公开(公告)号：WO2017112076A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/058879

申请日：2016-10-26

Applicant: INTEL CORPORATION

Inventor： AOKI, Russell S. ,  THIBADO, Jonathan W. ,  SMALLEY, Jeffory L. ,  LLAPITAN, David J. ,  BOYD, Thomas A. ,  KOFSTAD, Harvey R. ,  ZIAKAS, Dimitrios ,  YAN, Hongfei

IPC: H01R12/71 ,  H01R4/02 ,  H05K3/32

CPC classification number: H01L23/345 ,  H01L23/49816 ,  H01L23/49822 ,  H05K1/0212 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/176

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

Abstract translation: 描述了具有直接功率的返工栅格阵列中介层。 内插器具有可安装在主板和封装之间的基础层。 加热器嵌入在基层中以提供局部热量来回流焊料，以使得封装的附接或分离中的至少一个能够进行。 连接器安装在基础层上并连接到加热器和封装，以提供直接与电源连接的连接路径而不是通过主板。 一种类型的内插器与具有可焊接扩展的封装件接合。 另一个插入器具有多个嵌入基础层中的加热器区域。