Abstract:
A radiation-sensitive resin composition includes (A) a polymer that includes an acid-labile group, (B) an acid generator that generates an acid upon exposure to radiation, and (C) a polymer that includes a fluorine atom and a functional group shown by the following general formula (x), the polymer (C) having a fluorine atom content higher than that of the polymer (A). €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-A-R 1 €ƒ€ƒ€ƒ€ƒ€ƒ(x) wherein R 1 represents an alkali-labile group, and A represents an oxygen atom (excluding an oxygen atom that is bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group), an imino group, -CO-O-*, or -SO 2 -O-* (wherein "*" indicates a bonding hand bonded to R 1 ).
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition excellent in MEEF (mask error enhancement factor), CDU (critical dimension uniformity) and resolution, and to provide a method for forming a resist pattern using the photoresist composition.SOLUTION: The photoresist composition comprises: [A] a polymer having a (meth)acrylate unit (I) having a norbornane ring with a sulfolactone ring in a side chain and having a weight average molecular weight of 3,000 or more and 8,000 or less; and [B] an acid generator. It is preferable that the polymer [A] further contains a structural unit (II) having an acid dissociable group.
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition excellent in MEEF (mask error enhancement factor), DOF (depth of focus) and resolution, and to provide a method for forming a resist pattern using the photoresist composition.SOLUTION: The photoresist composition comprises: [A] a polymer having a (meth)acrylate unit (I) having a norbornane ring with a sulfolactone ring in a side chain, a structural unit (II) including an acid dissociable group having a monocyclic alicyclic group, and a structural unit (III) including a lactone group; and [B] a radiation-sensitive acid generator.
Abstract:
PROBLEM TO BE SOLVED: To form a resist film suppressing generation of defects due to development failure in liquid immersion exposure while the hydrophobicity of a film surface is increased and also being excellent in lithographic performance.SOLUTION: There is provided a radiation-sensitive resin composition characterized by comprising a polymer (A) having a repeating unit (a1) having a group represented by the following general formula (1) or (2) and having a fluorine atom, in an amount of 0.1 mass% or more and 20 mass% or less based on the total volume of a polymer.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which can improve hydrophilicity during alkali development while ensuring hydrophobicity during liquid immersion exposure, suppress a development defect of an un-exposure part, and give a resist coating film which is excellent in a pattern shape after development.SOLUTION: The radiation-sensitive resin composition contains polymer (A) with acid dissociable group, an acid generator (B) which generates an acid by radiation, and polymer (C) which has a functional group represented by general formula (x) and a fluorine atom, and the polymer (C) is a polymer with more fluorine atom content than the polymer(A). [In the general formula (x), Rrepresents alkali dissociable group, A represents oxygen atom (excluding ones directly bonded to aromatic ring, carbonyl group, and sulfoxyl group), imino group, -CO-O-* or -SO-O-* ("*"represents a bonding hand which is bonded to R.).]
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition capable of suppressing development defects.SOLUTION: A photoresist composition comprises: [A] a polymer having a structural unit (I) including an acid-dissociable group; and [B] an acid generating agent including a compound expressed by a formula (1) below. In the formula (1), Ris a monovalent alicyclic hydrocarbon group having 3-20 carbon atoms. An aliphatic heterocycle may be condensed with a carbon ring of the alicyclic hydrocarbon group. X is **-(X-R')-X-. Xis *-COO- or -O-. Xis -COO- or -O-. R' is a divalent alicyclic hydrocarbon group having 3-20 carbon atoms. An aliphatic heterocycle may be condensed with a carbon ring of the alicyclic hydrocarbon group. n is 0 or 1. Ris a divalent straight chain hydrocarbon group having even number of carbon atoms or a divalent straight chain fluorination hydrocarbon group having even number of carbon atoms. Ris a hydrogen atom or a fluorine atom.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, which suppresses generation of a missing contact hole in a process using a developing solution containing an organic solvent, and which is excellent in lithographic characteristics.SOLUTION: The radiation-sensitive resin composition is used for a method for forming a negative resist pattern using a developing solution containing 80 mass% or more of an organic solvent; and the resin composition comprises [A] a base polymer having an acid dissociable group, [B] a polymer having a higher fluorine atom content percentage than that of the [A] polymer, [C] a radiation-sensitive acid generator, [D] a solvent, and [E] a compound having a relative permittivity higher at least by 15 than the relative permittivity of the [D] solvent. The [A] polymer has a structural unit expressed by formula (1) described below. The [E] compound is included in an amount of 10 pts.mass or more and 200 pts.mass or less with respect to 100 pts.mass of the [A] polymer.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition capable of forming a resist pattern which sufficiently satisfies MEEF, LWR and CDU and pattern collapse resistance properties, and to provide a method for forming the resist pattern using the radiation sensitive resin composition.SOLUTION: The radiation sensitive resin composition contains: [A] a polymer including a structural unit (I) expressed by formula (1) and a structural unit having an acid dissociable group; [B] a salt having photo-degradation properties expressed by formula (2); and [C] a radiation sensitive acid generator.