公开(公告)号：DE10347320A1

公开(公告)日：2005-05-19

申请号：DE10347320

申请日：2003-10-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BLASZCZAK STEPHAN ,  SCHEIBE BERND ,  BENDER CARSTEN ,  NOCKE KERSTIN

IPC: H01L23/00 ,  H01L23/13 ,  H01L23/12 ,  H01L23/50

Abstract: A tape (2) glues a chip (3) face down on a substrate (1) with a passage way, a bonding channel (4) and a structured metal coating (5) on an underside, which has grid-type contact pads (6) and bonding pads (7) near the edge of the bonding channel to interlink these electrically. An independent claim is also included for a structure for a chip package to be constructed on a substrate with a chip mounted face down on the substrate and with protection to its rear side and edges by means of a sealing compound firmly bonded to the substrate.

公开(公告)号：DE10347622A1

公开(公告)日：2005-05-25

申请号：DE10347622

申请日：2003-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BLASZCZAK STEPHAN ,  SCHEIBE BERND

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/50

Abstract: The substrate (1) has a solder pad (3) on the substrate surface with an upper side (7), an underside (16) opposite the upper side on which the solder pad is joined to the substrate and bounding surfaces between the upper side and the underside, whereby the upper side forms an electrical contact surface (8) that can be soldered using a solder ball of the second substrate or the chip. The solder pad has solderable adhesive surfaces (6) in addition to the electrical contact surface.

公开(公告)号：DE10347621A1

公开(公告)日：2005-05-25

申请号：DE10347621

申请日：2003-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  SCHEIBE BERND ,  BLASZCZAK STEPHAN

IPC: H01L23/31 ,  H01L29/06 ,  H01L23/28 ,  H01L23/50

Abstract: A substrate-based package for integrated circuits includes a substrate on which at least one chip is attached by a die-attach material. The substrate has, on the side that is opposite from the chip, conductor tracks that are provided with solder balls and are connected to the chip by means of wire bridges that extend through a bonding channel, which is sealed by an encapsulating compound. The chip and parts of the substrate on the chip side are covered by a mold cap. The backside of the chip is provided at least partially with regions with a distinctly enlarged surface as a result of greater roughness by etching or mechanical working. The regions of greater roughness have a predetermined depth on the backside of the chip and also are able to be configured as crossing tracks.

公开(公告)号：DE102005051036A1

公开(公告)日：2007-04-26

申请号：DE102005051036

申请日：2005-10-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BLASZCZAK STEPHAN ,  SCHEIBE BERND ,  MUELLER SEBASTIAN ,  NOCKE KERSTIN

IPC: H01L21/50 ,  H01L23/12 ,  H01L23/28

Abstract: A method for fabricating an integrated module involves preparing a supporting substrate (2), especially with a chip mounted thereon, making available a holding structure in or on the substrate (2) and providing a housing material to form a housing (5) so that the housing material functions together with the holding structure in the substrate, to take up a lateral tensioning between the housing (5) and the substrate (2). An independent claim is included for (1) (A) A module or building block with support substrate and (2) (B) A module- substrate with several inter-joined substrates.

公开(公告)号：DE10347622B4

公开(公告)日：2006-09-07

申请号：DE10347622

申请日：2003-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  BLASZCZAK STEPHAN ,  SCHEIBE BERND

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

Abstract: The substrate (1) has a solder pad (3) on the substrate surface with an upper side (7), an underside (16) opposite the upper side on which the solder pad is joined to the substrate and bounding surfaces between the upper side and the underside, whereby the upper side forms an electrical contact surface (8) that can be soldered using a solder ball of the second substrate or the chip. The solder pad has solderable adhesive surfaces (6) in addition to the electrical contact surface.