ANISOTROPIC ELECTROCONDUCTIVE SHEET

    公开(公告)号:JP2002056719A

    公开(公告)日:2002-02-22

    申请号:JP2000240859

    申请日:2000-08-09

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic electroconductive sheet which shows an electroconductivity in a state without any pressure and in the pressurized state by a small force in a thickness direction and which shows a higher electroconductivity in a pressurized state by a large force in a thickness direction than that in the state without any pressure and in the pressurized state by a small force in a thickness direction. SOLUTION: This anisotropic electroconductive sheet comprises a sheet substrate composed of elastomer, electroconductive fibers arranged to extend in a thickness direction in this sheet substrate, and electroconductive particles to show contained magnetism in a state orienting in the thickness direction in the sheet substrate.

    INSPECTION DEVICE
    2.
    发明专利

    公开(公告)号:JPH11329646A

    公开(公告)日:1999-11-30

    申请号:JP13352298

    申请日:1998-05-15

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To exert uniform pressure on each terminal of an object to be tested without causing undesired shearing force to act thereon, by making up a testing device out of a rotary member, a press-member support body for pressing a surface of the object to be tested rockably provided on the rotary member, and a guide member for allowing relative movement of the press-member support body. SOLUTION: With a turning plate 14 inverted, a semiconductor element 26 is mounted in an opening part of a positioning member 24. The turning plate 14 is pushed in the direction of an arrow L against energizing force of a coil spring 40 by an opening/closing operation member 4, and the turning plate 14, following a guide member 12, makes turning motion from its inverted state in the direction that approaches the positioning member 24. A press-member support body 16 rotates while being guided by a guide hole 12a in the guide member 12. When the turning plate 14 makes further turning motion, an end face of the press-member support body 16 becomes vertical to the turning locus of the center of the turning plate 14 by being guided by the guide hole 12a of the guide member 12, and as a result, the surface of a pressing part 34a of a pressing body 34 becomes parallel to a pressed surface of a semiconductor element 26.

    Solder resistant gold composition and its application
    3.
    发明专利
    Solder resistant gold composition and its application 审中-公开
    耐焊锡金组合物及其应用

    公开(公告)号:JP2006063399A

    公开(公告)日:2006-03-09

    申请号:JP2004247938

    申请日:2004-08-27

    Inventor: SEDAKA RYOJI

    Abstract: PROBLEM TO BE SOLVED: To provide a solder resistant gold composition which has satisfactory conductivity, and whose deterioration caused by solder does not occur or is reduced, and to provide its application. SOLUTION: The solder resistant gold composition is obtained by incorporating silicon and/or germanium into gold or a gold alloy, and in which the ratio between gold and the total of silicon and germanium is 97:3 to 70:30 by an atomic ratio. Conductive grains according to this invention are obtained by forming a conductive film composed of the above solder resistant gold composition on the surface of each core grain exhibiting magnetism. Regarding an anisotropic conductive sheet according to this invention, in an anisotropic conductive sheet in which a plurality of conductive path forming parts elongating to the thickness direction, respectively are mutually insulated by insulating parts, the respective conductive path forming parts are incorporated into an elastic high polymer substance in a state where the conductive grains are orientated so as to be arranged in the thickness direction. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供具有令人满意的导电性并且由焊料引起的劣化不会发生或减少的耐焊锡金组合物并提供其应用。

    解决方案:通过将硅和/或锗掺入金或金合金中获得耐焊锡金组合物,其中金与硅和锗的总量之比为97:3至70:30,由 原子比。 根据本发明的导电性颗粒通过在表现出磁性的每个核心颗粒的表面上形成由上述阻焊金组合物构成的导电膜而获得。 对于根据本发明的各向异性导电片,在其中沿着厚度方向延伸的多个导电路径形成部分别分别由绝缘部分相互绝缘的各向异性导电片中,各个导电路径形成部分被并入弹性高 聚合物物质,其中导电颗粒被定向成在厚度方向上排列。 版权所有(C)2006,JPO&NCIPI

    ANISOTROPIC CONDUCTIVE SHEET
    4.
    发明专利

    公开(公告)号:JP2002075063A

    公开(公告)日:2002-03-15

    申请号:JP2000252470

    申请日:2000-08-23

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic conductive sheet showing conductivity in the non-pressure state or in the state pressurized by a small force in the perpendicular direction, and higher conductivity in the state pressurized by a large force in the perpendicular direction than in the non-pressure state or the state pressurized by a small force in the perpendicular direction. SOLUTION: An anisotropic conductive sheet is composed of a conductive elastomer and provided with projections on one surface at least. The conductive elastomer formed by dispersing a conductive imparted substance in insulating elastomer can be used. It is desirable that the volume resistivity of the conductive elastomer is 1×107-1×1012 Ω.m.

    Anisotropic conductivity connector, probe member, wafer inspection device and wafer inspection method
    5.
    发明专利
    Anisotropic conductivity connector, probe member, wafer inspection device and wafer inspection method 有权
    各向异性电阻连接器,探头组件,检波器检测和波形检测方法

    公开(公告)号:JP2004095548A

    公开(公告)日:2004-03-25

    申请号:JP2003289034

    申请日:2003-08-07

    Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic conductive connector in which alignment, retaining and fixing is easy even when the pitch of an electrode to be connected to is small and in which good conductivity is maintained over a long period of time even when repeatedly used in an environment of high temperature and its application. SOLUTION: In the connector, a frame plate with a plurality of anisotropic conductive film installation holes formed adapting to a range of an electrode on which wafer inspection is carried out and an elastic anisotropic conductive film installed inside each anisotropic conductive film installation hole and supported by the surrounding parts are provided. In each anisotropic conductive film, a functional part formed by elastic high polymer substance and installed corresponding to the electrode to be inspected consisting of a plurality of conductors extending in the thickness direction in which conductive particle indicating magnetism are densly contained and an insulatign part insulating these from each other, a part to be supported formed on the peripheral edge of the functional part and fixed to the peripheral part of the hole for installation of anisotropic conductive film are provided. The elastic high polymer substance is attaching type hardened liquefied silicone and 150°C permanent compressive strain is 10% or less. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:为了提供一种各向异性导电连接器,其中即使当要连接的电极的间距小并且长时间保持良好的导电性时,即使在即使是长时间保持良好的导电性的情况下,对准,保持和固定也是容易的 当在高温环境中重复使用及其应用时。 解决方案:在连接器中,具有多个各向异性导电膜安装孔的框架板,其适合于进行晶片检查的电极的范围,以及安装在每个各向异性导电膜安装孔内的弹性各向异性导电膜 并提供周边部件的支撑。 在每个各向异性导电膜中,由弹性高分子物质形成的功能部件,与要检查的电极相对应地安装,所述功能部件由沿着厚度方向延伸的多个导体构成,导电粒子指示磁性密集地包含在内,绝缘部分将这些 另外,在功能部的周缘部形成有被支撑的部分,并固定在各向异性导电膜的安装用孔的周缘部。 弹性高分子物质为附着型硬化液化硅,150℃永久压缩应变为10%以下。 版权所有(C)2004,JPO

    HEAT-CONDUCTIVE SHEET AND APPLICATION THEREOF

    公开(公告)号:JP2001284859A

    公开(公告)日:2001-10-12

    申请号:JP2000098943

    申请日:2000-03-31

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a heat-conductive sheet to meet heat-radiation and heat- transfer requirements for various electric apparatus, electronic apparatus, power generator and the like. SOLUTION: The heat conductive sheet comprises binder, magnetic body, and carbon fiber. The magnetic body and the carbon fiber are oriented in thickness direction of the heat-conductive sheet within the binder. Related to a heat- radiation structure, a high temperature part is jointed to a heat radiation part through the heat conductive sheet. Further, the heat conductive sheet stays on the surface of the high temperature part.

    HEAT TRANSFER SHEET AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:JP2001274302A

    公开(公告)日:2001-10-05

    申请号:JP2000088952

    申请日:2000-03-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a heat transfer sheet which can transfer heat with high efficiency and further has insulating properties, and a method which can manufacture readily such a heat transfer sheet. SOLUTION: This heat transfer sheet contains insulating heat transfer particles indicating a magnetism in a sheet base in which both surfaces are flat, and which is composed of an insulating polymer material having flexibility, in a state that the heat transfer particles are orientated in the thickness direction of the sheet base. This method for manufacturing the heat transfer sheet comprises the steps of forming a sheet molding material layer containing insulating heat transfer particles indicating a magnetism in a polymer forming material as an insulating polymer material having flexibility by curing, and acting a magnetic field on this sheet molding material layer in the thickness direction, and also curing the sheet molding material layer.

    INSPECTION DEVICE
    9.
    发明专利

    公开(公告)号:JP2001124823A

    公开(公告)日:2001-05-11

    申请号:JP30754399

    申请日:1999-10-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To make easily changeable the pressing force being applied to an object to be inspected according to the number of terminals of the object to be inspected. SOLUTION: A pressing member supporting body 16 for supporting a pressing body 34 so as to be capable of swinging is detachably supported on a rotating plate 14 with a supporting shaft 30.

    INSPECTION DEVICE
    10.
    发明专利

    公开(公告)号:JP2000206184A

    公开(公告)日:2000-07-28

    申请号:JP797699

    申请日:1999-01-14

    Applicant: JSR CORP NEC CORP

    Abstract: PROBLEM TO BE SOLVED: To enable an inspection device to apply a pressure uniformly to each terminal of an object to be inspected, without deteriorating the operability even when the number of terminals of a semiconductor device is comparatively increased. SOLUTION: This inspection device is equipped with an operation frame member 12 having an inclined plane parts (12F) and (12E), and a spring case 16 which has roller 16Da and 16Db engaging with the inclined plane parts (12F) and (12E) and accommodates a coil spring (40). In accordance with operation of the operation frame member 12, the spring case 16 is moved downward. Thereby, the coil spring (40) is deflected, and a semiconductor device (38) is pressed by the elastic force of the coil spring (40).

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