公开(公告)号：MY185911A

公开(公告)日：2021-06-14

申请号：MYPI2020006001

申请日：2015-12-04

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

Abstract: An apparatus, a method and a computer (32) program product for defect (19) detection in work pieces (2) is disclosed. At least one light source (18) is provided and the light source (18) generates an illumination light (13) of a wavelength range at which the work piece (2) is transparent. A camera (6) images (10) the light from at least one face of the work piece (2) on a detector (26) of the camera (6) by means of a lens (7). A stage (38) is used for moving the work piece (2) and for imaging the at least one face of the semiconductor (2) device completely with the camera (6). The computer (32) program product is disposed on a non-transitory, computer (32) readable medium for defect (19) detection in work pieces. A computer (32) is used to execute the various process steps and to control (31) the various means of the apparatus. (Figure 10)

公开(公告)号：PH12021550169A1

公开(公告)日：2021-10-11

申请号：PH12021550169

申请日：2021-01-22

Applicant: KLA TENCOR CORP

Inventor： WOUTERS CHRISTOPHE ,  JORIS KRISTOF ,  DE GREEVE JOHAN

IPC: G01B11/24 ,  G01B11/02 ,  G02B7/02 ,  G02B21/00 ,  G02B27/00

Abstract: 3D measurements of features on a workpiece, such as ball height, co-planarity, component thickness, or warpage, are determined. The system includes a broadband light source, a microlens array, a tunable color filter, a lens system, and a detector. The microlens array can focus a light beam to a points in a focal plane of the microlens array. The tunable color filter can narrow the light beam to a band at a central wavelength. The lens system can provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system.

公开(公告)号：SG11201704388YA

公开(公告)日：2017-06-29

申请号：SG11201704388Y

申请日：2015-12-04

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

IPC: G01R31/01 ,  G01N21/88 ,  G01N21/95 ,  G01R31/26 ,  G01R31/28

Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：SG10202110739PA

公开(公告)日：2021-11-29

申请号：SG10202110739P

申请日：2015-12-04

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：SG10201913246TA

公开(公告)日：2020-02-27

申请号：SG10201913246T

申请日：2015-12-04

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：PH12020551338A1

公开(公告)日：2021-04-12

申请号：PH12020551338

申请日：2020-08-26

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

IPC: G01N21/88 ,  G01N21/95 ,  G01R31/01 ,  G01R31/26 ,  G01R31/28

Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：SG11202100316UA

公开(公告)日：2021-02-25

申请号：SG11202100316U

申请日：2019-07-23

Applicant: KLA TENCOR CORP

Inventor： WOUTERS CHRISTOPHE ,  JORIS KRISTOF ,  DE GREEVE JOHAN

IPC: G01B11/24 ,  G01B11/02 ,  G02B7/02 ,  G02B21/00 ,  G02B27/00

Abstract: 3D measurements of features on a workpiece, such as ball height, co-planarity, component thickness, or warpage, are determined. The system includes a broadband light source, a microlens array, a tunable color filter, a lens system, and a detector. The microlens array can focus a light beam to points in a focal plane of the microlens array. The tunable color filter can narrow the light beam to a band at a central wavelength. The lens system can provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system.

公开(公告)号：WO2012014092A3

公开(公告)日：2012-04-05

申请号：PCT/IB2011051572

申请日：2011-04-12

Applicant: KLA TENCOR CORP ,  MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

Inventor： MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

IPC: G01B11/30 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01B11/25 ,  G01B2210/44 ,  G01N21/9501 ,  H01L22/12

Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

Abstract translation: 公开了一种用于在晶片（4）的至少一个表面（3）上对锯痕（3）进行三维检查的装置（1）和方法。 需要至少一个照相机（6）来捕获晶片（4）的整个表面（3）的图像。 至少一个投影仪（8）提供以中心光束轴线（9）为中心的光束（5）。 线投影仪（8）被布置成使得中心束轴线（9）相对于晶片（4）的平面（P）处于锐角（a）。 线移动器（12）位于每个线投影仪（8）和晶片（4）的表面（3）之间的光束（5）中。 使用帧抓取器（14）和图像处理器（16）来同步和协调图像捕获以及在前侧（3F）和/或背面（3F）上的线（22）的图案（20）的位置 3B）。

公开(公告)号：PH12017501024A1

公开(公告)日：2018-03-05

申请号：PH12017501024

申请日：2017-06-02

Applicant: KLA TENCOR CORP

Inventor： MARIVOET TOM ,  TRUYENS CARL ,  WOUTERS CHRISTOPHE

IPC: G01N21/88 ,  G01N21/95 ,  G01R31/01 ,  G01R31/26 ,  G01R31/28

Abstract: An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

公开(公告)号：SG187136A1

公开(公告)日：2013-02-28

申请号：SG2013004254

申请日：2011-04-12

Applicant: KLA TENCOR CORP

Inventor： MAISON BENOIT ,  HILL ANDY ,  HERMANS LAURENT ,  NIJS FRANS ,  VAN GILS KAREL ,  WOUTERS CHRISTOPHE

Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).