公开(公告)号：JP2011091361A

公开(公告)日：2011-05-06

申请号：JP2010149236

申请日：2010-06-30

Applicant: Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： BLUCK TERRY ,  PEDERSON TERRY ,  GRIMARD DENNIS

IPC: H01L21/683 ,  B23Q3/15 ,  H02N13/00

CPC classification number: H01L21/6831

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck assembly capable of reducing formation of plasma in the inside of an electrostatic chuck or its circumference, for example, in an opening penetrating the electrostatic chuck assembly, and a duct or its circumference while supplying a sufficient quantity of heat exchange gas to a substrate. SOLUTION: An isolator for a heat exchange gas conduit of this electrostatic chuck is disclosed. The isolator 300 includes a sleeve 304 and a body 308 arranged in the sleeve 304 for forming an annulus 312 for running the heat exchange gas between the sleeve 304 and itself. The body 308 is arranged in contact with a dielectric pack 111 of the electrostatic chuck, and may be supported in this position by a spring 328. A silicon seal 334 may be provided between the sleeve 304 and the pack 111 to prevent plasma from being formed in the conduit. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够减少静电卡盘或其周边内部的等离子体形成的静电卡盘组件，例如在穿过静电卡盘组件的开口以及导管或其圆周上，同时 向基板供应足够量的热交换气体。 解决方案：公开了一种用于该静电卡盘的热交换气体导管的隔离器。 隔离器300包括套筒304和布置在套筒304中的主体308，用于形成用于在套筒304和本身之间运行热交换气体的环带312。 主体308布置成与静电卡盘的电介质组111接触，并且可以通过弹簧328被支撑在该位置。硅密封件334可以设置在套筒304和包装件111之间，以防止形成等离子体 在导管中。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2017085136A

公开(公告)日：2017-05-18

申请号：JP2016248561

申请日：2016-12-22

Applicant: インテヴァック インコーポレイテッド ,  Intevac Inc ,  インテヴァック インコーポレイテッド

Inventor： PEDERSON TERRY ,  HENRY HIESLMAIR ,  CHUN MOON ,  VINAY PRABHAKAR ,  ADIBI BABAK ,  BLUCK TERRY

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/265 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

Abstract: 【課題】基板処理システムとして、スパッタリングおよびイオン注入システムのようなシステムでは、基板の処理中にシステムは固定されているが、このような固定されたシステムは、高処理能力による処理が困難である。【解決手段】2つのレール350、355を、処理領域の両側にそれぞれ設け、2つのチャックアレイC1、C2がレール上に片持ち状に設けられ、複数のチャック352、357を支持する。レールは、処理のための上の位置およびチャックアレイを返送するための下の位置に配置する昇降機構360に連結される。これにより、1つのレールが下の位置をとるとき、チャックアレイは、他のチャックアレイの下を通過することができ、イオンビームを常に一方のチャックアレイ上に維持し、処理されたアレイがビームから抜ける前に、もう一方のアレイをアンロード/ロードし、処理位置に戻す。【選択図】図3A

公开(公告)号：MY190638A

公开(公告)日：2022-04-29

申请号：MYPI2018701283

申请日：2016-09-30

Applicant: INTEVAC INC

Inventor： BLUCK TERRY ,  ZANETTO AARON ,  PEDERSON TERRY ,  RUNSTADLER JR WILLIAM EUGENE

IPC: B65G49/07 ,  G01B11/14 ,  G03F9/02 ,  H01L21/68 ,  H01L21/683

Abstract: A system (100) for processing wafers (220) in a vacuum processing chamber (400, 600). Carrier (200, 311, 313, 316, 317, 318, 319, 424, 503, 505, 700, 705, 1105, 1205, 1600, 1605) comprising a frame (205) having a plurality of openings (422, 1602), each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates (1610) configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage (1664) supports wafer plate under the opening in the carrier. A camera (1670) positioned to simultaneously image the mask and the wafer. Fig. 16D

公开(公告)号：ES2637391T3

公开(公告)日：2017-10-13

申请号：ES12866275

申请日：2012-11-02

Applicant: INTEVAC INC

Inventor： BROWN DAVID ,  SHAH VINAY ,  PEDERSON TERRY ,  BLUCK TERRY

IPC: C23C14/35

Abstract: Procedimiento para procesar un sustrato mediante pulverización catódica, que comprende: colocar una pluralidad de sustratos sobre un transportador; manejar el transportador de forma que transporte la pluralidad de sustratos a una velocidad constante y en una orientación hacia una diana, de forma que a cualquier tiempo dado, varios sustratos están orientados hacia la diana entre el borde de ataque y el borde de salida; barrer de forma recíproca una disposición de imanes detrás de la diana al tiempo que sostiene el plasma en un espacio entre la diana y los sustratos, en el que la etapa de barrer de forma recíproca la disposición de imanes se realiza a una velocidad que es, como mínimo, varias veces más rápida que la velocidad constante del transportador, caracterizado por definir zonas de rotación detrás del borde de ataque y el borde de salida de la diana e invertir el barrido recíproco de la disposición de imanes a puntos diferentes dentro de las zonas de rotación durante barridos diferentes.

公开(公告)号：SG10201603937RA

公开(公告)日：2016-08-30

申请号：SG10201603937R

申请日：2012-11-02

Applicant: INTEVAC INC

Inventor： BROWN DAVID WARD ,  SHAH VINAY ,  PEDERSON TERRY ,  BLUCK TERRY

Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

公开(公告)号：SG11201402177XA

公开(公告)日：2014-06-27

申请号：SG11201402177X

申请日：2012-11-08

Applicant: INTEVAC INC ,  PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ADIBI BABAK ,  BLUCK TERRY

Inventor： PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ADIBI BABAK ,  BLUCK TERRY

IPC: H01L21/677 ,  H01L21/687

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：MY185148A

公开(公告)日：2021-04-30

申请号：MYPI2014001255

申请日：2012-11-02

Applicant: INTEVAC INC

Inventor： BROWN DAVID WARD ,  SHAH VINAY ,  PEDERSON TERRY ,  BLUCK TERRY

Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target (262, 364, 464) positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target (262, 364, 464) and reciprocally slides behinds the target. A conveyor continuously transports substrates ( 150, 250, 350, 450, 650) at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge (243) and the traiIing edge (247). The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge (243) and trailing edge (247) of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone. (Figure 2)

公开(公告)号：MY175007A

公开(公告)日：2020-06-02

申请号：MYPI2014001355

申请日：2012-11-08

Applicant: INTEVAC INC

Inventor： PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ABIDI BABAK ,  BLUCK TERRY

Abstract: A system for processing substrates (102) has a vacuum enclosure 5 (100) and a processing chamber (115) situated to process wafers in a processing zone (145) inside the vacuum enclosure (100). Two rail assemblies are provided, one on each side of the processing zone (145). Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism (360) that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head (105) assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head (105) has plurality of electrostatic chucks that pick up the wafers (102) from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head (105).

公开(公告)号：PH12018500685A1

公开(公告)日：2018-10-15

申请号：PH12018500685

申请日：2018-03-27

Applicant: INTEVAC INC

Inventor： BLUCK TERRY ,  ZANETTO AARON ,  PEDERSON TERRY ,  RUNSTADLER JR WILLIAM EUGENE

IPC: B65G49/07 ,  G01B11/14 ,  G03F9/02 ,  H01L21/677 ,  H01L21/68

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

公开(公告)号：SG10201508582WA

公开(公告)日：2015-11-27

申请号：SG10201508582W

申请日：2012-11-08

Applicant: INTEVAC INC

Inventor： PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ADIBI BABAK ,  BLUCK TERRY

Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.