公开(公告)号：DE10047147A1

公开(公告)日：2002-04-25

申请号：DE10047147

申请日：2000-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYHOEFER GERD ,  SCHOBER MARTIN

IPC: G11C5/06 ,  H01L23/50 ,  H01L23/58

Abstract: With the help of mechanisms (25,26) to select a pilot pin position, outer connector pins (24) for integrated semiconductor circuits can be each assigned two different signals (A0,A12). Each assignment can be selected in a fixed or variable manner by an external signal (27). The mechanisms for selecting pilot pin positions have electronic fuses to select each assignment by firing or not firing a fuse.

公开(公告)号：DE10047147B4

公开(公告)日：2005-04-07

申请号：DE10047147

申请日：2000-09-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYHOEFER GERD ,  SCHOBER MARTIN

IPC: G11C5/06 ,  H01L23/50 ,  H01L23/525

公开(公告)号：DE10131939A1

公开(公告)日：2003-02-06

申请号：DE10131939

申请日：2001-07-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHOBER MARTIN ,  BENISEK MARTIN

IPC: G11C5/00 ,  H05K1/18

Abstract: An electronic printed circuit board has a memory module and a contact strip for insertion into another electronic unit. The memory module has at least nine identically designed housing-encapsulated integrated semiconductor memories configured on the printed circuit board. The longer dimension of the housing of one of the semiconductor memories, which is connected as an error correction chip, is oriented perpendicular to the contact strip. The longer dimension of the housings of the other semiconductor memories are oriented parallel to the contact strip. The different orientation of the semiconductor memories makes it possible to reduce the height of the printed circuit board while enabling the rectangular housings to keep the same physical form.

公开(公告)号：DE10339890A1

公开(公告)日：2005-03-31

申请号：DE10339890

申请日：2003-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： NEUGEBAUER SOEREN ,  SCHOBER MARTIN ,  SCHUSTER JOSEF

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L23/50 ,  H01L21/66

Abstract: A second connection surface (5) is located above the uppermost surface of the packaged semiconductor (1), which faces away from the circuit board (2). The surface (5) is separated from the semiconductor by insulant (6, 7). The surface (5) has electrical connections with the first connection- (ball grid array-) surface (3) below.

公开(公告)号：DE10122701A1

公开(公告)日：2002-11-21

申请号：DE10122701

申请日：2001-05-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHOBER MARTIN ,  BENISEK MARTIN ,  HOPPE WOLFGANG

IPC: G11C5/04 ,  H05K1/02 ,  H05K1/18

Abstract: A circuit module comprises a circuit board having a plurality of contact elements along a longitudinal edge thereof. The circuit board has arranged thereon a SDRAM memory component, the connections of this SDRAM memory component being each connected via resistance elements, which are implemented as individual resistors, to one of the contact elements through lines of limited length. The individual resistors are arranged in a line which extends parallel to the longitudinal direction of the circuit board.