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    COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID
    1.
    发明专利
    COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID 未知

    公开(公告)号：AU2003234794A1

    公开(公告)日：2003-11-11

    申请号：AU2003234794

    申请日：2003-05-12

    Applicant: JSR CORP

    Inventor： HANAMURA MASAAKI ,  YOKOYAMA YASUAKI ,  BESSHO NOBUO

    IPC: B24B37/04 ,  B24B45/00 ,  C09J11/00 ,  C09J201/00 ,  C09J5/00 ,  C09J7/00 ,  H01L21/304 ,  H01L21/301

    Abstract: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.

    PHOTOCURING RESIN COMPOSITION, MEDICAL DEVICE USING SAME AND METHOD FOR MANUFACTURING SAME
    6.
    发明专利
    PHOTOCURING RESIN COMPOSITION, MEDICAL DEVICE USING SAME AND METHOD FOR MANUFACTURING SAME 未知

    公开(公告)号：AU2003302411A1

    公开(公告)日：2004-06-18

    申请号：AU2003302411

    申请日：2003-11-13

    Applicant: JSR CORP

    Inventor： YASUDA KYOUYU ,  YOKOYAMA YASUAKI ,  BESSHO NOBUO

    IPC: G03F7/038 ,  C08L1/00 ,  A61L29/08 ,  A61L31/10 ,  C08K3/04

    Abstract: It is an object of the present invention to provide a novel photo-curing composition which can be cured by light of a wide wavelength region including ultraviolet light or visible light, has such high sensitivity that it can be sufficiently cured by exposure to a small amount of light, can favorably form a fine pattern when used as a resist and provides a cured product having excellent heat resistance and insulating properties, and a negative photoresist composition using the photo-curing composition. It is another object of the present invention to provide a process for highly accurately and easily producing a polyimide thin film used for a medical instrument, and a medical instrument having the polyimide thin film. The photo-curing composition of the present invention comprises (A) a carbon cluster and/or its derivative, having a photosensitizing function, (B) a compound having plural heterocyclic rings in a molecule, and if necessary, (C) a photo-insensitive resin.

    7.
    发明专利
    未知

    公开(公告)号：DE69325480T2

    公开(公告)日：2000-03-30

    申请号：DE69325480

    申请日：1993-07-23

    Applicant: JSR CORP

    Inventor： SANO KIMIYASU ,  ENDO MASAYUKI ,  SHIMADA ATSUFUMI ,  YOKOYAMA YASUAKI ,  BESSHO NOBUO

    IPC: C08G81/00 ,  C08F2/50 ,  C08F220/04 ,  C08F220/32 ,  C08F222/04 ,  H05K3/28 ,  C08F291/10

    Abstract: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided epoxy-group containing radiation sensitive resin composition which contains a component (A) obtained from (a), (b) and (c) and optionally (d), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

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