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公开(公告)号:DE102004028572A1
公开(公告)日:2006-01-12
申请号:DE102004028572
申请日:2004-06-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor: LUHMANN CLAUDIA , GRUMM MATHIAS , BRINTZINGER AXEL , STROGIES JOERG , STADT MICHAEL , WALLIS DAVID
IPC: H01L23/50
Abstract: The device has a set of conducting paths connecting bond-pads with respective contact surfaces on a round end of a bump. The paths are arranged in two electrically connected sections (5, 8), where the section (5) runs in a plane starting from the bond-pads and the section (8) runs in another plane arranged over the former plane. The planes are electrically insulated form each other, where the lengths of the sections are same.