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    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-SHOCK ISOLATION
    2.
    发明专利
    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-SHOCK ISOLATION 未知

    公开(公告)号：CA2448260A1

    公开(公告)日：2002-12-05

    申请号：CA2448260

    申请日：2002-05-28

    Applicant: INPUT OUTPUT INC

    Inventor： DEKKERS LEO M ,  GANNON JEFFREY C ,  CORRIGAN MICHAEL A

    IPC: G01V1/16 ,  G01V1/00

    Abstract: A sensor module (110) includes a module case (112) coupled to a module cap (114). The module cap (114) provides an access into the module case (112) fo r one or more electrical conductors of a telemetry cable. Housed in the module case (112) and module cap (114) is a sensor electronics package (116), the module case (112) is constructed with a wall thickness that allows for wall flexure to provide damping of high-g shock input. The outer surface (126) ma y include a longitudinal ridge (128). The longitudinal ridge (128) provides a key-type fit to prevent inadvertent rotation after the sensor module (110) i s inserted into the ground. Disposed between the module tip (120) and the sens or electronics package (116) is an isolator (115) for isolating the sensor electronics package from damaging mechanical shock axially induced in the sensor module (110). The isolator (115) may comprise one or more layers (115 a) and (115b) of vibration-isolating material. A first isolating layer 115a adjoins the electronic package 116 and a second isolating layer (115b). The second isolating layer (115b) adjoins the first isolating layer (115a) and t he module tip (120). The first isolating layer (115a) is manufactured from a material such as silicone, and the second iasolating layer (115b) is manufactured from a material such as high-damping polyurethane foam. A secon d, and similary constructed isolator (130) is disposed between the sensor electronics package (116) and the module cap (114). The sensor module (110) includes one or more MEMS accelerometers in an electronic package (116).

    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-G SHOCK ISOLATION
    3.
    发明专利
    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-G SHOCK ISOLATION 未知

    公开(公告)号：CA2448260C

    公开(公告)日：2013-03-26

    申请号：CA2448260

    申请日：2002-05-28

    Applicant: INPUT OUTPUT INC

    Inventor： CORRIGAN MICHAEL A ,  GANNON JEFFREY C ,  DEKKERS LEO M

    IPC: G01V1/00 ,  G01V1/16

    Abstract: A sensor module (110) includes a module case (112) coupled to a module cap (114). The module cap (114) provides an access into the module case (112) for one or more electrical conductors of a telemetry cable. Housed in the module case (112) and module cap (114) is a sensor electronics package (116), the module case (112) is constructed with a wall thickness that allows for wall flexure to provide damping of high-g shock input. The outer surface (126) may include a longitudinal ridge (128). The longitudinal ridge (128) provides a key-type fit to prevent inadvertent rotation after the sensor module (110) is inserted into the ground. Disposed between the module tip (120) and the sensor electronics package (116) is an isolator (115) for isolating the sensor electronics package from damaging mechanical shock axially induced in the sensor module (110). The isolator (115) may comprise one or more layers (115a) and (115b) of vibration-isolating material. A first isolating layer 115a adjoins the electronic package 116 and a second isolating layer (115b). The second isolating layer (115b) adjoins the first isolating layer (115a) and the module tip (120). The first isolating layer (115a) is manufactured from a material such as silicone, and the second iasolating layer (115b) is manufactured from a material such as high-damping polyurethane foam. A second, and similary constructed isolator (130) is disposed between the sensor electronics package (116) and the module cap (114). The sensor module (110) includes one or more MEMS accelerometers in an electronic package (116).

    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-G SHOCK ISOLATION
    6.
    发明公开
    SEISMIC SENSING APPARATUS AND METHOD WITH HIGH-G SHOCK ISOLATION 有权
    地震测量装置和方法具有高抗冲击隔离

    公开(公告)号：EP1390776A4

    公开(公告)日：2007-03-21

    申请号：EP02731923

    申请日：2002-05-28

    Applicant: INPUT OUTPUT INC

    Inventor： CORRIGAN MICHAEL A ,  GANNON JEFFREY C ,  DEKKERS LEO M

    IPC: G01V1/16 ,  G01V1/00

    CPC classification number: G01V1/16 ,  Y10S181/401

    Abstract: A sensor module (110) includes a module case (112) coupled to a module cap (114). The module cap (114) provides an access into the module case (112) for one or more electrical conductors of a telemetry cable. Housed in the module case (112) and module cap (114) is a sensor electronics package (116), the module case (112) is constructed with a wall thickness that allows for wall flexure to provide damping of high-g shock input. The outer surface (126) may include a longitudinal ridge (128). The longitudinal ridge (128) provides a key-type fit to prevent inadvertent rotation after the sensor module (110) is inserted into the ground. Disposed between the module tip (120) and the sensor electronics package (116) is an isolator (115) for isolating the sensor electronics package from damaging mechanical shock axially induced in the sensor module (110). The isolator (115) may comprise one or more layers (115a) and (115b) of vibration-isolating material. A first isolating layer 115a adjoins the electronic package 116 and a second isolating layer (115b). The second isolating layer (115b) adjoins the first isolating layer (115a) and the module tip (120). The first isolating layer (115a) is manufactured from a material such as silicone, and the second iasolating layer (115b) is manufactured from a material such as high-damping polyurethane foam. A second, and similary constructed isolator (130) is disposed between the sensor electronics package (116) and the module cap (114). The sensor module (110) includes one or more MEMS accelerometers in an electronic package (116).

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