公开(公告)号：DE10207817A1

公开(公告)日：2003-05-28

申请号：DE10207817

申请日：2002-02-25

Applicant: INFINEON TECHNOLOGIES CORP

Inventor： GENZ OLIVER ,  PREUNINGER JUERGEN ,  KUNKEL GERHARD

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/8242

Abstract: An apparatus (100) for patterning the surface of a semiconductor wafer (130). A stage (148) is coupled to a motor (150) that is adapted to move the stage (148) and a semiconductor wafer (130) in a horizontal direction at a first speed A. A mask (140) is disposed above the semiconductor wafer (130), the mask (140) being coupled to a motor (142) that is adapted to move the mask (140) in a horizontal direction at a second speed B. The ratio of the first and second speeds is different than the magnification factor, which may be other than 1:1 if a lens (120) is used. The mask (140) and the wafer (130) may be moved in the same horizontal direction simultaneously during the exposure process at different speeds B and A, respectively, to provide a magnification or demagnification of the mask (140) pattern onto the wafer (130) surface.