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    Merged-mask micro-machining process
    1.
    发明公开
    Merged-mask micro-machining process 有权
    所述的微机械的制造方法与交叉衰落掩模

    公开(公告)号：EP1510864A2

    公开(公告)日：2005-03-02

    申请号：EP04026039.0

    申请日：2000-07-13

    Applicant: Input/Output, Inc.

    Inventor： Yu, Lianzhong ,  Ried, Robert P. ,  Goldberg, Howard D. ,  Yu, Duli

    IPC: G03F7/00

    CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

    Sensor design and process
    2.
    发明公开
    Sensor design and process 审中-公开
    Sensorentwurf und Verfahren

    公开(公告)号：EP1705489A2

    公开(公告)日：2006-09-27

    申请号：EP06012101.9

    申请日：2000-03-16

    Applicant: Input/Output, Inc.

    Inventor： Selvakumar, Arjun ,  Goldberg, Howard D. ,  Yu, Duli ,  IP, Matthew ,  Schmidt, Martin A. ,  Marsh, James L. ,  Fung, Bing-Fai ,  Simon, Philip

    IPC: G01P15/13 ,  G01P15/08 ,  G01P15/125 ,  B81B3/00 ,  G01P1/02 ,  G01P1/00 ,  B81B7/00

    CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

    Abstract translation: 一种用于测量地震数据的加速度计（305）。 加速度计（305）包括用于在真空密封过程中使用的集成通气孔和用于减小盖子晶片弯曲的平衡金属图案。 加速度计（305）还包括用于将结合压力隔离到加速度计（305）的指定区域的顶盖挤压框架凹部（405）和底盖压力框架凹部（420）。 加速度计（305）被真空密封并且包括平衡金属图案（730），以防止加速度计（305）的性能下降。 在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。 加速度计（305）还包括过冲保护缓冲器（720）和图案化金属电极，以在加速度计（305）的操作期间减小静摩擦力。

    Accelerometer with mass support springs having predetermined vibration modes
    3.
    发明公开
    Accelerometer with mass support springs having predetermined vibration modes 审中-公开
    Beschleunigungssensor mit Massen-Biegefedern mit bestimmten Vibrationsmoden

    公开(公告)号：EP1408336A2

    公开(公告)日：2004-04-14

    申请号：EP03028054.9

    申请日：2001-06-21

    Applicant: Input/Output, Inc.

    Inventor： Selvakumar, Arjun ,  Yu, Lianzhong ,  Yu, Duli ,  Jones, Ben

    IPC: G01P15/08 ,  G01P15/00

    CPC classification number: G01V1/181 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/0163 ,  B81B2203/053 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125

    Abstract: An accelerometer is disclosed comprising a measuring mass 1405 for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies 1400 positioned within the cavity, wherein each spring mass assembly 1400 includes a support structure 1410, including one or more resilient folded beams 1415a-1415d coupled to the support structure 1410 and the measuring mass 1405 is coupled to the resilient folded beams 1415a-1415d, wherein one or more electrode patterns are coupled to the spring mass assembly 1400, wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass 1405, and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to the measurement mass 1405.

    Abstract translation: 加速度计包括一个或多个弹簧质量组件（1400），其定位在壳体中的空腔内。 每个弹簧质量组件包括耦合到一个或多个弹性折叠梁（1415a-1415d）的测量块（1405），所述弹性折叠梁又连接到支撑结构（1410）。 一个或多个电极图案耦合到弹簧质量组件。 耦合到测量质量的是顶盖和底盖晶片，分别包括顶部和底部电容器电极。 弹簧质量组件还可以包括联接到支撑结构的一个或多个移动范围的止挡件，用于限制质量块在止挡件的方向上的移动。

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