公开(公告)号：DE102020200933A1

公开(公告)日：2020-09-03

申请号：DE102020200933

申请日：2020-01-27

Applicant: INTEL CORP

Inventor： GRUNNET-JEPSEN ANDERS ,  TAKAGI AKIHIRO ,  SWEETSER JOHN N ,  WINER PAUL

IPC: H04N13/254

Abstract: Systeme, Vorrichtungen und Techniken bezüglich des Projizierens dynamischer Merkmalsmuster auf eine Szene zur Verwendung in stereoskopischer Bildgebung sind besprochen. Solche Techniken können Implementieren eines dynamischen transmittierenden Elements in einem optischen Pfad zwischen einem Projektor und der Szene beinhalten, um ein statisches Muster, das von dem Projektor emittiert wird, zu modifizieren, um die Szene mit einem dynamischen Muster zu beleuchten.

公开(公告)号：WO2013006487A2

公开(公告)日：2013-01-10

申请号：PCT/US2012045090

申请日：2012-06-29

Applicant: INTEL CORP ,  WINER PAUL

Inventor： WINER PAUL

CPC classification number: G02B27/2264 ,  G09G3/3406 ,  G09G2380/00 ,  H04N13/0438 ,  H04N13/0497

Abstract: In general, in one aspect, a three dimensional (3D) display includes an optical stack, a backlight, panel electronics and a backlight driver. The optical stack is to present left eye and right eye images. The backlight is to illuminate the optical stack so the left eye and right eye images are visible and to provide signals for synchronizing the image illuminated on the optical stack with shutter glasses worn by a user to enable a left eye to view the left eye images and a right eye to view the right eye images. The panel electronics are to generate the left eye and right eye images on the optical stack. The backlight driver is to control operation of the backlight.

Abstract translation: 通常，在一个方面，三维（3D）显示器包括光学叠堆，背光源，面板电子器件和背光驱动器。 光学堆叠将呈现左眼和右眼图像。 背光将照亮光学叠堆，使得左眼图像和右眼图像可见并且提供用于使照明在光学叠堆上的图像与用户佩戴的快门眼镜同步以使左眼能够观看左眼图像的信号以及 右眼观看右眼图像。 面板电子设备将在光学堆栈上生成左眼和右眼图像。 背光驱动器用于控制背光的操作。

公开(公告)号：WO2006066177A3

公开(公告)日：2006-10-26

申请号：PCT/US2005045871

申请日：2005-12-15

Applicant: INTEL CORP ,  WINER PAUL ,  STEINBACH ANDREW

Inventor： WINER PAUL ,  STEINBACH ANDREW

IPC: H04N5/74 ,  H04N9/31

CPC classification number: H04N9/3114 ,  H04N5/7416 ,  H04N9/315

Abstract: A technique includes pulse width modulating a beam of a light to establish a pixel intensity. The technique includes controlling a light source to modulate an illumination of the beam to create different tonal resolution ranges for the pixel intensity.

Abstract translation: 一种技术包括脉冲宽度调制光束以建立像素强度。 该技术包括控制光源以调制光束的照射以为像素强度创建不同的色调分辨率范围。

公开(公告)号：AU2002367904A8

公开(公告)日：2003-12-19

申请号：AU2002367904

申请日：2002-06-21

Applicant: INTEL CORP

Inventor： ROWLETTE JEREMY ,  WINER PAUL

IPC: B81B1/00 ,  B81C1/00

公开(公告)号：MY114590A

公开(公告)日：2002-11-30

申请号：MYPI19982128

申请日：1998-05-13

Applicant: INTEL CORP

Inventor： MA KARL J ,  PANICCIA MARIO J ,  WINER PAUL

IPC: G01R31/26 ,  H01L23/34 ,  H01L23/10 ,  H01L23/467 ,  H01L23/473

Abstract: A METHOD AND AN APPARATUS FOR COOLING A SEMICONDUCTOR DIE. IN ONE EMBODIMENT, A C4 PACKAGED SEMICONDUCTOR DIE (301) IS THERMALLY COUPLED TO A COOLING PLATE (313) HAVING AN OPENING (315). THE OPENING OF THE COOLING PLATE IS DISPOSED OVER A BACK SIDE SURFACE (311) OF THE SEMICONDUCTOR DIE (301) SUCH THAT DIRECT UNOBSTRUCTED ACCESS TO THE EXPOSED BACK SIDE SURFACE OF THE SEMICONDUCTOR DIE IS PROVIDED. A CONFORMABLE THERMAL CONDUCTOR, SUCH AS INDIUM (317), IS DISPOSED BETWEEN THE SEMICONDUCTOR DIE (301) AND THE COOLING PLATE (313) TO IMPROVE THE THERMAL COUPLING BETWEEN THE SEMICONDUCTOR AND COOLING PLATE. IN ONE EMBODIMENT, THE SEMICONDUCTOR DIE IS MOUNTED ON A CIRCUIT BOARD (307) AND A COOLING BLOCK (319) IS DISPOSED ON THE OPPOSITE SIDE OF THE CIRCUIT HOARD (307). THE COOLING PLATE (513) IS THERMALLY COUPLED TO THE COOLING BLOCK (519) WITH HEAT TRANSFER CONDUITS (523A & 523B), SUCH AS THERMAL SCREWS, THAT EXTEND THROUGH THE CIRCUIT BOARD (507) TO TRANSFER THE HEAT FROM THE SEMICONDUCTOR DIE (501) THROUGH THE COOLING PLATE THROUGH THE HEAT TRANSFER CONDUITS TO THE COOLING BLOCK LOCATED ON THE OPPOSITE SIDE OF THE CIRCUIT BOARD. IN ONE EMBODIMENT, COOLANT IS CIRCULATED THROUGH THE COOLING BLOCK TO REMOVE HEAT FROM THE COOLING BLOCK. (FIGURE 3)

公开(公告)号：AU2002367904A1

公开(公告)日：2003-12-19

申请号：AU2002367904

申请日：2002-06-21

Applicant: INTEL CORP

Inventor： WINER PAUL ,  ROWLETTE JEREMY

IPC: B81B1/00 ,  B81C1/00

公开(公告)号：MY112358A

公开(公告)日：2001-05-31

申请号：MYPI19976212

申请日：1997-12-20

Applicant: INTEL CORP

Inventor： LIVENGOOD RICHARD H ,  WINER PAUL

IPC: H01L23/544

Abstract: A FIDUCIAL (301,401) FOR ALIGNING AN INTEGRATED CIRCUIT DIE. IN ONE EMBODIMENT, THE FIDUCIAL IS CONFIGURED TO BE EXPOSED BY LASER CHEMICAL ETCHING THROUGH A SILICON SUBSTRATE (313) THROUGH THE BACK SIDE (331) OF A C4 PACKAGED INTEGRATED CIRCUIT DIE. THE PRESENTLY DESCRIBED FIDUCIAL INCLUDES FLOATING DIFFUSION REGIONS DISPOSED IN THE SUBSTRATE. AN OXIDE LAYER (321) FREE OFMETAL CONTACTS IS DISPOSED OVER THE DIFFUSION REGIONS (307, 309,311) WITHIN THE FIDUCIAL REGION (303,305) OF THE INTEGRATED CIRCUIT. A METAL PATTERN (323) LAYER IS DISPOSED BENEATH THE OXIDE LAYER TO PROVIDE ALIGNMENT INFORMATION. THE METAL PATTERN LAYER IS CONFIGURED TO BE VISIBLE THROUGH THE OXIDE LAYER AFTER THE SILICON SUBSTRATE HAS BEEN REMOVED FROM THE FIDUCIAL REGION. A LIGHT BLOCK (327) IS DISPOSED BETWEEN THE METAL PATTERN LAYER AND AN UNDERLYING EPOXY (325)UNDERFILL LAYER TO MINIMIZE THE RISK OF AN EXCESSIVE AMOUNT OF LIGHT FROM BEING EXPOSED TO THE UNDERLYING EPOXY LAYER, WHICH MINIMIZES THE RISK OF THE EPOXY LAYER FROM DAMAGING THE INTEGRATED CIRCUIT FROM EXCESSIVE LIGHT EXPOSURE. SINCE THE PRESENTLYDESCRIBED FIDUCIAL DOES NOT INCLUDE ANY CONTACTS IN THE OXIDE LAYER, THE ADDITIONAL STEP OF UTILIZING A FOCUS ION BEAM MILL IS NO LONGER NECESSARY AND THE PRESENTLY DESCRIBED FIDUCIAL THEREFORE ONLY NEEDS TO BE ETCHED WITH A LASER CHEMICAL ETCHER TO BE EXPOSED(FIG. 3 & 4)

公开(公告)号：AU6971898A

公开(公告)日：1998-12-08

申请号：AU6971898

申请日：1998-04-14

Applicant: INTEL CORP

Inventor： WINER PAUL ,  PANICCIA MARIO J ,  MA KARL J

IPC: G01R31/26 ,  H01L23/467 ,  H01L23/473 ,  H01L23/34

Abstract: A method and an apparatus for cooling a semiconductor die. In one embodiment, a C4 packaged semiconductor die is thermally coupled to a cooling plate having an opening. The opening of the cooling plate is disposed over a back side surface of the semiconductor die such that direct unobstructed access to the exposed back side surface of the semiconductor die is provided. A conformable thermal conductor, such as indium, is disposed between the semiconductor die and the cooling plate to improve the thermal coupling between the semiconductor and cooling plate. In one embodiment, the semiconductor die is mounted on a circuit board and a cooling block is disposed on the opposite side of the circuit board. The cooling plate is thermally coupled to the cooling block with heat transfer conduits, such as thermal screws, that extend through the circuit board to transfer the heat from the semiconductor die through the cooling plate through the heat transfer conduits to the cooling block located on the opposite side of the circuit board. In one embodiment, coolant is circulated through the cooling block to remove heat from the cooling block.

公开(公告)号：EP2726934A4

公开(公告)日：2015-03-04

申请号：EP12807237

申请日：2012-06-29

Applicant: INTEL CORP

Inventor： WINER PAUL

IPC: G02B27/22 ,  G09G3/34 ,  H04N13/04

CPC classification number: G02B27/2264 ,  G09G3/3406 ,  G09G2380/00 ,  H04N13/0438 ,  H04N13/0497

Abstract: In general, in one aspect, a three dimensional (3D) display includes an optical stack, a backlight, panel electronics and a backlight driver. The optical stack is to present left eye and right eye images. The backlight is to illuminate the optical stack so the left eye and right eye images are visible and to provide signals for synchronizing the image illuminated on the optical stack with shutter glasses worn by a user to enable a left eye to view the left eye images and a right eye to view the right eye images. The panel electronics are to generate the left eye and right eye images on the optical stack. The backlight driver is to control operation of the backlight.