公开(公告)号：WO2010111575A3

公开(公告)日：2011-01-13

申请号：PCT/US2010028800

申请日：2010-03-26

Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

Inventor： MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

IPC: H01G4/12 ,  H01G4/005

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426

Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

Abstract translation: 一种多层陶瓷电容器，其具有至少一个芯片，并且具有平行隔开的关系的第一基底金属板和平行隔开的关系的第二基底金属板，其中第一板和第二板被交错。 电介质位于第一基底金属板和第二基底金属板之间，电介质具有第一热膨胀系数。 第一端接件与第一板电接触，第二端接件与第二板电接触。 引线框架连接到端子处并与其接触，其中引线框架具有第二热膨胀系数，并且第二热膨胀系数高于所述第一热膨胀系数。 引线框架是有色金属材料。

公开(公告)号：EP2411988A4

公开(公告)日：2012-08-22

申请号：EP10756898

申请日：2010-03-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

IPC: H01G4/12 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426