公开(公告)号：DE102005046404B4

公开(公告)日：2008-12-24

申请号：DE102005046404

申请日：2005-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BORGHOFF GEORG ,  NUEBEL THOMAS ,  SPANKE REINHOLD ,  WOELZ MARTIN

IPC: H01L21/48 ,  B21B1/38 ,  H01L23/12 ,  H01L23/36 ,  H01L25/07

Abstract: The method involves rolling the metal base plates (4) in a preferential direction such as its longitudinal direction. The base plates can be made from copper or aluminium. Independent claim describes semi conductor module with semi conductor component (2) mounted on a base plate (4) which is rolled in its longitudinal direction.

公开(公告)号：DE102004042367B4

公开(公告)日：2008-07-10

申请号：DE102004042367

申请日：2004-09-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： NUEBEL THOMAS ,  SCHILLING OLIVER ,  SPANKE REINHOLD

IPC: H01L25/07 ,  H01L23/12 ,  H01L23/36

Abstract: The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates (2, 3, 4, 5, 6, 7) are placed on the base plate (11) while being arranged in a single row (12), and pressing devices (15, 16), which are situated close to the substrate, are provided on both longitudinal sides (11a, 11b) of the base plate (11) while being arranged parallel to the row (12). The base plate can be pressed against a cooling surface by the pressing devices.

公开(公告)号：DE102005046404A1

公开(公告)日：2007-04-05

申请号：DE102005046404

申请日：2005-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BORGHOFF GEORG ,  NUEBEL THOMAS ,  SPANKE REINHOLD ,  WOELZ MARTIN

IPC: H01L21/48 ,  B21B1/38 ,  H01L23/12 ,  H01L25/07

Abstract: The method involves rolling the metal base plates (4) in a preferential direction such as its longitudinal direction. The base plates can be made from copper or aluminium. Independent claim describes semi conductor module with semi conductor component (2) mounted on a base plate (4) which is rolled in its longitudinal direction.