1.
    发明专利
    未知

    公开(公告)号:DE69807760T2

    公开(公告)日:2003-08-14

    申请号:DE69807760

    申请日:1998-01-26

    Applicant: JSR CORP

    Abstract: A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

    2.
    发明专利
    未知

    公开(公告)号:DE69807760D1

    公开(公告)日:2002-10-17

    申请号:DE69807760

    申请日:1998-01-26

    Applicant: JSR CORP

    Abstract: A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

    3.
    发明专利
    未知

    公开(公告)号:DE69522786T2

    公开(公告)日:2002-05-23

    申请号:DE69522786

    申请日:1995-12-05

    Applicant: JSR CORP

    Abstract: A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.

    5.
    发明专利
    未知

    公开(公告)号:DE69941954D1

    公开(公告)日:2010-03-11

    申请号:DE69941954

    申请日:1999-06-25

    Applicant: JSR CORP

    Abstract: Oxetane compounds represented by general formula (1), which are excellent in radical polymerizability and cationic polymerizability and in compatibility and copolymerizability with other copolymerizable monomers; a process for producing the compounds; and an oxetane copolymer which is excellent in compatibility among the monomer units and has a low water absorption and excellent transparency. ÄIn general formula (1), substituent R is hydrogen, alkyl, fluorine, fluoroalkyl, allyl, aryl, furyl, or thienyl; substituents R , R , and R each independently is hydrogen or C1-6 alkyl; and m and n each is an integer of 1 to 10 (provided that not all of R , R , and R are hydrogen)Ü.

    6.
    发明专利
    未知

    公开(公告)号:DE69913884T2

    公开(公告)日:2004-12-09

    申请号:DE69913884

    申请日:1999-06-17

    Applicant: JSR CORP

    Abstract: Disclosed is a photo-curable composition comprising the following components (A) to (C): (A) hydrolyzable silane compound represented by the general formula (1) or a hydrolyzate thereof: (R )pSi(X)4-p (1) wherein R is a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 0 to 3; (B) photo acid generator; and (C) dehydrating agent. By such constitution, it is possible to provide a photo-curable composition which has a rapid photo-curable rate, is excellent in characteristics such as storage stability, heat resistance, weather-ability, scratch resistance and the like, and is applicable to base materials having low heat resistance such as plastics, as well as a cured product obtained therefrom.

    7.
    发明专利
    未知

    公开(公告)号:DE69913884D1

    公开(公告)日:2004-02-05

    申请号:DE69913884

    申请日:1999-06-17

    Applicant: JSR CORP

    Abstract: Disclosed is a photo-curable composition comprising the following components (A) to (C): (A) hydrolyzable silane compound represented by the general formula (1) or a hydrolyzate thereof: (R )pSi(X)4-p (1) wherein R is a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer of 0 to 3; (B) photo acid generator; and (C) dehydrating agent. By such constitution, it is possible to provide a photo-curable composition which has a rapid photo-curable rate, is excellent in characteristics such as storage stability, heat resistance, weather-ability, scratch resistance and the like, and is applicable to base materials having low heat resistance such as plastics, as well as a cured product obtained therefrom.

    8.
    发明专利
    未知

    公开(公告)号:DE69522786D1

    公开(公告)日:2001-10-25

    申请号:DE69522786

    申请日:1995-12-05

    Abstract: A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.

    HEAT-CONDUCTIVE SHEET, METHOD FOR PRODUCING HEAT- CONDUCTIVE SHEET AND RADIATING STRUCTURE USING HEAT- CONDUCTIVE SHEET

    公开(公告)号:JP2001294676A

    公开(公告)日:2001-10-23

    申请号:JP2000112043

    申请日:2000-04-13

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a heat-conductive sheet which has high anisotropic heat conductivity in the thickness direction, can efficiently release heat from heat generators such as semiconductor elements or semiconductor packages, has excellent heat resistance, durability and mechanical strength, and has excellent adhesivity to the heat generators. SOLUTION: This heat-conductive sheet is characterized in that carbon fibers are disposed in the thickness direction and exposed to the surface of the sheet or contained in a binder in an exposable state and in that magnets and the carbon fibers are disposed in the cured or semi-cured binder in the thickness direction of the heat-conductive sheet. The method for producing the heat- conductive sheet, is characterized by forming a composition for the heat- conductive sheet in a sheet-like shape, and then applying a magnetic field to the composition in the thickness direction of the sheet-like composition to orient the magnetic layer-coated carbon fibers in the thickness direction of the sheet- like composition and simultaneously cure or semi-cure the sheet-like composition.

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