公开(公告)号：SG10201913238UA

公开(公告)日：2020-02-27

申请号：SG10201913238U

申请日：2016-07-01

Applicant: KLA TENCOR CORP

Inventor： WOLL DIRK

Abstract: A system includes a nonlinear crystal positioned such that a focus of a laser beam is outside the nonlinear crystal in at least one plane perpendicular to a beam propagation direction of the laser beam. The nonlinear crystal is disposed in a crystal mount assembly. A laser beam may be directed at the nonlinear crystal for wavelength conversion. The system may be used as a deep-UV wavelength converter.

公开(公告)号：SG11201900909XA

公开(公告)日：2019-02-27

申请号：SG11201900909X

申请日：2017-08-01

Applicant: KLA TENCOR CORP

Inventor： WOLL DIRK

IPC: H01L21/67 ,  H01L21/66

Abstract: A cartridge in an oven enclosure includes a pre-heating feature for an incoming purge gas before the purge gas enters the space around an optical component, such as a nonlinear optical crystal, in an oven cell. The incoming purge gas can be pre-heated as it travels along a gas pathway around a cartridge. The cartridge can include a heater. The oven enclosure can have two windows positioned such that a laser beam can enter through one of the windows, pass through the optical component, and exit through another of the windows. A second harmonic beam can be generated with the optical component.

公开(公告)号：EP2732272A4

公开(公告)日：2015-08-19

申请号：EP12811849

申请日：2012-07-10

Applicant: KLA TENCOR CORP

Inventor： ROMANOVSKY ANATOLY ,  MALEEV IVAN ,  KAVALDJIEV DANIEL ,  YUDITSKY YURY ,  WOLL DIRK ,  BIELLAK STEVEN

IPC: G01N21/88 ,  G01N21/47 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.