公开(公告)号：DE102004050177A1

公开(公告)日：2006-04-20

申请号：DE102004050177

申请日：2004-10-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER TORSTEN ,  LUHMANN CLAUDIA ,  WOLLANKE ALEXANDER

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/60

Abstract: Wiring system for electronic component consists of conductive tracks on component surface (5), containing at least one interface (4), in its plane, between different materials. One conductive track (6) surmounts continuously interface. In junction region (8) on interface, which extends over both adjacent materials, conductive track is mechanically decoupled from surface of component. Preferably, width of junction region is rated according to temperature region, to which component will be exposed, as well as to difference of linear expansion coefficients of interface materials. Independent claims are included for method for forming wiring system.

公开(公告)号：DE102004028572A1

公开(公告)日：2006-01-12

申请号：DE102004028572

申请日：2004-06-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LUHMANN CLAUDIA ,  GRUMM MATHIAS ,  BRINTZINGER AXEL ,  STROGIES JOERG ,  STADT MICHAEL ,  WALLIS DAVID

IPC: H01L23/50

Abstract: The device has a set of conducting paths connecting bond-pads with respective contact surfaces on a round end of a bump. The paths are arranged in two electrically connected sections (5, 8), where the section (5) runs in a plane starting from the bond-pads and the section (8) runs in another plane arranged over the former plane. The planes are electrically insulated form each other, where the lengths of the sections are same.