公开(公告)号：DE102005046404B4

公开(公告)日：2008-12-24

申请号：DE102005046404

申请日：2005-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BORGHOFF GEORG ,  NUEBEL THOMAS ,  SPANKE REINHOLD ,  WOELZ MARTIN

IPC: H01L21/48 ,  B21B1/38 ,  H01L23/12 ,  H01L23/36 ,  H01L25/07

Abstract: The method involves rolling the metal base plates (4) in a preferential direction such as its longitudinal direction. The base plates can be made from copper or aluminium. Independent claim describes semi conductor module with semi conductor component (2) mounted on a base plate (4) which is rolled in its longitudinal direction.

公开(公告)号：DE102006034599A1

公开(公告)日：2008-01-31

申请号：DE102006034599

申请日：2006-07-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIS BENNO ,  PETERS DETHARD ,  WOELZ MARTIN

IPC: H01L21/77 ,  H01L21/60

Abstract: The method involves preparing a wafer (10), which is rotated around a rotation axis (R) during manufacturing or processing and has many unscattered semiconductor chips and successively arranging many grouping zones (21 to 24) in radial direction to which each section of the wafer is assigned. Each semiconductor chip of the wafer is partly assigned in the grouping areas, where two semiconductor chips, which are assigned to grouping zones, are connected. An independent claim is also included for a method for interconnecting semiconductor chips, which are manufactured on a common wafer.

公开(公告)号：DE102005046404A1

公开(公告)日：2007-04-05

申请号：DE102005046404

申请日：2005-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BORGHOFF GEORG ,  NUEBEL THOMAS ,  SPANKE REINHOLD ,  WOELZ MARTIN

IPC: H01L21/48 ,  B21B1/38 ,  H01L23/12 ,  H01L25/07

Abstract: The method involves rolling the metal base plates (4) in a preferential direction such as its longitudinal direction. The base plates can be made from copper or aluminium. Independent claim describes semi conductor module with semi conductor component (2) mounted on a base plate (4) which is rolled in its longitudinal direction.

公开(公告)号：DE102006034599B4

公开(公告)日：2010-01-21

申请号：DE102006034599

申请日：2006-07-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEIS BENNO ,  PETERS DETHARD ,  WOELZ MARTIN

IPC: H01L21/77 ,  H01L21/60 ,  H01L23/544

Abstract: The method involves preparing a wafer (10), which is rotated around a rotation axis (R) during manufacturing or processing and has many unscattered semiconductor chips and successively arranging many grouping zones (21 to 24) in radial direction to which each section of the wafer is assigned. Each semiconductor chip of the wafer is partly assigned in the grouping areas, where two semiconductor chips, which are assigned to grouping zones, are connected. An independent claim is also included for a method for interconnecting semiconductor chips, which are manufactured on a common wafer.

公开(公告)号：DE102006004031B3

公开(公告)日：2007-03-08

申请号：DE102006004031

申请日：2006-01-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHILLING OLIVER ,  WOELZ MARTIN

IPC: H01L25/07 ,  H01L23/498 ,  H02M1/00

Abstract: At least four substrates (41-44) are arranged in a row on a carrier board (40). Components (414,415) on each individual substrate are connected to form an electrical half-bridge. For each individual substrate, the sequence of connection points for the low and high potentials corresponds exactly to a sequence of external connection terminals (10,20) on two bus rails (1,2) in the direction of the row of substrates.