公开(公告)号：AT392126T

公开(公告)日：2008-04-15

申请号：AT03705923

申请日：2003-01-23

Applicant: INTEL CORP

Inventor： SATO DARYL ,  BRIST GARY ,  LONG GARY

IPC: H05K1/02 ,  H05K3/46

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

公开(公告)号：WO03067943A2

公开(公告)日：2003-08-14

申请号：PCT/US0302360

申请日：2003-01-23

Applicant: INTEL CORP

Inventor： SATO DARYL ,  BRIST GARY ,  LONG GARY

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K1/0265 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0221 ,  H05K3/005 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Abstract translation: 一种装置，其包括多个金属化平面，分离多个金属化平面的一个或多个电介质层和连接到多个金属化平面中的至少一个的一个或多个导电沟槽。

公开(公告)号：DE60320219T2

公开(公告)日：2009-05-14

申请号：DE60320219

申请日：2003-01-23

Applicant: INTEL CORP

Inventor： SATO DARYL ,  BRIST GARY ,  LONG GARY

IPC: H05K1/02 ,  H05K3/46

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

公开(公告)号：HK1076980A1

公开(公告)日：2006-01-27

申请号：HK05108904

申请日：2005-10-07

Applicant: INTEL CORP

Inventor： ALGER WILLIAM ,  LONG GARY ,  BRIST GARY ,  MEJIA CARLOS

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board.

公开(公告)号：DE60320219D1

公开(公告)日：2008-05-21

申请号：DE60320219

申请日：2003-01-23

Applicant: INTEL CORP

Inventor： SATO DARYL ,  BRIST GARY ,  LONG GARY

IPC: H05K1/02 ,  H05K3/46

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

公开(公告)号：GB2412500A

公开(公告)日：2005-09-28

申请号：GB0513566

申请日：2004-02-19

Applicant: INTEL CORP

Inventor： ALGER WILLIAM ,  LONG GARY ,  BRIST GARY ,  MEJIA CARLOS

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/14 ,  H05K3/36

Abstract: An apparatus and system, as well as fabrication methods therefor, comprising a carrier (110) located adjacent a first side (114) of a circuit board (120). The circuit board (120) has a contact field (130) defined therein by a circuit (140), which may be included in a package (142), and is located on a second side (144) of the circuit board (120). The circuit (140) includes one or more power supply contacts (148), which are located inside the inner perimeter (152) of the contact field (130), and one or more power supply terminals (156) located outside of the outer perimeter (160) of the contact field (130). One or more conductors (170) are attached to the carrier (110). The conductors (170) have a first terminal (172) coupled to one or more of the power supply contacts (148) and a second terminal (174) coupled to one or more of the power supply terminals (156).

公开(公告)号：AU2003272412A1

公开(公告)日：2004-04-08

申请号：AU2003272412

申请日：2003-09-12

Applicant: INTEL CORP

Inventor： BRIST GARY ,  LONG GARY ,  SATO DARYL

IPC: H01L21/268 ,  H01L21/48 ,  H05K3/06 ,  B23K26/34 ,  H01L23/498 ,  H01L21/24 ,  C23C8/78 ,  C25D5/02 ,  H01R13/03 ,  B23K26/00 ,  H05K3/02 ,  H05K3/10

Abstract: Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, CO 2 laser device, or other energy source.

公开(公告)号：DE112004000300B4

公开(公告)日：2011-09-08

申请号：DE112004000300

申请日：2004-02-19

Applicant: INTEL CORP

Inventor： ALGER WILLIAM ,  LONG GARY ,  BRIST GARY ,  MEJIA CARLOS

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36

Abstract: Vorrichtung, umfassend: einen Träger (110), der angrenzend an eine erste Seite (114) einer Leiterplatte (120) angeordnet ist, die ein Kontaktfeld (130) aufweist, das darin von einer Schaltung (140) der Leiterplatte (120) angeordnet ist, wobei das Kontaktfeld (130) einen äußeren Rand (160) und einen inneren Rand (152) aufweist, wobei die Schaltung (140) innerhalb des inneren Rands (152) des Kontaktfelds (130) einen Stromversorgungskontakt (148) aufweist, und wobei die Leiterplatte (120) außerhalb des äußeren Rands (160) des Kontaktfelds (130) einen Stromversorgungs-Anschlusspunkt (156) aufweist; und einen Leiter (170), der an dem Träger (110) befestigt ist, wobei der Leiter (170) einen ersten Anschlusspunkt (172) und einen zweiten Anschlusspunkt (174) aufweist, und wobei der erste Anschlusspunkt (172) durch einen ersten Stift (178) mit dem Stromversorgungskontakt (148) verbunden ist und der zweite Anschlusspunkt (174) durch einen zweiten Stift (178) mit dem Stromversorgungs-Anschlusspunkt (156) verbunden ist.

公开(公告)号：GB2412500B

公开(公告)日：2006-05-24

申请号：GB0513566

申请日：2004-02-19

Applicant: INTEL CORP

Inventor： ALGER WILLIAM ,  LONG GARY ,  BRIST GARY ,  MEJIA CARLOS

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board.

公开(公告)号：AU2003207694A8

公开(公告)日：2003-09-02

申请号：AU2003207694

申请日：2003-01-23

Applicant: INTEL CORP

Inventor： BRIST GARY ,  LONG GARY ,  SATO DARYL

IPC: H05K1/02 ,  H05K3/46

Abstract: An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.