Abstract:
A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.
Abstract:
The object of the present invention is to provide a polymeric material without odors or fuming and with reduced stickiness of the worked surface of material for seals and workability during laser processing, and the flexographic printing plate and sealing material made of the polymeric material having excellent characteristics of laser processing and having sufficient carving depth. The polymeric material of the present invention is characterized in that the polymeric material is made by crosslinking a polymer composition comprising a polymer which contains an ethylene unit as a repeating unit in content of 45% or more by mass and an organic peroxide. Another object of the present invention is to provide a laminated body for laser processing with excellent workability upon laser processing and a flexographic printing plate with excellent printing performance and workability and a method for fabricating the same. The laminated body for laser processing of the present invention comprises a polymer layer for laser processing which is fabricated by crosslinking a polymer composition containing an ethylenic copolymer, and a base layer laminated on one of the surfaces of the polymer layer for laser processing, whereby peeling the polymer layer for laser processing from the base layer at the interface.
Abstract:
A positively photosensitive insulating resin composition characterized by containing at least (A) an alkali-soluble resin having phenolic hydroxy groups, (B) a compound having a quinonediazide group, (C) fine crosslinking particles, (D) a compound having per molecule at least two amino groups into which an alkyl ether group has been incorporated, and (F) a solvent. The positively photosensitive insulating resin composition is excellent in resolution, electrical insulating properties, and thermal shock resistance. Also provided is a cured object characterized by being obtained by curing the positively photosensitive insulating resin composition. The cured object has satisfactory adhesion.
Abstract:
Photosensitive resin composition comprises particulate copolymer, photopolymerizable unsaturated monomer and at least one initiator. A photosensitive resin composition comprises: (1) a particulate copolymer; (2) a photopolymerizable unsaturated monomer; and (3) at least one photopolymerization initiator selected from compounds of formula (I) and (II). [Image] X and Y : H, halogen, carboxyl group, 1-20C monovalent hydrocarbon group or 1-20C alkoxyl group; Z : oxygen, sulfur or a bond. The particulate copolymer comprises (mole%): (A) an aliphatic conjugated diene monomer (10 - 99.8); (B) a monomer which has one polymerizable unsaturated group and an amino group (0.1 - 30); (C) a monomer which has at least two polymerizable unsaturated groups (0.1 - 20); and (D) a copolymerizable monomer having one polymerizable unsaturated group (0 - 40). An independent claim is also included for a photosensitive resin composition which comprises 1), 2), 3) and 4) a block copolymer comprising hard and soft segments as the main components. The hard segment is a thermoplastic non-elastomeric polymer having a glass transition (Tg) not lower than 20 [deg]C. The soft segment is an aliphatic conjugated diene-based elastomeric polymer or a hydrogenated aliphatic conjugated diene-based elastomeric polymer having a Tg not higher than 10 [deg]C.
Abstract:
The object of the present invention is to provide a polymeric material without odors or fuming and with reduced stickiness of the worked surface of material for seals and workability during laser processing, and the flexographic printing plate and sealing material made of the polymeric material having excellent characteristics of laser processing and having sufficient carving depth. The polymeric material of the present invention is characterized in that the polymeric material is made by crosslinking a polymer composition comprising a polymer which contains an ethylene unit as a repeating unit in content of 45% or more by mass and an organic peroxide. Another object of the present invention is to provide a laminated body for laser processing with excellent workability upon laser processing and a flexographic printing plate with excellent printing performance and workability and a method for fabricating the same. The laminated body for laser processing of the present invention comprises a polymer layer for laser processing which is fabricated by crosslinking a polymer composition containing an ethylenic copolymer, and a base layer laminated on one of the surfaces of the polymer layer for laser processing, whereby peeling the polymer layer for laser processing from the base layer at the interface.
Abstract:
Photosensitive resin composition comprises particulate copolymer, photopolymerizable unsaturated monomer and at least one initiator. A photosensitive resin composition comprises: (1) a particulate copolymer; (2) a photopolymerizable unsaturated monomer; and (3) at least one photopolymerization initiator selected from compounds of formula (I) and (II). [Image] X and Y : H, halogen, carboxyl group, 1-20C monovalent hydrocarbon group or 1-20C alkoxyl group; Z : oxygen, sulfur or a bond. The particulate copolymer comprises (mole%): (A) an aliphatic conjugated diene monomer (10 - 99.8); (B) a monomer which has one polymerizable unsaturated group and an amino group (0.1 - 30); (C) a monomer which has at least two polymerizable unsaturated groups (0.1 - 20); and (D) a copolymerizable monomer having one polymerizable unsaturated group (0 - 40). An independent claim is also included for a photosensitive resin composition which comprises 1), 2), 3) and 4) a block copolymer comprising hard and soft segments as the main components. The hard segment is a thermoplastic non-elastomeric polymer having a glass transition (Tg) not lower than 20 [deg]C. The soft segment is an aliphatic conjugated diene-based elastomeric polymer or a hydrogenated aliphatic conjugated diene-based elastomeric polymer having a Tg not higher than 10 [deg]C.
Abstract:
A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that has excellent flame retardancy and provides a cured film having excellent adhesiveness to both of a resin such as a polyimide resin and a metal such as copper, a polymer favorably used in the resin composition, a cured film obtained from the resin composition and a printed-wiring board having the cured film. SOLUTION: The resin composition includes a component (A) comprising a structural unit (a1) derived from a phosphorus-containing group-containing ethylenic unsaturated monomer and a structural unit (a2) derived from a conjugated diene-based monomer and a component (B) comprising a solvent. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming an adhesive layer having excellent electrical characteristics such as low dielectric constant and low dielectric loss while having sufficient adhesive strength and heat resistance. SOLUTION: The adhesive composition comprises (A) a copolymer, (B) a thermosetting resin and (C) a curing agent. (A) The copolymer includes (a-1) a structural unit derived from a monomer having at least two ethylenically polymerizable unsaturated groups, (a-2) a structural unit derived from a monomer having an alcoholic hydroxy group and (a-3) a structural unit derived from at least one kind selected from the group consisting of styrene, a styrene derivative, (meth)acrylic acid and an acrylic or a methacrylic acid derivative. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a cured product exhibiting low dielectric constant and low dielectric loss and having excellent insulating properties and excellent thermal shock resistance and to provide a thermosetting resin composition affording the cured product. SOLUTION: The thermosetting resin composition comprises (A) an epoxy resin, (B) a styrene-butadiene copolymer having at least one kind of functional group selected from a carboxy group, a hydroxy group and an epoxy group and (C) a curing agent and/or a curing catalyst. COPYRIGHT: (C)2006,JPO&NCIPI