公开(公告)号：SG10202004327QA

公开(公告)日：2021-01-28

申请号：SG10202004327Q

申请日：2020-05-11

Applicant: INTEL CORP

Inventor： MALLIK DEBENDRA ,  MAHAJAN RAVINDRANATH ,  SANKMAN ROBERT ,  LIFF SHAWNA ,  PIETAMBARAN SRINIVAS ,  PENMECHA BHARAT

Abstract: Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.