公开(公告)号：SG11201702721RA

公开(公告)日：2017-04-27

申请号：SG11201702721R

申请日：2015-10-02

Applicant: KLA TENCOR CORP

Inventor： VAZHAEPARAMBIL JIJEN ,  ZHAO GUOHENG ,  KAVALDJIEV DANIEL IVANOV ,  ROMANOVSKY ANATOLY ,  MALEEV IVAN ,  WOLTERS CHRISTIAN ,  KREN GEORGE ,  BIELLAK STEPHEN ,  WHITESIDE BRET ,  PETTIBONE DONALD

IPC: H01L21/66

Abstract: A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.

公开(公告)号：DE112015004550T5

公开(公告)日：2017-06-14

申请号：DE112015004550

申请日：2015-10-02

Applicant: KLA TENCOR CORP

Inventor： VAZHAEPARAMBIL JIJEN ,  ZHAO GUOHENG ,  KAVALDJIEV DANIEL IVANOV ,  ROMANOVSKY ANATOLY ,  WOLTERS CHRISTIAN ,  KREN GEORGE ,  BIELLAK STEPHEN ,  WHITESIDE BRET ,  PETTIBONE DONALD ,  MALEEV IVAN

IPC: H01L21/66

Abstract: Ein Wafer-Abtastsystem umfasst eine abbildende Sammeloptik, um die effektive Spotgröße zu reduzieren. Eine kleinere Spotgröße verringert die Anzahl der Photonen, die durch die Oberfläche proportional zur Fläche des Spots gestreut sind. Die Luftstreuung wird ebenfalls reduziert. TDI wird verwendet, um ein Waferbild zu erzeugen, das auf einer Vielzahl von Bildsignalen basiert, die über die Richtung der Linearbewegung des Wafers integriert sind. Ein Beleuchtungssystem überflutet den Wafer mit Licht, und die Aufgabe, den Spot zu erzeugen, wird der bildgebenden Sammeloptik zugeordnet.

公开(公告)号：EP2732272A4

公开(公告)日：2015-08-19

申请号：EP12811849

申请日：2012-07-10

Applicant: KLA TENCOR CORP

Inventor： ROMANOVSKY ANATOLY ,  MALEEV IVAN ,  KAVALDJIEV DANIEL ,  YUDITSKY YURY ,  WOLL DIRK ,  BIELLAK STEVEN

IPC: G01N21/88 ,  G01N21/47 ,  G01N21/95 ,  G01N21/956 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.