Abstract:
A composition for formation of upper layer film, which is used for forming an upper layer film on the surface of a photoresist film and which comprises a resin (A) having a repeating unit represented by the following general formula (1-1) and not having a repeating unit represented by the following general formula (1-2), and a resin (B) having a repeating unit represented by the following general formula (1-2) and not having a repeating unit represented by the following general formula (1-1). [In the general formulas (1-1) and (1-2), R 1 is hydrogen or the like; R 2 is single bonds or the like; and R 3 is a fluorine-substituted, linear or branched alkyl group having 1 to 12 carbon atoms, or the like.] The composition can form an upper layer film giving a sufficiently high receded contact angle.
Abstract:
An object of the present invention is to provide a novel fluorine-containing polymer, a radiation-sensitive resin composition for liquid immersion lithography which contains the fluorine-containing polymer, which leads to a pattern having an excellent shape and excellent depth of focus, wherein the amount of an eluted component in a liquid for liquid immersion lithography such as water that comes in contact with the resist during exposure in liquid immersion lithography is little, and which provides a larger receding contact angle between the resist film and the liquid for liquid immersion lithography such as water, and a method for purifying the fluorine-containing polymer. The present resin composition comprises a novel fluorine-containing polymer (A) containing repeating units represented by the general formulae (1) and (2) and having Mw of 1,000-50,000, a resin (B) having an acid-unstable group, a radiation-sensitive acid generator (C), a nitrogen-containing compound (D) and a solvent (E).
Abstract:
A radiation-sensitive resin composition includes (A) a polymer that includes an acid-labile group, (B) an acid generator that generates an acid upon exposure to radiation, and (C) a polymer that includes a fluorine atom and a functional group shown by the following general formula (x), the polymer (C) having a fluorine atom content higher than that of the polymer (A). €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-A-R 1 €ƒ€ƒ€ƒ€ƒ€ƒ(x) wherein R 1 represents an alkali-labile group, and A represents an oxygen atom (excluding an oxygen atom that is bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group), an imino group, -CO-O-*, or -SO 2 -O-* (wherein "*" indicates a bonding hand bonded to R 1 ).
Abstract:
A radiation-sensitive resin composition includes (A) a polymer, (B) a photoacid generator, (C) an acid diffusion controller, and (D) a solvent, the polymer (A) including a repeating unit (a-1) shown by the following general formula (a-1), and the acid diffusion controller (C) including at least one base selected from (C-1) a base shown by the following general formula (C-1) and (C-2) a photodegradable base. wherein R 1 individually represent a hydrogen atom or the like, R represents a monovalent group shown by the above general formula (a'), R 19 represents a chain-like hydrocarbon group having 1 to 5 carbon atoms or the like, A represents a divalent chain-like hydrocarbon group having 1 to 30 carbon atoms or the like, m and n are integers from 0 to 3 (m+n=1 to 3), and R 2 and R 3 individually represent a monovalent chain-like hydrocarbon group having 1 to 20 carbon atoms or the like, provided that the two R 2 may bond to form a ring structure.
Abstract:
A radiation-sensitive resin composition that not only excels in fundamental properties as resist, such as sensitivity and resolution, but also with respect to both of line-and-space pattern and isolated space pattern, realizes extensive depth of focus (DOF) and is less in the line width change attributed to alteration of baking temperature, the limit line width free from any phenomenon of line pattern collapse of the radiation-sensitive resin composition being small. Further, there is provided a lactone copolymer being useful as a resin component of the radiation-sensitive resin composition. This lactone copolymer is represented by a copolymer of compound of the following formula (1-1), compound of the following formula (2-1) and compound of the following formula (3-1). This radiation-sensitive resin composition comprises the lactone copolymer (a) and radiation-sensitive acid generating agent (b).