-
公开(公告)号：US20220402752A1
公开(公告)日：2022-12-22
申请号：US17351865
申请日：2021-06-18
Applicant: Infineon Technologies AG
Inventor： Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz
Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
-
公开(公告)号：US11117798B2
公开(公告)日：2021-09-14
申请号：US16270219
申请日：2019-02-07
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Alfons Dehe , Marc Fueldner , Bernd Goller , Ulrich Krumbein , Andreas Wiesbauer
Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.
-
公开(公告)号：US10214413B2
公开(公告)日：2019-02-26
申请号：US15819555
申请日：2017-11-21
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Nikolay Ilkov , Georg Lischka
Abstract: A MEMS sensor device includes an electrically conductive membrane and an electrically conductive closed loop structure. The closed loop structure is arranged in proximity to the membrane and is configured to reduce eddy currents in the membrane.
-
公开(公告)号：US10570007B2
公开(公告)日：2020-02-25
申请号：US16385475
申请日：2019-04-16
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Bernd Goller
Abstract: A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.
-
公开(公告)号：US20190359481A1
公开(公告)日：2019-11-28
申请号：US16385475
申请日：2019-04-16
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Bernd Goller
Abstract: A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.
-
Patent Agency Ranking
公开(公告)号：US20190270639A1
公开(公告)日：2019-09-05
申请号：US16270219
申请日：2019-02-07
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Alfons Dehe , Marc Fueldner , Bernd Goller , Ulrich Krumbein , Andreas Wiesbauer
Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.
-
公开(公告)号：US20190023562A1
公开(公告)日：2019-01-24
申请号：US16041083
申请日：2018-07-20
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Stefan Barzen , Alfons Dehe , Gunar Lorenz
Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.
-
公开(公告)号：US20180141802A1
公开(公告)日：2018-05-24
申请号：US15819555
申请日：2017-11-21
Applicant: Infineon Technologies AG
Inventor： Gunar Lorenz , Nikolay Ilkov , Georg Lischka
IPC: B81B3/00
CPC classification number: B81B3/0091 , B81B3/0086 , B81B7/0064 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127
Abstract: A MEMS sensor device includes an electrically conductive membrane and an electrically conductive closed loop structure. The closed loop structure is arranged in proximity to the membrane and is configured to reduce eddy currents in the membrane.
-
9.发明申请公开(公告)号：US20210385584A1
公开(公告)日：2021-12-09
申请号：US17354412
申请日：2021-06-22
Applicant: Infineon Technologies AG
Inventor： Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz , Pradyumna Mishra , Daniel Neumaier , David Tumpold
Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
-
公开(公告)号：US11053117B2
公开(公告)日：2021-07-06
申请号：US16821145
申请日：2020-03-17
Applicant: Infineon Technologies AG
Inventor： Marc Fueldner , Stefan Barzen , Alfons Dehe , Gunar Lorenz
Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the counterelectrode structure.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.024 seconds)
