公开(公告)号：SG11201707200PA

公开(公告)日：2017-10-30

申请号：SG11201707200P

申请日：2015-08-19

Applicant: KLA TENCOR CORP

Inventor： HERMANS LAURENT ,  DELFOSSE ERIC ,  NIJS FRANS ,  THISSEN FRANCIS ,  DE GREEVE JOHAN

IPC: G06K9/48 ,  G06K9/62

Abstract: A method for shape classification of an object is provided. Shape categories are provided which specify a plane and points therein relative to the object, and also specify at least one limit coordinate for each such point, the limit coordinate defining a boundary in a direction normal to the plane for the shape of the object considered in order for the object to be classified into a respective shape category. The shape categories can be provided by a user, making the method very flexible. The shape categories can in particular be derived from a set of samples of objects representing a shape category to be defined. For classification, the position of a surface of the object is measured at each of the points defined in the shape category, and the result is compared with the corresponding limit coordinate.

公开(公告)号：SG187136A1

公开(公告)日：2013-02-28

申请号：SG2013004254

申请日：2011-04-12

Applicant: KLA TENCOR CORP

Inventor： MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

公开(公告)号：WO2012014092A3

公开(公告)日：2012-04-05

申请号：PCT/IB2011051572

申请日：2011-04-12

Applicant: KLA TENCOR CORP ,  MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

Inventor： MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

IPC: G01B11/30 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01B11/25 ,  G01B2210/44 ,  G01N21/9501 ,  H01L22/12

Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

Abstract translation: 公开了一种用于在晶片（4）的至少一个表面（3）上对锯痕（3）进行三维检查的装置（1）和方法。 需要至少一个照相机（6）来捕获晶片（4）的整个表面（3）的图像。 至少一个投影仪（8）提供以中心光束轴线（9）为中心的光束（5）。 线投影仪（8）被布置成使得中心束轴线（9）相对于晶片（4）的平面（P）处于锐角（a）。 线移动器（12）位于每个线投影仪（8）和晶片（4）的表面（3）之间的光束（5）中。 使用帧抓取器（14）和图像处理器（16）来同步和协调图像捕获以及在前侧（3F）和/或背面（3F）上的线（22）的图案（20）的位置 3B）。