公开(公告)号：DE102006043133B4

公开(公告)日：2009-09-24

申请号：DE102006043133

申请日：2006-09-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KRUMBEIN ULRICH ,  GNANNT KLAUS ,  SCHELAUSKE PATRICK ,  AHRENS CARSTEN ,  SEIDEMANN GEORG ,  MACKH GUNTHER ,  ALBERS SVEN ,  SCHUDERER BERTHOLD

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/485

Abstract: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.

公开(公告)号：DE102006043133A1

公开(公告)日：2008-03-27

申请号：DE102006043133

申请日：2006-09-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KRUMBEIN ULRICH ,  GNANNT KLAUS ,  SCHELAUSKE PATRICK ,  AHRENS CARSTEN ,  SEIDEMANN GEORG ,  MACKH GUNTHER ,  ALBERS SVEN ,  SCHUDERER BERTHOLD

IPC: H01L23/50 ,  H01L23/485

Abstract: A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.