公开(公告)号：DE69325480T2

公开(公告)日：2000-03-30

申请号：DE69325480

申请日：1993-07-23

Applicant: JSR CORP

Inventor： SANO KIMIYASU ,  ENDO MASAYUKI ,  SHIMADA ATSUFUMI ,  YOKOYAMA YASUAKI ,  BESSHO NOBUO

IPC: C08G81/00 ,  C08F2/50 ,  C08F220/04 ,  C08F220/32 ,  C08F222/04 ,  H05K3/28 ,  C08F291/10

Abstract: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided epoxy-group containing radiation sensitive resin composition which contains a component (A) obtained from (a), (b) and (c) and optionally (d), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.