公开(公告)号：WO2022108647A1

公开(公告)日：2022-05-27

申请号：PCT/US2021/049666

申请日：2021-09-09

Applicant: INTEL CORPORATION

Inventor： PIETAMBARAM, Srinivas V. ,  MARIN, Brandon C. ,  PAITAL, Sameer ,  VADLIMANI, Sai ,  MANEPALLI, Rahul N. ,  LI, Xiaoqian ,  POTHUKUCHI, Suresh V. ,  SHARAN, Sujit ,  SARKAR, Arnab ,  KARHADE, Omkar ,  DESHPANDE, Nitin ,  PRATAP, Divya ,  ECTON, Jeremy ,  MALLIK, Debendra ,  MAHAJAN, Ravindranath V. ,  ZHANG, Zhichao ,  AYGÜN, Kemal ,  NIE, Bai ,  DARMAWIKARTA, Kristof ,  JAUSSI, James E. ,  GAMBA, Jason M. ,  CASPER, Bryan K. ,  DUAN, Gang ,  INTI, Rajesh ,  MANSURI, Mozhgan ,  JADHAV, Susheel ,  BROWN, Kenneth ,  AGRAWAL, Ankar ,  DOBRIYAL, Priyanka

IPC: G02B6/42 ,  H01L31/0203 ,  H01L23/538 ,  H01L25/16

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

公开(公告)号：EP4057038A1

公开(公告)日：2022-09-14

申请号：EP22155383.7

申请日：2022-02-07

Applicant: INTEL Corporation

Inventor： PRATAP, Divya ,  LI, Xiaoqian ,  CHIU, Chia-Pin

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics systems and packages (100). In an embodiment, a photonics package (100) comprises a package substrate (105) and a photonics die (110) overhanging an edge of the package substrate (105). In an embodiment, the photonics die (110) comprises a v-groove (112) for receiving an optical fiber. In an embodiment, the photonics package (100) further comprises an integrated heat spreader (IHS) over the photonics die (110). In an embodiment, the IHS comprises a foot (122), and a hole (123) through the foot (122) is aligned with the v-groove (112).

公开(公告)号：EP4497209A1

公开(公告)日：2025-01-29

申请号：EP23775422.1

申请日：2023-01-11

Applicant: INTEL Corporation

Inventor： FRYMAN, Joshua B. ,  AHMED, Khaled ,  SHUMARAYEV, Sergey ,  LILJEBERG, Thomas ,  PRATAP, Divya ,  JAUSSI, James E.

IPC: H04B10/25 ,  H04B10/50 ,  G02B6/10 ,  G02B6/122 ,  G02B6/42 ,  H01S5/42

公开(公告)号：EP4020040A1

公开(公告)日：2022-06-29

申请号：EP21208878.5

申请日：2021-11-17

Applicant: INTEL Corporation

Inventor： LI, Xiaoqian ,  DESHPANDE, Nitin ,  KARHADE, Omkar ,  TODA, Asako ,  PRATAP, Divya ,  ZHANG, Zhichao

IPC: G02B6/42 ,  G02B6/30

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS

公开(公告)号：EP4020030A1

公开(公告)日：2022-06-29

申请号：EP21209148.2

申请日：2021-11-18

Applicant: INTEL Corporation

Inventor： PRATAP, Divya ,  NEKKANTY, Srikant

IPC: G02B6/26 ,  G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

公开(公告)号：EP4248249A1

公开(公告)日：2023-09-27

申请号：EP21895299.2

申请日：2021-09-09

Applicant: INTEL Corporation

Inventor： PIETAMBARAM, Srinivas V. ,  MARIN, Brandon C. ,  PAITAL, Sameer ,  VADLIMANI, Sai ,  MANEPALLI, Rahul N. ,  LI, Xiaoqian ,  POTHUKUCHI, Suresh V. ,  SHARAN, Sujit ,  SARKAR, Arnab ,  KARHADE, Omkar ,  DESHPANDE, Nitin ,  PRATAP, Divya ,  ECTON, Jeremy ,  MALLIK, Debendra ,  MAHAJAN, Ravindranath V. ,  ZHANG, Zhichao ,  AYGÜN, Kemal ,  NIE, Bai ,  DARMAWIKARTA, Kristof ,  JAUSSI, James E. ,  GAMBA, Jason M. ,  CASPER, Bryan K. ,  DUAN, Gang ,  INTI, Rajesh ,  MANSURI, Mozhgan ,  JADHAV, Susheel ,  BROWN, Kenneth ,  AGRAWAL, Ankar ,  DOBRIYAL, Priyanka

IPC: G02B6/42 ,  H01L31/0203 ,  H01L23/538 ,  H01L25/16

公开(公告)号：EP4063926A1

公开(公告)日：2022-09-28

申请号：EP22150101.8

申请日：2022-01-04

Applicant: Intel Corporation

Inventor： LI, Xiaoqian ,  MORGAN, Wesley ,  DESHPANDE, Nitin ,  PRATAP, Divya

IPC: G02B6/36 ,  G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package (100) comprises a photonics die (105) and a plurality of v-grooves (117) on the photonics die (105). In an embodiment, a lens array (122) is optically coupled to a spot size converter on the photonics die (105). In an embodiment, the lens array (122) comprises a main body (120) and a plurality of lenses (122) extending out from the main body.

公开(公告)号：EP4016151A1

公开(公告)日：2022-06-22

申请号：EP21198382.0

申请日：2021-09-22

Applicant: INTEL Corporation

Inventor： DESHPANDE, Nitin ,  KARHADE, Omkar ,  MARIN, Brandon ,  MAY, Robert ,  BOYAPATI, Sri Ranga Sai ,  PIETAMBARAM, Srinivas V. ,  LI, Xiaoqian ,  ECTON, Jeremy ,  PRATAP, Divya ,  TANAKA, Hiroki ,  VADLAMANI, Sai

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.