公开(公告)号：WO2013009712A3

公开(公告)日：2013-06-13

申请号：PCT/US2012045975

申请日：2012-07-09

Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JOHN E ,  BULTITUDE JOHN ,  GURAV ABHIJIT

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  GURAV ABHIJIT

IPC: C04B41/88 ,  C04B35/01 ,  C04B35/64 ,  H01G4/12

CPC classification number: H01G4/30 ,  B05D3/06 ,  H01G4/1227 ,  H01G13/02 ,  H01G13/06 ,  Y10T29/43

Abstract: An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

Abstract translation: 在制造金属箔涂覆的陶瓷的方法中提供形成金属箔涂覆的陶瓷和金属箔电容器的方法，包括提供金属箔; 将陶瓷前体施加到金属箔上，其中陶瓷前体包括至少一个基座和高介电常数氧化物和有机粘合剂，并且以高强度，高脉冲频率的光能烧结陶瓷前体以形成金属箔陶瓷。

公开(公告)号：WO2010111575A3

公开(公告)日：2011-01-13

申请号：PCT/US2010028800

申请日：2010-03-26

Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

Inventor： MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

IPC: H01G4/12 ,  H01G4/005

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426

Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

Abstract translation: 一种多层陶瓷电容器，其具有至少一个芯片，并且具有平行隔开的关系的第一基底金属板和平行隔开的关系的第二基底金属板，其中第一板和第二板被交错。 电介质位于第一基底金属板和第二基底金属板之间，电介质具有第一热膨胀系数。 第一端接件与第一板电接触，第二端接件与第二板电接触。 引线框架连接到端子处并与其接触，其中引线框架具有第二热膨胀系数，并且第二热膨胀系数高于所述第一热膨胀系数。 引线框架是有色金属材料。

公开(公告)号：WO2011150263A3

公开(公告)日：2012-02-23

申请号：PCT/US2011038216

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP ,  CHACKO ANTONY P ,  MCCONNELL JOHN E ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  BULTITUDE JOHN

Inventor： CHACKO ANTONY P ,  MCCONNELL JOHN E ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  BULTITUDE JOHN

IPC: H01G9/04 ,  H01G9/012

CPC classification number: H01G9/012 ,  H01G9/0425 ,  H01G9/15 ,  Y02E60/13 ,  Y10T29/43

Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.

Abstract translation: 在阳极上具有阳极和电介质的固体电解电容器。 阴极位于电介质上，并在所述电介质上具有导电涂层。 阴极引线通过选自瞬态液相可烧结材料和聚合物焊料的粘合剂电连接到导电涂层。

公开(公告)号：EP2411988A4

公开(公告)日：2012-08-22

申请号：EP10756898

申请日：2010-03-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

IPC: H01G4/12 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426

公开(公告)号：EP2791951A4

公开(公告)日：2015-11-11

申请号：EP12858253

申请日：2012-12-10

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  WEBSTER ALAN P ,  JONES LONNIE G ,  RENNER GARRY L ,  BELL JEFFREY

IPC: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP2577694A4

公开(公告)日：2014-07-02

申请号：EP11787439

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/232 ,  H01G4/005 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

公开(公告)号：EP2923366A4

公开(公告)日：2016-08-10

申请号：EP13856305

申请日：2013-11-18

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  HILL R ALLEN ,  RENNER GARRY L

IPC: H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

CPC classification number: H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38

公开(公告)号：EP2577695A4

公开(公告)日：2014-12-03

申请号：EP11787450

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： CHACKO ANTONY P ,  MCCONNELL JOHN E ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  BULTITUDE JOHN

IPC: H01G9/012 ,  H01G9/042

CPC classification number: H01G9/012 ,  H01G9/0425 ,  H01G9/15 ,  Y02E60/13 ,  Y10T29/43