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公开(公告)号：SG11201610371TA
公开(公告)日：2017-01-27
申请号：SG11201610371T
申请日：2014-07-11
Applicant: INTEL CORP
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公开(公告)号：EP3172048A4
公开(公告)日：2018-04-18
申请号：EP14873107
申请日：2014-07-11
Applicant: INTEL CORP
Inventor： LEVANDER ALEJANDRO , ANDRYUSHCHENKO TATYANA , STAINES DAVID , KOBRINSKY MAURO , ALEKSOV ALEKSANDAR , SENEVIRATNE DILAN , SOTO GONZALEZ JAVIER , PIETAMBARAM SRINIVAS , ISLAM RAFIQUL
CPC classification number: H01L23/4985 , B23B5/16 , B32B27/08 , B32B27/283 , B32B2307/54 , B32B2307/7265 , B32B2439/00 , B32B2457/00 , H01L21/4846 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L23/3135 , H01L23/49811 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/48 , H01L24/85 , H01L24/96 , H01L25/50 , H01L2221/68345 , H01L2221/68381 , H01L2224/48227 , H01L2224/81192 , H01L2224/81203 , H01L2224/81815 , H01L2224/85801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01079 , H01L2924/0715 , H01L2924/15747 , H01L2924/15791 , H05K1/0283 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
Abstract: Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1) depositing a first elastomer material on a panel, (2) laminating trace material on the elastomer material, (3) processing the trace material to pattern the trace material into one or more traces and one or more bond pads, (4) attaching a die to the one or more bond pads, or (5) depositing a second elastomer material on and around the one or more traces, the bonds pads, and the die to encapsulate the one or more traces and the one or more bond pads in the first and second elastomer materials.
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