公开(公告)号：DE112015004721T5

公开(公告)日：2017-07-06

申请号：DE112015004721

申请日：2015-10-13

Applicant: KLA TENCOR CORP

Inventor： LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO ,  LUO QING ,  WU KENONG

IPC: H01L21/66

Abstract: Systeme und Verfahren zur Detektion von Defekten auf einer Probe auf Grundlage von Strukturinformation werden bereitgestellt. Ein System beinhaltet ein oder mehrere Computersubsysteme, die dazu ausgebildet sind, die von einem Detektor eines Inspektionssubsystems in einem Array-Gebiet auf einer Probe erzeugte Ausgabe in zumindest erste und zweite Segmente der Ausgabe zu trennen, auf Grundlage eines Merkmals/von Merkmalen einer Struktur/von Strukturen in dem Array-Gebiet, so dass die Ausgabe in unterschiedlichen Segmenten an unterschiedlichen Positionen in dem Array-Gebiet erzeugt worden ist, in denen die Struktur(en), die unterschiedliche Werte des Merkmals/der Merkmale haben, ausgebildet sind. Das Computersubsystem/die Computersubsysteme sind auch dazu ausgebildet, Defekte auf der Probe zu detektieren, indem sie eine oder mehrere Defektdetektionsmethoden auf die Ausgabe anwenden, abhängig davon, ob sich die Ausgabe in dem ersten Segment oder dem zweiten Segment befindet.

公开(公告)号：SG11201700784QA

公开(公告)日：2017-03-30

申请号：SG11201700784Q

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

IPC: H01L21/66

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：SG10201903148WA

公开(公告)日：2019-05-30

申请号：SG10201903148W

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

Abstract: REPEATER DETECTION Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the an - ay region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s). (Figure ) 38

公开(公告)号：SG11201702725WA

公开(公告)日：2017-04-27

申请号：SG11201702725W

申请日：2015-10-13

Applicant: KLA TENCOR CORP

Inventor： LUO QING ,  WU KENONG ,  LEE HUCHENG ,  GAO LISHENG ,  SHIFRIN EUGENE ,  SUN ALFONSO

IPC: H01L21/66

Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.