公开(公告)号：DE10324069B4

公开(公告)日：2005-06-23

申请号：DE10324069

申请日：2003-05-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHLOEGEL XAVER ,  OTREMBA RALF ,  MAERZ JOSEF ,  DORAISAMY STANLEY JOB ,  TAN PING-LING

IPC: H01L23/495 ,  H01L23/49

公开(公告)号：DE10324069A1

公开(公告)日：2004-12-23

申请号：DE10324069

申请日：2003-05-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHLOEGEL XAVER ,  OTREMBA RALF ,  MAERZ JOSEF ,  DORAISAMY STANLEY JOB ,  TAN PING-LING

IPC: H01L23/495 ,  H01L23/49

Abstract: A circuit to conductively bond contact spots (11) on the front of a semiconductor chip (10) to mounting connections (12) or to contact spots on other chips comprises at least two bond wires (1,2) one under the other on a contact spot with one wire being straight and the other bent and leading to the same mounting connection or contact spot. An independent claim is also included for a connection process for the above.