中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.025 seconds)

    Method for machining a workpiece on a workpiece support
    2.
    发明申请
    Method for machining a workpiece on a workpiece support 审中-公开
    一种用于编辑工件一种用于在工件上加工工件的方法spport工件载

    公开(公告)号：WO2005101459B1

    公开(公告)日：2006-06-29

    申请号：PCT/EP2005051493

    申请日：2005-04-01

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： BRADL STEPHAN ,  GROMMES WALTHER ,  KROENINGER WERNER ,  MELZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

    IPC: H01L21/68

    CPC classification number: H01L21/6836 ,  H01L2221/68327 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141 ,  Y10S438/977 ,  Y10T29/49998

    Abstract: Disclosed is, among other things, a method in which a workpiece (14) is fastened to a workpiece support (12) with the aid of connecting means (18, 20), the workpiece (14) and the workpiece support (12) being joined together using an annular connecting means (18, 20). The resulting compound is machined, whereupon the machined workpiece (14) is separated from the workpiece support (12), making it possible to create a particularly simple machining process.

    Abstract translation: 通过连接装置（18，20），来描述，除其他外，一种方法，其中，固定在工件支承件（12）的工件（14），其中，所述工件（14），并通过一个环形连接装置在工件支架（12）（18 ，20）连接在一起。 将得到的复合物（10）进行处理。 然后，从工件支架（12）加工工件（14）断开。 其结果是一种特别简单的加工方法。

    3.
    发明专利
    未知

    公开(公告)号：DE502004003186D1

    公开(公告)日：2007-04-19

    申请号：DE502004003186

    申请日：2004-09-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： BRADL STEPHAN ,  METZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

    IPC: H01L21/68 ,  H01L21/00 ,  H01L21/673

    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

    4.
    发明专利
    未知

    公开(公告)号：DE112004002684A5

    公开(公告)日：2007-05-03

    申请号：DE112004002684

    申请日：2004-09-29

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： BRADL STEPHAN ,  METZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

    IPC: H01L21/68 ,  H01L21/00 ,  H01L21/673

    Abstract: The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Patent Agency Ranking