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    MULTI-SPOT ANALYSIS SYSTEM WITH MULTIPLE OPTICAL PROBES
    1.
    发明专利
    MULTI-SPOT ANALYSIS SYSTEM WITH MULTIPLE OPTICAL PROBES 未知

    公开(公告)号：SG11202010081VA

    公开(公告)日：2020-11-27

    申请号：SG11202010081V

    申请日：2019-04-12

    Applicant: KLA TENCOR CORP

    Inventor： DIGHE PRASANNA ,  MUELLER DIETER ,  CHEN DONG ,  CHEN DENGPENG ,  ZAMEK STEVE ,  KAVALDJIEV DANIEL ,  BUETTNER ALEXANDER

    IPC: G01N21/47 ,  G01N21/41

    Abstract: A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE
    3.
    发明申请
    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE 审中-公开
    用于测量基板的形状或厚度信息的方法和装置

    公开(公告)号：WO2010096387A3

    公开(公告)日：2010-11-18

    申请号：PCT/US2010024305

    申请日：2010-02-16

    Applicant: KLA TENCOR CORP ,  TANG SHOUHONG ,  KREN GEORGE ,  MUELLER DIETER ,  HAAS BRIAN ,  KAVALDJIEV DANIEL

    Inventor： TANG SHOUHONG ,  KREN GEORGE ,  MUELLER DIETER ,  HAAS BRIAN ,  KAVALDJIEV DANIEL

    IPC: H01L21/66 ,  G01B11/06

    CPC classification number: G01B9/02021 ,  G01B9/02027 ,  G01B9/02057 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/306

    Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

    Abstract translation: 干涉仪系统和方法可用于测量衬底厚度或形状。 该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光腔。 衬底保持器可以被配置为将衬底放置在空腔中，其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面，使得第一或第二衬底表面之间的空间距离相应的一个 参考表面或阻尼表面。 干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。 干涉仪可以分别通过经由干涉仪装置光耦合到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE
    5.
    发明公开
    METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE 审中-公开
    VERFAHREN UND VORRICHTUNG ZUR MESSUNG VON FORM- ODER DICKEDATEN EINES SUBSTRATS

    公开(公告)号：EP2399285A4

    公开(公告)日：2016-07-20

    申请号：EP10744192

    申请日：2010-02-16

    Applicant: KLA TENCOR CORP

    Inventor： TANG SHOUHONG ,  KREN GEORGE ,  MUELLER DIETER ,  HAAS BRIAN ,  KAVALDJIEV DANIEL

    IPC: H01L21/66 ,  G01B9/02 ,  G01B11/06 ,  G01B11/30

    CPC classification number: G01B9/02021 ,  G01B9/02027 ,  G01B9/02057 ,  G01B9/02072 ,  G01B9/0209 ,  G01B11/306

    Abstract: An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

    Abstract translation: 干涉仪系统和方法可用于测量基底厚度或形状。 该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光腔。 衬底保持器可以被配置为将衬底放置在空腔中，其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面，使得第一或第二衬底表面之间的空间距离相应的一个 参考表面或阻尼表面。 干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。 干涉仪可以分别通过经由干涉仪装置光耦合到空腔的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

    WAFER INSPECTION
    6.
    发明公开
    WAFER INSPECTION 审中-公开
    晶圆检查

    公开(公告)号：EP2732272A4

    公开(公告)日：2015-08-19

    申请号：EP12811849

    申请日：2012-07-10

    Applicant: KLA TENCOR CORP

    Inventor： ROMANOVSKY ANATOLY ,  MALEEV IVAN ,  KAVALDJIEV DANIEL ,  YUDITSKY YURY ,  WOLL DIRK ,  BIELLAK STEVEN

    IPC: G01N21/88 ,  G01N21/47 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.

    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    7.
    发明申请
    COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER 审中-公开
    用于检查和/或分类WAFER的计算机实现方法

    公开(公告)号：WO2010011578A3

    公开(公告)日：2010-04-22

    申请号：PCT/US2009051044

    申请日：2009-07-17

    Applicant: KLA TENCOR CORP ,  REICH JUERGEN ,  VINTRO LOUIS ,  DIGHE PRASANNA ,  STEINBACH ANDREW ,  KAVALDJIEV DANIEL ,  BIELLAK STEPHEN

    Inventor： REICH JUERGEN ,  VINTRO LOUIS ,  DIGHE PRASANNA ,  STEINBACH ANDREW ,  KAVALDJIEV DANIEL ,  BIELLAK STEPHEN

    IPC: H01L21/66

    CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.

    Abstract translation: 提供了用于检查和/或分类晶片的计算机实现的方法。 一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。 另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性的组合，以及使用输出确定的晶片的空间局部化特性 。

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