公开(公告)号：WO9966337A3

公开(公告)日：2002-09-26

申请号：PCT/DE9901719

申请日：1999-06-11

Applicant: INFINEON TECHNOLOGIES AG ,  SCHMID WILHELM ,  DOERRHOEFER CARSTEN

Inventor： SCHMID WILHELM ,  DOERRHOEFER CARSTEN

IPC: G01R31/28 ,  G01R31/317 ,  G01R31/3185 ,  G01R31/319 ,  H01L21/66 ,  H01L21/822 ,  H01L27/04 ,  G01R31/316

CPC classification number: G01R31/31708 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/31723 ,  G01R31/318505 ,  G01R31/318572 ,  G01R31/31926

Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), (2, 3) are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7, 8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.

Abstract translation: 根据本发明，所述集成电路模块（芯片）（1）一个或多个外部测试连接接触点（垫;销;球），（2，3），其将被测量或待分析的信号（4，5，6） 各自选择性例如 通过多重电路的装置（7,8）经由内部块的传导路径切换通过从立即不可访问电路点，例如 是涵道芯片位置（15到20）或覆盖接触点。 根据本发明的装置特别适用于高集成度的半导体芯片。

公开(公告)号：DE19945434A1

公开(公告)日：2001-04-05

申请号：DE19945434

申请日：1999-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHMITT-LANDSIEDEL DORIS ,  SCHOEBINGER MATTHIAS ,  TIHANYI JENOE ,  WURZER HELMUT ,  PLATZOEDER MICHAEL ,  SCHMID WILHELM

IPC: H01L23/34 ,  H01L23/38 ,  H01L25/065 ,  H05K7/20

Abstract: The invention relates to a device for cooling an integrated circuit of an electronic, preferably mobile, appliance. The device for cooling is provided with a cooling element. The integrated circuit is provided with areas, wherein the power is consumed in different manners. The inventive device is characterised in that said device is provided with at least two cooling element for selectively cooling a partial surface of the integrated circuit respectively. The temperature of heavily used or speed-determining areas of a circuit is thus specifically influenced. Different cooling elements can be controlled according to the temperature to be maintained or the current computing power of the area to be cooled respectively.

公开(公告)号：DE59915081D1

公开(公告)日：2009-10-22

申请号：DE59915081

申请日：1999-06-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHMID WILHELM ,  DOERRHOEFER CARSTEN

IPC: G01R31/317 ,  G01R31/28 ,  G01R31/316 ,  G01R31/3185 ,  G01R31/319 ,  H01L21/66 ,  H01L21/822 ,  H01L27/04

公开(公告)号：DE59915088D1

公开(公告)日：2009-11-05

申请号：DE59915088

申请日：1999-06-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHMID WILHELM ,  DOERRHOEFER CARSTEN

IPC: G01R31/317 ,  G01R31/28 ,  G01R31/316 ,  G01R31/3185 ,  G01R31/319 ,  H01L21/66 ,  H01L21/822 ,  H01L27/04

公开(公告)号：DE59913490D1

公开(公告)日：2006-07-06

申请号：DE59913490

申请日：1999-06-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHMID WILHELM ,  DOERRHOEFER CARSTEN

IPC: G01R31/317 ,  G01R31/28 ,  G01R31/3185 ,  G01R31/319 ,  H01L21/66 ,  H01L21/822 ,  H01L27/04