Abstract:
An antireflection film-forming composition having excellent coatability, capable of significantly inhibiting production of fine microbubbles and capable of forming an antireflection film with a sufficiently decreased standing-wave effect, and having excellent solubility in water and alkaline developers is provided. The composition comprises a polymer having at least one polymerization unit with a hydroxyl group-containing organic group on the side chain, preferably a copolymer having at least one recurring unit of the following formula (2) and/or at least one recurring unit of the following formula (3) and at least one recurring unit of the following formula (4), and/or a salt thereof: wherein R 1 and R 2 represent a hydrogen atom, a fluorine atom, or a monovalent organic group, m is an integer of 1-20, and A represents a divalent coupling means.
Abstract:
A composition for formation of upper layer film, which is used for forming an upper layer film on the surface of a photoresist film and which comprises a resin (A) having a repeating unit represented by the following general formula (1-1) and not having a repeating unit represented by the following general formula (1-2), and a resin (B) having a repeating unit represented by the following general formula (1-2) and not having a repeating unit represented by the following general formula (1-1). [In the general formulas (1-1) and (1-2), R 1 is hydrogen or the like; R 2 is single bonds or the like; and R 3 is a fluorine-substituted, linear or branched alkyl group having 1 to 12 carbon atoms, or the like.] The composition can form an upper layer film giving a sufficiently high receded contact angle.
Abstract:
PROBLEM TO BE SOLVED: To provide: a negative radiation-sensitive composition capable of forming a cured pattern having a low relative dielectric constant; a cured pattern forming method using the same; and a cured pattern obtained by the cured pattern forming method. SOLUTION: The negative radiation-sensitive composition includes (A) a polymer, (B) a radiation-sensitive acid generator, and (C) a solvent. The polymer (A) is a polymer obtained by hydrolysis and condensation of at least one hydrolyzable silane compound selected from (a1) a hydrolyzable silane compound represented by the general formula (1): R a Si(OR 1 ) 4-a and (a2) a hydrolyzable silane compound represented by the general formula (2): Si(OR 2 ) 4 . When the total of all units included in the polymer (A) is considered to be 100 mol%, the content of units derived from the compound (1) is 80-100 mol%. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative-type radiation-sensitive composition which forms a hardened pattern of low specific dielectric constant, and to provide a pattern-forming method using the same, and a hardened pattern. SOLUTION: The negative-type radiation-sensitive composition contains: (A1) a polymer having a structure unit (I), which is derived from a radically polymerizable compound having an alkylene glycol chain, and a structure unit (II) derived from a radically polymerizable compound having an alkoxysilyl group; (B) a radiation-sensitive acid-generating agent; and (C) a solvent. The method includes; (1) a process in which a film using the composition is formed on the surface of a substrate; (2) a process in which the film thus obtained is subjected to heat processing; (3) a process in which the heated film is exposed to light; (4) a process in which the exposed film is developed to obtain a precursory pattern; and (5) a process in which the precursory pattern thus obtained is hardened to obtain a hardened pattern. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive resin composition superior in sensitivity and resolution, showing small optical proximity effect, capable of accurately and stably forming a fine pattern, even in the case of an isolated line pattern, capable of ensuring sufficient focus margin for an isolated line pattern, and useful as a chemically amplified resist. SOLUTION: The negative radiation-sensitive resin composition comprises (A) a low-molecular compound obtained by substituting at least one hydrogen atom of a compound, having an amino group in which the hydrogen atom bonds to a nitrogen atom by a t-butoxycarbonyl group; (B) a radiation-sensitive acid generator; (D) an alkali-soluble resin comprising a p-hydroxystyrene/styrene copolymer; and (E) a crosslinking agent. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist pattern forming method using a radiation-sensitive resin composition and an upper layer film forming composition each having sufficient transmittance at an exposure wavelength, particularly at 248 nm (KrF) and 193 nm (ArF). SOLUTION: The photoresist pattern forming method includes: forming a photoresist film on a substrate by applying the radiation-sensitive resin composition containing a resin containing >60 mol% of a monomer which becomes alkali-soluble under the action of an acid and a radiation-sensitive acid generator; forming an upper layer film on the photoresist film by applying the upper layer film forming composition containing an alkali-soluble resin containing at least one of specific monomers; and obtaining a resist pattern by disposing a liquid immersion medium between the upper layer film and a lens, irradiating the photoresist film and the upper layer film with exposure light via the liquid immersion medium and a mask having a predetermined pattern, and performing development. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in sensitivity and resolution, having a small light proximity effect, capable of accurately and stably forming a fine pattern even in an isolated line pattern, capable of ensuring a sufficient focus margin for the isolated line pattern and useful as a positive type or negative type chemical amplification type resist. SOLUTION: The positive type radiation-sensitive resin composition contains (A) a low molecular compound obtained by preparing a compound having an amino group in which at least one hydrogen atom bonds to a nitrogen atom and substituting the hydrogen atom by a t-butoxycarbonyl group, (B) a radiation- sensitive acid generating agent and (C) (a) an acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated or (b) an alkali-soluble resin and an alkali solubility controlling agent. The negative type radiation-sensitive resin composition contains the component A, the component B, (D) an alkali-soluble resin and (E) a crosslinking agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition which can reduce nano edge roughness and is excellent in depth of focus.SOLUTION: A photoresist composition contains [A] a compound represented by the following formula (1), and [B] a polymer having a structural unit (I) represented by the following formula (2-1).
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition having excellent nanoedge roughness suppressing properties and a focal depth.SOLUTION: The photoresist composition contains a polymer having a structural unit (I) represented by formula (1-1) and an acid generating agent represented by formula (2). In the formula (2), Ris an organic group having at least one ester bond and is represented by formula (2-1a).