公开(公告)号：SG11201700784QA

公开(公告)日：2017-03-30

申请号：SG11201700784Q

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

IPC: H01L21/66

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

公开(公告)号：SG10201903148WA

公开(公告)日：2019-05-30

申请号：SG10201903148W

申请日：2015-08-27

Applicant: KLA TENCOR CORP

Inventor： CHEN HONG ,  WU KENONG ,  SHIFRIN EUGENE ,  YAMAOKA MASATOSHI ,  SIVARAMAN GANGADHARAN ,  BABULNATH RAGHAV ,  KURADA SATYA ,  SUN ALFONSO

Abstract: REPEATER DETECTION Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the an - ay region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s). (Figure ) 38