1.
    发明专利
    未知

    公开(公告)号:DE69522786T2

    公开(公告)日:2002-05-23

    申请号:DE69522786

    申请日:1995-12-05

    Applicant: JSR CORP

    Abstract: A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.

    2.
    发明专利
    未知

    公开(公告)号:DE60124342D1

    公开(公告)日:2006-12-21

    申请号:DE60124342

    申请日:2001-06-19

    Applicant: JSR CORP

    Abstract: The object of the present invention is to provide a polymeric material without odors or fuming and with reduced stickiness of the worked surface of material for seals and workability during laser processing, and the flexographic printing plate and sealing material made of the polymeric material having excellent characteristics of laser processing and having sufficient carving depth. The polymeric material of the present invention is characterized in that the polymeric material is made by crosslinking a polymer composition comprising a polymer which contains an ethylene unit as a repeating unit in content of 45% or more by mass and an organic peroxide. Another object of the present invention is to provide a laminated body for laser processing with excellent workability upon laser processing and a flexographic printing plate with excellent printing performance and workability and a method for fabricating the same. The laminated body for laser processing of the present invention comprises a polymer layer for laser processing which is fabricated by crosslinking a polymer composition containing an ethylenic copolymer, and a base layer laminated on one of the surfaces of the polymer layer for laser processing, whereby peeling the polymer layer for laser processing from the base layer at the interface.

    4.
    发明专利
    未知

    公开(公告)号:DE60012401T2

    公开(公告)日:2005-07-28

    申请号:DE60012401

    申请日:2000-04-20

    Applicant: JSR CORP

    Abstract: Photosensitive resin composition comprises particulate copolymer, photopolymerizable unsaturated monomer and at least one initiator. A photosensitive resin composition comprises: (1) a particulate copolymer; (2) a photopolymerizable unsaturated monomer; and (3) at least one photopolymerization initiator selected from compounds of formula (I) and (II). [Image] X and Y : H, halogen, carboxyl group, 1-20C monovalent hydrocarbon group or 1-20C alkoxyl group; Z : oxygen, sulfur or a bond. The particulate copolymer comprises (mole%): (A) an aliphatic conjugated diene monomer (10 - 99.8); (B) a monomer which has one polymerizable unsaturated group and an amino group (0.1 - 30); (C) a monomer which has at least two polymerizable unsaturated groups (0.1 - 20); and (D) a copolymerizable monomer having one polymerizable unsaturated group (0 - 40). An independent claim is also included for a photosensitive resin composition which comprises 1), 2), 3) and 4) a block copolymer comprising hard and soft segments as the main components. The hard segment is a thermoplastic non-elastomeric polymer having a glass transition (Tg) not lower than 20 [deg]C. The soft segment is an aliphatic conjugated diene-based elastomeric polymer or a hydrogenated aliphatic conjugated diene-based elastomeric polymer having a Tg not higher than 10 [deg]C.

    5.
    发明专利
    未知

    公开(公告)号:DE60124342T2

    公开(公告)日:2007-05-31

    申请号:DE60124342

    申请日:2001-06-19

    Applicant: JSR CORP

    Abstract: The object of the present invention is to provide a polymeric material without odors or fuming and with reduced stickiness of the worked surface of material for seals and workability during laser processing, and the flexographic printing plate and sealing material made of the polymeric material having excellent characteristics of laser processing and having sufficient carving depth. The polymeric material of the present invention is characterized in that the polymeric material is made by crosslinking a polymer composition comprising a polymer which contains an ethylene unit as a repeating unit in content of 45% or more by mass and an organic peroxide. Another object of the present invention is to provide a laminated body for laser processing with excellent workability upon laser processing and a flexographic printing plate with excellent printing performance and workability and a method for fabricating the same. The laminated body for laser processing of the present invention comprises a polymer layer for laser processing which is fabricated by crosslinking a polymer composition containing an ethylenic copolymer, and a base layer laminated on one of the surfaces of the polymer layer for laser processing, whereby peeling the polymer layer for laser processing from the base layer at the interface.

    6.
    发明专利
    未知

    公开(公告)号:DE60012401D1

    公开(公告)日:2004-09-02

    申请号:DE60012401

    申请日:2000-04-20

    Applicant: JSR CORP

    Abstract: Photosensitive resin composition comprises particulate copolymer, photopolymerizable unsaturated monomer and at least one initiator. A photosensitive resin composition comprises: (1) a particulate copolymer; (2) a photopolymerizable unsaturated monomer; and (3) at least one photopolymerization initiator selected from compounds of formula (I) and (II). [Image] X and Y : H, halogen, carboxyl group, 1-20C monovalent hydrocarbon group or 1-20C alkoxyl group; Z : oxygen, sulfur or a bond. The particulate copolymer comprises (mole%): (A) an aliphatic conjugated diene monomer (10 - 99.8); (B) a monomer which has one polymerizable unsaturated group and an amino group (0.1 - 30); (C) a monomer which has at least two polymerizable unsaturated groups (0.1 - 20); and (D) a copolymerizable monomer having one polymerizable unsaturated group (0 - 40). An independent claim is also included for a photosensitive resin composition which comprises 1), 2), 3) and 4) a block copolymer comprising hard and soft segments as the main components. The hard segment is a thermoplastic non-elastomeric polymer having a glass transition (Tg) not lower than 20 [deg]C. The soft segment is an aliphatic conjugated diene-based elastomeric polymer or a hydrogenated aliphatic conjugated diene-based elastomeric polymer having a Tg not higher than 10 [deg]C.

    7.
    发明专利
    未知

    公开(公告)号:DE69522786D1

    公开(公告)日:2001-10-25

    申请号:DE69522786

    申请日:1995-12-05

    Abstract: A photosensitive resin composition is provided which is excellent in water developability, impact resilience, resin plate strength after exposure, breaking extension, and resin-plate transparency. The composition comprises: (1) a granular copolymer produced by polymerizing a monomer mixture comprising: (i) an aliphatic conjugated diene monomer; (ii) a monomer expressed by the general formula (I): (in which R represents a hydrogen atom or a methyl group, R represents an alkylene group having a carbon number of 3 to 20, and l represents an integer of 1 to 20); (iii) a monomer having at least two addition-polymerizable groups, and (iv) an addition-polymerizable monomer other than (i), (ii) and (iii), if desirable; (2) a photo-polymerizable unsaturated monomer; (3) an amino group-containing compound, and (4) a photo-polymerization initiator.

    Resin composition, cured film, polymer and printed-wiring board
    8.
    发明专利
    Resin composition, cured film, polymer and printed-wiring board 有权
    树脂组合物,固化膜,聚合物和印刷线路板

    公开(公告)号:JP2011105837A

    公开(公告)日:2011-06-02

    申请号:JP2009261594

    申请日:2009-11-17

    Abstract: PROBLEM TO BE SOLVED: To provide a resin composition that has excellent flame retardancy and provides a cured film having excellent adhesiveness to both of a resin such as a polyimide resin and a metal such as copper, a polymer favorably used in the resin composition, a cured film obtained from the resin composition and a printed-wiring board having the cured film. SOLUTION: The resin composition includes a component (A) comprising a structural unit (a1) derived from a phosphorus-containing group-containing ethylenic unsaturated monomer and a structural unit (a2) derived from a conjugated diene-based monomer and a component (B) comprising a solvent. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 解决问题的方案为了提供阻燃性优异的树脂组合物,提供对聚酰亚胺树脂等树脂和铜等金属具有优异的粘附性的固化膜,优选在树脂中使用的聚合物 组合物,由树脂组合物获得的固化膜和具有固化膜的印刷线路板。 解决方案:树脂组合物包括由含有含磷基团的烯属不饱和单体衍生的结构单元(a1)和由共轭二烯系单体衍生的结构单元(a2)的组分(A)和 组分(B)包含溶剂。 版权所有(C)2011,JPO&INPIT

    Adhesive composition and substrate for flexible printed wiring board
    9.
    发明专利
    Adhesive composition and substrate for flexible printed wiring board 审中-公开
    柔性印刷电路板的胶粘组合物和基材

    公开(公告)号:JP2008081678A

    公开(公告)日:2008-04-10

    申请号:JP2006265972

    申请日:2006-09-28

    Inventor: NISHIOKA TAKASHI

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming an adhesive layer having excellent electrical characteristics such as low dielectric constant and low dielectric loss while having sufficient adhesive strength and heat resistance. SOLUTION: The adhesive composition comprises (A) a copolymer, (B) a thermosetting resin and (C) a curing agent. (A) The copolymer includes (a-1) a structural unit derived from a monomer having at least two ethylenically polymerizable unsaturated groups, (a-2) a structural unit derived from a monomer having an alcoholic hydroxy group and (a-3) a structural unit derived from at least one kind selected from the group consisting of styrene, a styrene derivative, (meth)acrylic acid and an acrylic or a methacrylic acid derivative. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供能够形成具有优异的电特性如低介电常数和低介电损耗的粘合剂层的粘合剂组合物,同时具有足够的粘合强度和耐热性。 粘合剂组合物包含(A)共聚物,(B)热固性树脂和(C)固化剂。 (A)共聚物包含(a-1)来自具有至少两个烯键式聚合性不饱和基团的单体的结构单元,(a-2)来自具有醇羟基的单体的结构单元和(a-3) 衍生自苯乙烯,苯乙烯衍生物,(甲基)丙烯酸和丙烯酸或甲基丙烯酸衍生物中的至少一种的结构单元。 版权所有(C)2008,JPO&INPIT

    Thermosetting resin composition and cured product thereof
    10.
    发明专利
    Thermosetting resin composition and cured product thereof 审中-公开
    热固性树脂组合物及其固化产品

    公开(公告)号:JP2006137791A

    公开(公告)日:2006-06-01

    申请号:JP2004326288

    申请日:2004-11-10

    Abstract: PROBLEM TO BE SOLVED: To provide a cured product exhibiting low dielectric constant and low dielectric loss and having excellent insulating properties and excellent thermal shock resistance and to provide a thermosetting resin composition affording the cured product.
    SOLUTION: The thermosetting resin composition comprises (A) an epoxy resin, (B) a styrene-butadiene copolymer having at least one kind of functional group selected from a carboxy group, a hydroxy group and an epoxy group and (C) a curing agent and/or a curing catalyst.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供具有低介电常数和低介电损耗并且具有优异的绝缘性能和优异的耐热冲击性的固化产物,并提供提供固化产物的热固性树脂组合物。 解决方案:热固性树脂组合物包含(A)环氧树脂,(B)具有至少一种选自羧基,羟基和环氧基的官能团的苯乙烯 - 丁二烯共聚物和(C) 固化剂和/或固化催化剂。 版权所有(C)2006,JPO&NCIPI

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