METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT

    公开(公告)号:SG10201912769PA

    公开(公告)日:2020-02-27

    申请号:SG10201912769P

    申请日:2016-11-04

    Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

    APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS
    2.
    发明申请
    APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS 审中-公开
    WATER SAW MARKS三维检测装置及方法

    公开(公告)号:WO2012014092A3

    公开(公告)日:2012-04-05

    申请号:PCT/IB2011051572

    申请日:2011-04-12

    CPC classification number: G01B11/25 G01B2210/44 G01N21/9501 H01L22/12

    Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

    Abstract translation: 公开了一种用于在晶片(4)的至少一个表面(3)上对锯痕(3)进行三维检查的装置(1)和方法。 需要至少一个照相机(6)来捕获晶片(4)的整个表面(3)的图像。 至少一个投影仪(8)提供以中心光束轴线(9)为中心的光束(5)。 线投影仪(8)被布置成使得中心束轴线(9)相对于晶片(4)的平面(P)处于锐角(a)。 线移动器(12)位于每个线投影仪(8)和晶片(4)的表面(3)之间的光束(5)中。 使用帧抓取器(14)和图像处理器(16)来同步和协调图像捕获以及在前侧(3F)和/或背面(3F)上的线(22)的图案(20)的位置 3B)。

    RING LIGHT ILLUMINATOR AND BEAM SHAPER FOR RING LIGHT ILLUMINATOR
    3.
    发明申请
    RING LIGHT ILLUMINATOR AND BEAM SHAPER FOR RING LIGHT ILLUMINATOR 审中-公开
    环形光照明器和光束形状光圈照明器

    公开(公告)号:WO2011135534A3

    公开(公告)日:2012-01-19

    申请号:PCT/IB2011051867

    申请日:2011-04-28

    Inventor: HILL ANDY

    Abstract: A ring light illuminator with annularly arranged light sources is disclosed. To each light source there corresponds a beam shaper comprising a light collector, a homogenizing means for light from the light source, and an imaging means for imaging an output of the homogenizing means into an area to be illuminated. The homogenizing means in embodiments is a rod, into which light from the light collector is directed. The end of the rod opposite the light collector is imaged by the imaging means into the area to be illuminated.

    Abstract translation: 公开了一种具有环形布置的光源的环形照明器。 对于每个光源,对应于包括光收集器的光束整形器,用于来自光源的光的均匀化装置和用于将均匀化装置的输出成像到待照射区域的成像装置。 在实施例中的均质装置是一个杆,来自光收集器的光被引向该杆。 与光收集器相对的杆的端部通过成像装置成像到要照明的区域中。

    METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT

    公开(公告)号:SG11201805467TA

    公开(公告)日:2018-08-30

    申请号:SG11201805467T

    申请日:2016-11-04

    Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

    APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS

    公开(公告)号:SG187136A1

    公开(公告)日:2013-02-28

    申请号:SG2013004254

    申请日:2011-04-12

    Abstract: An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

    PROCEDIMIENTO Y SISTEMA PARA LA MEDICION OPTICA DE TOPOGRAFIA TRIDIMENSIONAL

    公开(公告)号:ES2908695T3

    公开(公告)日:2022-05-03

    申请号:ES16889639

    申请日:2016-11-04

    Abstract: Un procedimiento para la medición topográfica tridimensional óptica de una superficie (21) de un objeto (2), el procedimiento comprendiendo las etapas de: proyectar iluminación con patrón a través de un objetivo (5) sobre la superficie del objeto (21); realizar un movimiento relativo entre el objeto (2) y el objetivo (5), donde una dirección del movimiento relativo incluye un ángulo oblicuo (23) con un eje óptico (51) del objetivo, y donde la superficie pasa a través de un plano focal (52) del objetivo durante el movimiento relativo; y donde la superficie del objeto (21) define un plano de referencia que es paralelo al plano focal (52) del objetivo (5); registrar una pluralidad de imágenes de la superficie a través del objetivo (5) durante el movimiento relativo; derivar la información de altura para una posición respectiva sobre la superficie del objeto de la variación de la intensidad registrada desde la posición respectiva en la pluralidad de imágenes; donde la iluminación con patrón es generada por iluminación incoherente de una máscara de patrón (33), donde la máscara de patrón es una rejilla, donde la rejilla es una rejilla flameada; y donde, para la iluminación con patrón, se usan solamente un orden de difracción 0 y un orden difractado, que surge de la máscara del patrón, ambos órdenes de difracción teniendo la misma intensidad.

    METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT

    公开(公告)号:PH12018501598A1

    公开(公告)日:2019-04-08

    申请号:PH12018501598

    申请日:2018-07-26

    Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

    RING LIGHT ILLUMINATOR AND BEAM SHAPER FOR RING LIGHT ILLUMINATOR

    公开(公告)号:SG184961A1

    公开(公告)日:2012-11-29

    申请号:SG2012078028

    申请日:2011-04-28

    Inventor: HILL ANDY

    Abstract: A ring light illuminator with annularly arranged light sources is disclosed. To each light source there corresponds a beam shaper comprising a light collector, a homogenizing means for light from the light source, and an imaging means for imaging an output of the homogenizing means into an area to be illuminated. The homogenizing means in embodiments is a rod, into which light from the light collector is directed. The end of the rod opposite the light collector is imaged by the imaging means into the area to be illuminated.

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