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    SYSTEMS, METHODS, AND APPARATUSES FOR HYBRID MEMORY
    1.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR HYBRID MEMORY 审中-公开
    混合存储器的系统，方法和装置

    公开(公告)号：WO2011081846A2

    公开(公告)日：2011-07-07

    申请号：PCT/US2010059853

    申请日：2010-12-10

    Applicant: INTEL CORP ,  DUNNING DAVE ,  CASPER BRYAN ,  MOONEY RANDY ,  MANSURI MOZHGAN ,  JAUSSI JAMES E

    Inventor： DUNNING DAVE ,  CASPER BRYAN ,  MOONEY RANDY ,  MANSURI MOZHGAN ,  JAUSSI JAMES E

    IPC: G11C5/02

    CPC classification number: G06F11/1076 ,  G11C5/02 ,  G11C29/12 ,  H01L2224/16145 ,  H03M13/15 ,  H03M13/152

    Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.

    Abstract translation: 本发明的实施例一般涉及用于混合存储器的系统，方法和装置。 在一个实施例中，混合存储器可以包括封装衬底。 混合存储器还可以包括附接到封装衬底的第一侧的混合存储器缓冲芯片。 高速输入/输出（HSIO）逻辑支持与处理器的HSIO接口。 混合存储器还包括在HSIO接口上支持分组处理协议的分组处理逻辑。 此外，混合存储器还具有垂直堆叠在混合存储器缓冲器上的一个或多个存储器片。

    SYSTEMS, METHODS, AND APPARATUSES FOR HYBRID MEMORY
    3.
    发明公开
    SYSTEMS, METHODS, AND APPARATUSES FOR HYBRID MEMORY 有权
    系统，方法和设备混合存储器

    公开(公告)号：EP2519948A4

    公开(公告)日：2014-01-08

    申请号：EP10841482

    申请日：2010-12-10

    Applicant: INTEL CORP

    Inventor： DUNNING DAVE ,  CASPER BRYAN ,  MOONEY RANDY ,  MANSURI MOZHGAN ,  JAUSSI JAMES E

    IPC: G11C5/02

    CPC classification number: G06F11/1076 ,  G11C5/02 ,  G11C29/12 ,  H01L2224/16145 ,  H03M13/15 ,  H03M13/152

    Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.

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