Abstract:
PROBLEM TO BE SOLVED: To provide a method and system which can obtain a method and apparatus setting wafer chips with a single power on and off sequence, and further adjust a chip parameter during a wafer test without utilizing the sequence. SOLUTION: The method comprises the steps of: assigning a specific identifier to a controllable chip resistor by a program of each wafer chip for test (step 52); storing a value of the parameter fixed by corresponding to each of them inside the chip resistor of the chip selected based on its identifier (step 54); and performing a test evaluating a setting of the parameter for each chip with a desired parameter set simultaneously (step 56). COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
A method and apparatus according to the present invention enable wafer chips to be configured with a single power on and off sequence and further enable a chip parameter to be adjusted during a wafer test without utilizing that sequence. In particular, each wafer chip under test is assigned a unique programmable identification. Once each chip has been assigned a corresponding identification, the chips may each be individually accessible by that identification to provide parameter values to chip registers to configure that chip. The configured chips may be subsequently tested in parallel to evaluate the parameter settings. In addition, the present invention enables chips to share data I/O pins or lines, thereby reducing the quantity of testing machine pins utilized for each chip and enabling a greater quantity of chips to be tested in a parallel fashion.