보조 전자기장의 도입에 기초한 1차 스캐터로메트리 오버레이의 새로운 접근법

    公开(公告)号:KR20180039743A

    公开(公告)日:2018-04-18

    申请号:KR20187009582

    申请日:2016-08-18

    CPC classification number: G01B11/272 G01B9/0201 G01N21/4788 G03F7/70633

    Abstract: 메트롤로지측정방법및 툴이제공되며, 이는고정된조명원에의해고정된회절타겟을조명하고, 0차회절신호와 1차회절신호의합으로구성된신호를측정하고, 상기회절타겟과상기조명원을고정되게유지하면서상기 0차회절신호와상기 1차회절신호사이의복수의관계에대하여상기측정단계를반복하며, 측정된합으로부터상기 1차회절신호를유도한다. 조명은간섭성일수 있고, 측정은동공평면에있을수 있거나, 조명은비간섭성일수 있고, 측정은필드평면에있을수 있으며, 어느경우이든, 0차및 1차회절차수의부분중첩이측정된다. 조명은환형일수 있으며, 회절타겟은중첩영역을분리하기위해상이한피치를갖는주기적구조를갖는 1(one) 셀 SCOL 타겟일수 있다.

    OPTICAL NEAR-FIELD METROLOGY
    2.
    发明专利

    公开(公告)号:SG11201900996VA

    公开(公告)日:2019-04-29

    申请号:SG11201900996V

    申请日:2017-07-10

    Abstract: Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements. The optical microcavity probes detect features on a wafer by shifts in an interference signal between reference radiation and near-field interactions of radiation in the microcavities and wafer features, such as device features and metrology target features. Various illumination and detection configurations provide quick and sensitive signals which are used to enhance optical metrology measurements with respect to their accuracy and sensitivity. The optical microcavity probes may be scanned at a controlled height and position with respect to the wafer and provide information concerning the spatial relations between device and target features.

    OFF-AXIS ILLUMINATION OVERLAY MEASUREMENT USING TWO-DIFFRACTED ORDERS IMAGING

    公开(公告)号:SG11202100991PA

    公开(公告)日:2021-03-30

    申请号:SG11202100991P

    申请日:2018-12-14

    Abstract: Metrology methods and tools are provided, which enhance the accuracy of the measurements and enable simplification of the measurement process as well as improving the correspondence between the metrology targets and the semiconductor devices. Methods comprise illuminating the target in a Littrow configuration to yield a first measurement signal comprising a −1st diffraction order and a 0th diffraction order and a second measurement signal comprising a +1st distraction order and a 0th diffraction order, wherein the −1st diffraction order of the first measurement signal and the +1st diffraction order of the second measurement signal are diffracted at 180° to a direction of the illumination, performing a first measurement of the first measurement signal and a second measurement of the second measurement signal, and deriving metrology metric(s) therefrom. Optionally, a reflected 0th diffraction order may be split to yield components which interact with the −1st and +1st diffraction orders.

    DIFFRACTION BASED OVERLAY SCATTEROMETRY

    公开(公告)号:SG11202006133SA

    公开(公告)日:2020-07-29

    申请号:SG11202006133S

    申请日:2018-10-29

    Abstract: A method of monitoring overlay is used in a manufacturing process in which successive layers are deposited one over another to form a stack. Each layer may include a periodic structure such as a diffraction grating to be aligned with a periodic structure in another layer. The stacked periodic structures may be illuminated to form + and − first order diffraction patterns from the periodic structures. An image of the stacked periodic structures may be captured including + and − diffraction patterns. The + and − diffraction patterns may be compared to calculate the overlay between successive layers.

    SYSTEMS AND METHODS FOR METROLOGY WITH LAYER-SPECIFIC ILLUMINATION SPECTRA

    公开(公告)号:SG11201907747XA

    公开(公告)日:2019-10-30

    申请号:SG11201907747X

    申请日:2018-03-28

    Abstract: PUBLISHEDUNDER THE PATENT COOPERATION TREATY (PCT) IiiimmomiolollmonolomolmomEmmomoun () International Publication Number WO 2018/187108 Al WIPO I PCT (12) INTERNATIONAL APPLICATION (19) World Intellectual Property Organization International Bureau (43) International Publication Date 11 October 2018 (11.10.2018) (51) International Patent Classification: HO1L 21/66 (2006.01) (21) International Application Number: PCT/US2018/024702 (22) International Filing Date: 28 March 2018 (28.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/481,685 05 April 2017 (05.04.2017) US 15/608,766 30 May 2017 (30.05.2017) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: MANASSEN, Amnon; 10 Golda Meir Street, 34892 Haifa (IL). NEGRI, Dania; Ha'Alon Street 38/1, 36811 Nesher (IL). HILL, Andrew V.; 2112 Los Ange- les Avenue, Berkeley, California 94707 (US). BACHAR, Ohad; 29 He'elah Street, 36576 Timrat (IL). LEV- INSKI, Vladimir; Hermon 9, 23100 Migdal HaEmek (IL). PASKOVER, Yuri; 32A Seora Str, 30560 Binyamina (IL). (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, (54) Title: SYSTEMS AND METHODS FOR METROLOGY WITH LAYER-SPECIFIC ILLUMINATION SPECTRA 126 CONTROLLER 128 PROCESSORS 130 MEMORY 100 122 108 40111111111110- 104 —120 102 n 124 114 V 112 110 106 116 1-1 cc O N cc 00 O O FIG.1 (57) : A metrology system includes an image device and a controller. The image device includes a spectrally-tunable illumi- nation device and a detector to generate images of a sample having metrology target elements on two or more sample layers based on radiation emanating from the sample in response to illumination from the spectrally-tunable illumination device. The controller determines layer-specific imaging configurations of the imaging device to image the metrology target elements on the two or more sample layers within a selected image quality tolerance in which each layer-specific imaging configuration includes an illumination spectrum from the spectrally-tunable illumination device. The controller further receives one or more images of the metrology target elements on the two or more sample layers generated using the layer-specific imaging configurations. The controller further provides a metrology measurement based on the one or more images of the metrology target elements on the two or more sample layers. [Continued on next page] WO 2018/187108 Al MIDEDIMOMOIDEIREEMOMOHOMOIDIMMIOMMIS MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))

    LOCALIZED TELECENTRICITY AND FOCUS OPTIMIZATION FOR OVERLAY METROLOGY

    公开(公告)号:SG11202005972UA

    公开(公告)日:2020-11-27

    申请号:SG11202005972U

    申请日:2019-04-05

    Abstract: An overlay metrology tool providing site-by-site alignment includes a controller coupled to a telecentric imaging system. The controller may receive two or more alignment images of an overlay target on a sample captured at two or more focal positions by the imaging system, generate alignment data indicative of an alignment of the overlay target within the imaging system based on the alignment images, set the alignment images as measurement images when the alignment of the overlay target is within selected alignment tolerances, direct the imaging system to adjust the alignment of the overlay target in the imaging system and further receive one or more measurement images from the imaging system when the alignment of the overlay target is outside the selected alignment tolerances, and determine overlay between two or more layers of the sample based on at least one of the measurement images.

    TOPOGRAPHIC PHASE CONTROL FOR OVERLAY MEASUREMENT

    公开(公告)号:SG10201912818WA

    公开(公告)日:2020-02-27

    申请号:SG10201912818W

    申请日:2016-05-19

    Abstract: Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy. In imaging, overlay error magnification may be reduced by choosing appropriate measurement conditions based on analysis of contrast function behavior, changing illumination conditions (reducing spectrum width and illumination NA), using polarizing targets and/or optical systems, using multiple defocusing positions etc. On-the-fly calibration of measurement results may be carried out in imaging or scatterometry using additional measurements or additional target cells.

    TOPOGRAPHIC PHASE CONTROL FOR OVERLAY MEASUREMENT

    公开(公告)号:SG10201912822UA

    公开(公告)日:2020-02-27

    申请号:SG10201912822U

    申请日:2016-05-19

    Abstract: Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy. In imaging, overlay error magnification may be reduced by choosing appropriate measurement conditions based on analysis of contrast function behavior, changing illumination conditions (reducing spectrum width and illumination NA), using polarizing targets and/or optical systems, using multiple defocusing positions etc. On-the-fly calibration of measurement results may be carried out in imaging or scatterometry using additional measurements or additional target cells.

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