公开(公告)号：SG11201700784QA

公开(公告)日：2017-03-30

申请号：SG11201700784Q

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

IPC: H01L21/66

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：SG10201903148WA

公开(公告)日：2019-05-30

申请号：SG10201903148W

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

Abstract: REPEATER DETECTION Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the an - ay region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s). (Figure ) 38

公开(公告)号：SG11201610818XA

公开(公告)日：2017-02-27

申请号：SG11201610818X

申请日：2015-07-28

Applicant: KLA TENCOR CORP

Inventor： BARIS OKSEN T ,  BABULNATH RAGHAV

IPC: H01L21/66

Abstract: Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.