公开(公告)号：DE60026635D1

公开(公告)日：2006-05-11

申请号：DE60026635

申请日：2000-04-11

Applicant: JSR CORP

Inventor： SUGITA HIKARU ,  SAITO AKIO ,  YAMADA KINJI ,  NISHIKAWA MICHINORI ,  OHTA YOSHIHISA ,  YUUMOTO YOSHIJI

IPC: G03F7/09 ,  H01L21/027 ,  C08K5/54 ,  C08L83/04 ,  C08L83/14 ,  G03F7/075 ,  G03F7/11

Abstract: Disclosed are a composition for a resist underlayer film excellent in reproducibility of a resist pattern, excellent in adhesion to a resist, excellent in resistance to a developing solution used after exposure of the resist and decreased in film loss in oxygen ashing of the resist; and a method for producing the same, the composition comprising: both or either of a hydrolysate and a condensate of (A) at least one compound selected from the group consisting of (A-1) a compound represented by the following general formula (1): R aSi(OR )4-a wherein R represents a hydrogen atom, a fluorine atom or a univalent organic group, R represents a univalent organic group, and a represents an integer of 0 to 2, and (A-2) a compound represented by the following general formula (2): R b(R O)3-bSi-(R )d-Si(OR )3-cR c wherein R , R , R and R , which may be the same or different, each represent univalent organic groups, b and c, which may be the same or different, each represent integers of 0 to 2, R represents an oxygen atom or -(CH2)n-, d represents 0 or 1, and n represents an integer of 1 to 6; and (B) a compound generating an acid by ultraviolet irradiation and/or heating.

公开(公告)号：DE60026635T2

公开(公告)日：2006-10-05

申请号：DE60026635

申请日：2000-04-11

Applicant: JSR CORP

Inventor： SUGITA HIKARU ,  SAITO AKIO ,  YAMADA KINJI ,  NISHIKAWA MICHINORI ,  OHTA YOSHIHISA ,  YUUMOTO YOSHIJI

IPC: G03F7/09 ,  H01L21/027 ,  C08K5/54 ,  C08L83/04 ,  C08L83/14 ,  G03F7/075 ,  G03F7/11

Abstract: Disclosed are a composition for a resist underlayer film excellent in reproducibility of a resist pattern, excellent in adhesion to a resist, excellent in resistance to a developing solution used after exposure of the resist and decreased in film loss in oxygen ashing of the resist; and a method for producing the same, the composition comprising: both or either of a hydrolysate and a condensate of (A) at least one compound selected from the group consisting of (A-1) a compound represented by the following general formula (1): R aSi(OR )4-a wherein R represents a hydrogen atom, a fluorine atom or a univalent organic group, R represents a univalent organic group, and a represents an integer of 0 to 2, and (A-2) a compound represented by the following general formula (2): R b(R O)3-bSi-(R )d-Si(OR )3-cR c wherein R , R , R and R , which may be the same or different, each represent univalent organic groups, b and c, which may be the same or different, each represent integers of 0 to 2, R represents an oxygen atom or -(CH2)n-, d represents 0 or 1, and n represents an integer of 1 to 6; and (B) a compound generating an acid by ultraviolet irradiation and/or heating.

公开(公告)号：JP2009042643A

公开(公告)日：2009-02-26

申请号：JP2007209714

申请日：2007-08-10

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： CHIBA TAKASHI ,  UCHIDA TARO ,  ASANO SHIGETO ,  SAITO AKIO

IPC: G03F7/038 ,  C08G73/10 ,  G03F7/037 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitably used for a surface protective film, an interlayer insulating film, and an insulating film for high-density mounting board, which has high solubility to general solvents and satisfactory sensitivity to g-ray and h-ray, can respond to highly thick application and alkali development, form a pattern of high resolution, and provide a cured product with high film remaining rate.
SOLUTION: The photosensitive resin composition comprises (A) a polyimide resin, (B) a photosensitive acid generator containing a compound represented by the general formula (1), wherein R1 represents hydrogen atom, a 1-4C alkyl group or a 1-4C alkoxyl group, X represents halogen atom, Y represents oxygen atom or sulfur atom; and (C) a crosslinking agent.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供适合用于表面保护膜，层间绝缘膜和用于高密度安装板的绝缘膜的感光性树脂组合物，其对一般溶剂具有高溶解度并且对g具有令人满意的敏感性 射线和h射线，可以响应高度的应用和碱发展，形成高分辨率的图案，并提供具有高膜剩余率的固化产品。 光敏树脂组合物包含（A）聚酰亚胺树脂，（B）含有由通式（1）表示的化合物的光敏酸产生剂，其中R1表示氢原子，1-4C烷基或 1-4C烷氧基，X表示卤素原子，Y表示氧原子或硫原子; 和（C）交联剂。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008231255A

公开(公告)日：2008-10-02

申请号：JP2007073025

申请日：2007-03-20

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： UCHIDA TARO ,  ASANO SHIGETO ,  SAITO AKIO ,  CHIBA TAKASHI

IPC: C08G73/10 ,  G03F7/038 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a resin composition coated in thick films with good in-plane uniformity in coating and alkali developed and giving cured products having high resolution and suitable for uses as surface protection films, interlayer insulating films and insulating films for high-density mounting boards.
SOLUTION: The resin composition comprises (A) an OH-containing polyimide polymer comprising a repeating unit expressed by general formula (1) and a repeating unit expressed by general formula (2) and (B) a solvent containing a specific solvent such as propylene glycol monoalkyl monoether or the like.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种涂覆在具有良好的涂层和碱显影的均匀性的厚膜中的树脂组合物，并得到具有高分辨率且适用于表面保护膜，层间绝缘膜和绝缘膜的固化产物 适用于高密度安装板。 解决方案：树脂组合物包含（A）包含由通式（1）表示的重复单元的含羟基聚酰亚胺聚合物和由通式（2）表示的重复单元和（B）含有特定溶剂的溶剂 例如丙二醇单烷基单醚等。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008170984A

公开(公告)日：2008-07-24

申请号：JP2007324033

申请日：2007-12-14

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SUGITA HIKARI ,  SAITO AKIO ,  YAMADA KINJI ,  NISHIKAWA MICHINORI ,  OTA YOSHIHISA ,  ISAMOTO YOSHITSUGU

IPC: G03F7/11 ,  G03F7/004 ,  G03F7/075 ,  G03F7/095 ,  G03F7/26 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To obtain a composition for a resist underlayer film disposed between a resist and an antireflection film, having both of adhesion to the resist and resistance to a resist developing solution, and further having resistance to oxygen ashing in resist removal.
SOLUTION: The composition for a resist underlayer film comprises: (A) both or either of a hydrolysate and a condensate of a silane compound; (B) a compound generating an acid by ultraviolet irradiation and/or heating (e.g., bis(4-t-butylphenyl)iodonium camphorsulfonate); and (C) a catalyst (e.g., maleic acid). The silane compound is at least one compound selected from the group consisting of tetramethoxysilane, tetraethoxysilane, tetra-n-propoxysilane, tetra-iso-propoxysilane and tetraphenoxysilane.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了获得设置在抗蚀剂和抗反射膜之间的抗蚀剂下层膜的组合物，其具有对抗蚀剂的粘附性和对抗蚀剂显影溶液的抗性，并且还具有抗氧化剂抗氧化性的抗蚀剂 去除。 解决方案：用于抗蚀剂下层膜的组合物包括：（A）硅烷化合物的水解产物和缩合物中的任一种; （B）通过紫外线照射和/或加热产生酸的化合物（例如双（4-叔丁基苯基）碘鎓樟脑磺酸盐）; 和（C）催化剂（例如马来酸）。 硅烷化合物是选自四甲氧基硅烷，四乙氧基硅烷，四正丙氧基硅烷，四异丙氧基硅烷和四苯氧基硅烷中的至少一种化合物。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007327983A

公开(公告)日：2007-12-20

申请号：JP2006156792

申请日：2006-06-06

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： NAKAJIMA HIROMITSU ,  SAITO AKIO ,  HARADA KENTARO ,  NISHIMURA YUKIO ,  NAKAGAWA DAIKI

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which gives a good pattern profile, excels in focal depth, and is used for liquid immersion lithography by which irradiation with a radiation is carried out through a liquid for liquid immersion lithography having a higher refractive index than air at a wavelength of 193 nm, and in which materials elute in a small amount into the liquid for liquid immersion lithography such as water with which the composition contacts in liquid immersion lithography. SOLUTION: The radiation-sensitive resin composition is used for a resist pattern forming method including liquid immersion lithography by which irradiation with a radiation is carried out through a liquid for liquid immersion lithography between a lens and a photoresist film, and contains a resin (A) and at least one radiation-sensitive acid generator (B) represented by formulae (1) and (2), wherein R 1 is H; R 2 is alkoxyl; X is butylene; and each R 4 and R 5 are fluoroalkyl. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种辐射敏感的树脂组合物，其具有良好的图案轮廓，优异的焦深，并且用于液浸光刻，其中通过用于液浸的液体进行辐射照射 平版印刷术具有比193nm波长的空气更高的折射率，并且其中材料少量浸入用于液浸光刻的液体中，例如在液浸光刻中组合物接触的水。 解决方案：辐射敏感性树脂组合物用于包括液浸光刻的抗蚀剂图案形成方法，通过该液浸光刻法，通过透镜和光致抗蚀剂膜之间的液浸光刻用液体进行辐射照射，并且包含 树脂（A）和由式（1）和（2）表示的至少一种辐射敏感性酸产生剂（B），其中R 1 为H; R 2是烷氧基; X是丁烯; 并且每个R“SP”4 和R 5 是氟代烷基。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2001011392A

公开(公告)日：2001-01-16

申请号：JP18263499

申请日：1999-06-29

Applicant: JSR CORP

Inventor： YAMADA KINJI ,  SUGITA HIKARI ,  HAYASHI EIJI ,  SAITO AKIO ,  OTA YOSHIHISA

IPC: C08K5/057 ,  C08L101/06 ,  C08L101/08 ,  C09D7/12 ,  C09D201/06

Abstract: PROBLEM TO BE SOLVED: To obtain a strippable film-forming composition that gives a cured film easily removable e.g. with an alkali solution and is useful e.g. for protective coat to be obtained through heating coating film applied to a substrate by including a metal alkoxide and a polymer compound having at least one carboxylic group or the like. SOLUTION: This composition comprises (A) a metal alkoxide such as an aluminum alkoxide (e.g. aluminum butoxide, etc.), and (B) a polymer compound (e.g. a polyacrylate, a polyester, a polyamide, etc.), having at least one carboxylic group and/or acid anhydride group which has an acid value of 60-200 mg/g. The content ratio of the ingredient A to the ingredient B preferably is (10:90) to (70:30). The ingredient B preferably is a copolymer obtained by copolymerizing a carboxylic acid and/or its anhydride with a comonomer except a carboxylic acid and/or its anhydride.

公开(公告)号：JP2003043679A

公开(公告)日：2003-02-13

申请号：JP2001232347

申请日：2001-07-31

Applicant: Jsr Corp ,  ジェイエスアール株式会社

Inventor： KAI TOSHIYUKI ,  SAITO AKIO

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in roughness, etching resistance, sensitivity and resolution and capable of stably forming a fine pattern with a high degree of accuracy. SOLUTION: The radiation sensitive resin composition contains a radiation sensitive acid generator such as 2,4,6-trimethylphenyldiphenylsulfonium 2,4- difluorobenzenesulfonate or bis(4-t-butylphenyl)iodonium 2,4- difluorobenzenesulfonate, an alkali-insoluble or slightly alkali-soluble resin having units obtained by cleaving the polymerizable unsaturated bonds of o- hydroxystyrene, m-hydroxystyrene or the like and a compound prepared by substituting a monovalent acid dissociable group for the hydrogen atom of the hydroxy group of the above compound and a dissolution accelerator having a unit obtained by cleaving the polymerizable unsaturated bond of o- hydroxystyrene, m-hydroxystyrene or the like.

Abstract translation: 要解决的问题：提供粗糙度，耐腐蚀性，灵敏度和分辨率优异的能够以高精度稳定地形成精细图案的辐射敏感性树脂组合物。 解决方案：辐射敏感性树脂组合物含有辐射敏感性酸产生剂，例如2,4,6-三甲基苯基二苯基锍2,4-二氟苯磺酸盐或双（4-叔丁基苯基）碘鎓2,4-二氟苯磺酸盐，碱不溶性或微碱性 具有通过裂解邻羟基苯乙烯，间羟基苯乙烯等的可聚合不饱和键而获得的单元的可溶性树脂和通过用上述化合物的羟基的氢原子取代一价酸解离基团和溶解促进剂制备的化合物 具有通过裂解邻羟基苯乙烯，间羟基苯乙烯等的可聚合不饱和键而获得的单元。

公开(公告)号：JP2001022083A

公开(公告)日：2001-01-26

申请号：JP19730299

申请日：1999-07-12

Applicant: JSR CORP

Inventor： NISHIKAWA MICHINORI ,  SUGITA HIKARI ,  KAWABE KENICHI ,  YAMADA KINJI ,  SAITO AKIO ,  OTA YOSHIHISA

IPC: H01L21/027 ,  G03F7/004 ,  G03F7/075 ,  G03F7/11

Abstract: PROBLEM TO BE SOLVED: To obtain a composition for an underlayer film of a resist excellent in adhesion to the resist and resistance to a developing solution and less liable to reduce film thickness in the oxygen ashing of the resist. SOLUTION: The composition contains (A) a hydrolyzate and/or a condensation product of a compound of the formula R1aSi(OR2)4-a [where R1 is H, F or a monovalent organic group, R2 is a monovalent organic group and (a) is 0-2] or the formula R3b(R4O)3-bSi-(R7)d-Si(OR5)3-cR6c [where R3-R6 are each a monovalent organic group, (b) and (c) are each 0-2, R7 is 0 or -(CH2)n-, (d) is 0 or 1 and (n) is 1-6], (B) a solvent of the formula R8O(CHCH3CH2O)cR9 [where R8 and R9 are each H, 1-4C alkyl or CH3CO- and (e) is 1-2] and (C) a compound which generates an acid when irradiated with light and/or heated.

公开(公告)号：JP2000347415A

公开(公告)日：2000-12-15

申请号：JP15867299

申请日：1999-06-04

Applicant: JSR CORP

Inventor： YAMADA KINJI ,  SUGITA HIKARI ,  NISHIKAWA MICHINORI ,  SAITO AKIO ,  OTA YOSHIHISA

IPC: H01L21/027 ,  C08K5/54 ,  C08K5/541 ,  C08L83/04 ,  G03F7/075 ,  G03F7/11

Abstract: PROBLEM TO BE SOLVED: To obtain a composition for an underlayer film of resist having both adhesiveness to a resist and resistance to a resist developer and further having resistance to oxygen ashing when the resist is removed by incorporating a hydrolysate of a specific compound and its condensate or any of them and at least one of other specific compounds in the composition. SOLUTION: A hydrolysate of compound shown by the formula R1aSi(OR2)4-a and its condensate or any of them and at least one of the compound shown by the formula R23SiQ are incorporated in this composition. In the formulae, R1 is hydrogen atom or fluorine atom or a univalent organic group; R2 is a univalent organic group; (a) is an integer of 0-2; Q is any one selected from the group consisting of a chlorine atom, -OR3, -OSiR33, -NHSiR33, -NHCONHSiR33 and -OC(CH3)=NSiR33 (wherein R3 is a univalent organic group).