Abstract:
The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.
Abstract:
An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
Abstract:
An accelerometer is disclosed comprising a measuring mass 1405 for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies 1400 positioned within the cavity, wherein each spring mass assembly 1400 includes a support structure 1410, including one or more resilient folded beams 1415a-1415d coupled to the support structure 1410 and the measuring mass 1405 is coupled to the resilient folded beams 1415a-1415d, wherein one or more electrode patterns are coupled to the spring mass assembly 1400, wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass 1405, and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to the measurement mass 1405.
Abstract:
A digital optical switch (108) and method for manufacture. The apparatus includes a mirror assembly (112) coupled to a top cap (110) and to a bottom cap (114).
Abstract:
An accelerometer is disclosed comprising a measuring mass 1405 for detecting acceleration. Springs suspending the mass are tuned so that induced vibrations remain in a predetermined frequency band or below a threshold amplitude, both being determined by the characteristics of a closed loop controller coupled to the sensor.