公开(公告)号：WO2022108647A1

公开(公告)日：2022-05-27

申请号：PCT/US2021/049666

申请日：2021-09-09

Applicant: INTEL CORPORATION

Inventor： PIETAMBARAM, Srinivas V. ,  MARIN, Brandon C. ,  PAITAL, Sameer ,  VADLIMANI, Sai ,  MANEPALLI, Rahul N. ,  LI, Xiaoqian ,  POTHUKUCHI, Suresh V. ,  SHARAN, Sujit ,  SARKAR, Arnab ,  KARHADE, Omkar ,  DESHPANDE, Nitin ,  PRATAP, Divya ,  ECTON, Jeremy ,  MALLIK, Debendra ,  MAHAJAN, Ravindranath V. ,  ZHANG, Zhichao ,  AYGÜN, Kemal ,  NIE, Bai ,  DARMAWIKARTA, Kristof ,  JAUSSI, James E. ,  GAMBA, Jason M. ,  CASPER, Bryan K. ,  DUAN, Gang ,  INTI, Rajesh ,  MANSURI, Mozhgan ,  JADHAV, Susheel ,  BROWN, Kenneth ,  AGRAWAL, Ankar ,  DOBRIYAL, Priyanka

IPC: G02B6/42 ,  H01L31/0203 ,  H01L23/538 ,  H01L25/16

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

公开(公告)号：WO2020068239A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/039976

申请日：2019-06-28

Applicant: INTEL CORPORATION

Inventor： VENKATRAM, Hariprasath ,  MOSTOFA, Mohammed ,  INTI, Rajesh ,  CHENG, Roger K. ,  MARTIN, Aaron ,  MOZAK, Christopher ,  KAPPANGANTULA, Pavan Kumar ,  YANG, Hsien-Pao ,  MANSURI, Mozhgan ,  JAUSSI, James ,  SRIDHARAN, Harishankar

IPC: G11C11/4074 ,  G11C5/14

Abstract: An apparatus is provided which comprises: a first power supply rail to provide a first power supply; second and third power supply rails to provide second and third power supplies, respectively, wherein a voltage level of the first power supply is higher than a voltage level of each of the second and third power supplies; a first driver circuitry coupled to the first power supply rail and the second power supply rail; a second driver circuitry coupled to the third power supply rail, and coupled to the first driver circuitry; and a stack of transistors of N conductivity type coupled to the first power supply rail, and to the second driver circuitry.

公开(公告)号：EP4248249A1

公开(公告)日：2023-09-27

申请号：EP21895299.2

申请日：2021-09-09

Applicant: INTEL Corporation

Inventor： PIETAMBARAM, Srinivas V. ,  MARIN, Brandon C. ,  PAITAL, Sameer ,  VADLIMANI, Sai ,  MANEPALLI, Rahul N. ,  LI, Xiaoqian ,  POTHUKUCHI, Suresh V. ,  SHARAN, Sujit ,  SARKAR, Arnab ,  KARHADE, Omkar ,  DESHPANDE, Nitin ,  PRATAP, Divya ,  ECTON, Jeremy ,  MALLIK, Debendra ,  MAHAJAN, Ravindranath V. ,  ZHANG, Zhichao ,  AYGÜN, Kemal ,  NIE, Bai ,  DARMAWIKARTA, Kristof ,  JAUSSI, James E. ,  GAMBA, Jason M. ,  CASPER, Bryan K. ,  DUAN, Gang ,  INTI, Rajesh ,  MANSURI, Mozhgan ,  JADHAV, Susheel ,  BROWN, Kenneth ,  AGRAWAL, Ankar ,  DOBRIYAL, Priyanka

IPC: G02B6/42 ,  H01L31/0203 ,  H01L23/538 ,  H01L25/16