公开(公告)号：JP2001250873A

公开(公告)日：2001-09-14

申请号：JP2001016198

申请日：2001-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FENK JOSEF ,  PETTER FRANZ

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/32 ,  H01L23/552 ,  H01L25/04 ,  H05K9/00

Abstract: PROBLEM TO BE SOLVED: To provide a protection device and an element for electromagnetically protecting a semiconductor chip in such a form that the elements are electromag netically protected at a minimum cost. SOLUTION: The protecting device has a coating member 16 surrounding at least partly a semiconductor chip.

公开(公告)号：DE10148042B4

公开(公告)日：2006-11-09

申请号：DE10148042

申请日：2001-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DAECHE FRANK ,  PETTER FRANZ

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/057 ,  H01L23/31 ,  H01L23/495

Abstract: An electronic device comprises a plastic housing (2), height-structured metallic components (3) of a leadframe, and two line structures having a first line structure (9) with height-structured interconnects (11), and a second line structure (10) having bonding connections disposed within the plastic housing. An electronic device comprises: (i) a plastic housing having an underside; (ii) height-structured metallic components of a leadframe, and including contact islands (7) and chip islands in a matrix form on the underside of the plastic housing; and (iii) two line structures having a first line structure with height-structured interconnects disposed on the underside of the plastic housing with height-structured interconnects are further components of the height-structured metallic leadframe. The two line structures containing a second line structure having bonding connections disposed within the plastic housing. An Independent claim is also included for a method for producing an electronic device comprising: (a) providing a metallic carrier material comprising metal plate and a metal strip; (b) applying a mask on a top side of the metallic carrier material; (c) applying an etching stop layer to the uncovered areas of the metallic carrier material; (d) applying a height-structured layer to the etching stop layer in the uncovered areas of the metallic carrier material; and (e) removing the mask; (f) applying a bondable coating (25) to the contact islands; (g) applying a solderable coating and a conductive adhesive to the chip islands; (h) applying circuit elements to the chip islands; (i) producing bonding connections and line bridges between electrodes of the circuit elements and the contact islands and between the contact islands; (j) embedding the height-structured components, the circuit elements, an the bonding connections is a plastic molding compound (29) resulting in a one-sided packaging; (k) removing part of the height-structured leadframe at least as fast as the etching stop layer; (l) applying a structured insulating layer on an underside of the height-structured leadframe for covering undersides at least of the interconnects; and (m) separating the height-structured leadframe with the plastic molding compound into individual electronic devices.

公开(公告)号：DE10148042A1

公开(公告)日：2003-04-30

申请号：DE10148042

申请日：2001-09-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DAECHE FRANK ,  PETTER FRANZ

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/057 ,  H01L21/60

Abstract: An electronic device comprises a plastic housing (2), height-structured metallic components (3) of a leadframe, and two line structures having a first line structure (9) with height-structured interconnects (11), and a second line structure (10) having bonding connections disposed within the plastic housing. An electronic device comprises: (i) a plastic housing having an underside; (ii) height-structured metallic components of a leadframe, and including contact islands (7) and chip islands in a matrix form on the underside of the plastic housing; and (iii) two line structures having a first line structure with height-structured interconnects disposed on the underside of the plastic housing with height-structured interconnects are further components of the height-structured metallic leadframe. The two line structures containing a second line structure having bonding connections disposed within the plastic housing. An Independent claim is also included for a method for producing an electronic device comprising: (a) providing a metallic carrier material comprising metal plate and a metal strip; (b) applying a mask on a top side of the metallic carrier material; (c) applying an etching stop layer to the uncovered areas of the metallic carrier material; (d) applying a height-structured layer to the etching stop layer in the uncovered areas of the metallic carrier material; and (e) removing the mask; (f) applying a bondable coating (25) to the contact islands; (g) applying a solderable coating and a conductive adhesive to the chip islands; (h) applying circuit elements to the chip islands; (i) producing bonding connections and line bridges between electrodes of the circuit elements and the contact islands and between the contact islands; (j) embedding the height-structured components, the circuit elements, an the bonding connections is a plastic molding compound (29) resulting in a one-sided packaging; (k) removing part of the height-structured leadframe at least as fast as the etching stop layer; (l) applying a structured insulating layer on an underside of the height-structured leadframe for covering undersides at least of the interconnects; and (m) separating the height-structured leadframe with the plastic molding compound into individual electronic devices.

公开(公告)号：DE10002852A1

公开(公告)日：2001-08-02

申请号：DE10002852

申请日：2000-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FENK JOSEF ,  PETTER FRANZ

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/32 ,  H01L23/552 ,  H01L25/04 ,  H05K9/00 ,  H01L23/28 ,  H01L23/12 ,  H01L25/065

公开(公告)号：DE19639181B4

公开(公告)日：2006-08-17

申请号：DE19639181

申请日：1996-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAPE HEINZ ,  PETTER FRANZ

IPC: H01L23/50 ,  H01L23/36 ,  H01L23/495

公开(公告)号：DE10005296A1

公开(公告)日：2001-08-16

申请号：DE10005296

申请日：2000-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEIMGAERTNER RUDOLF ,  PETTER FRANZ

IPC: H01L51/52 ,  H01L51/10 ,  H01L51/20 ,  H05B33/04

Abstract: The invention relates to a device for emitting electromagnetic radiation that comprises the following elements: a substrate, at least one active layer of a radiation-emitting organic material, a lid, and a seal between the substrate and the lid so that an interior space between the substrate and the lid is closed off in a gas-tight manner. The inventive device is further characterized in that the seal protects the active layer from humidity from the ambient air. The inventive device has therefore a high service life. All advantages implied by the use of organic, light-emitting diodes can be used in a simple and cost-effective manner.