Abstract:
An improved overvoltage protection component is provided. The overvoltage protection component has a first internal electrode contained within a dielectric material. The first internal electrode is electrically connected to a first termination and a second internal electrode contained within the ceramic dielectric material is electrically connected to a second termination.
Abstract:
A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
Abstract:
A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
Abstract:
A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.
Abstract:
New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area, and subsequently capacitance, is lowered in this case.
Abstract:
An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.
Abstract:
A capacitor combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor results in a resistive failure when the fuse opens during an overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.
Abstract:
Es ist eine Aufgabe der Erfindung einen verbesserten mehrschichtigen Keramikkondensator (MLCC) bereitzustellen. Der Kondensator weist einen aktiven Bereich auf, der erste Schichten und zweite Schichten in abwechselnder paralleler Anordnung mit einem Dielektrikum dazwischen umfasst. Die erste Schicht umfasst eine erste aktive Elektrode und eine erste potentialfreie Elektrode in einer gemeinsamen Ebene und die zweite Schicht umfasst eine zweite aktive Elektrode und eine zweite potentialfreie Elektrode in einer zweiten gemeinsamen Ebene. Wenigstens eine Abschirmschicht ist benachbart zu einer äußersten ersten Schicht der ersten Schichten ist, wobei die Abschirmschicht einen ersten Vorsprung aufweist und die ersten Schichten einen zweiten Vorsprung aufweisen, wobei der erste Vorsprung und der zweite Vorsprung unterschiedlich sind.