1.
    发明专利
    未知

    公开(公告)号:DE69535692D1

    公开(公告)日:2008-03-06

    申请号:DE69535692

    申请日:1995-07-11

    Abstract: A transmissive substrate (14) is illuminated by a laser (30) through an optical system comprised of a laser scanning system (40,42), individual transmitted and reflected light collection optics (84,35) and detectors (34,36) collect and generate signals representative of the light transmitted and reflected by the substrate (14) as the substrate is scanned repeatedly in one axis in a serpentine pattern by a laser beam (13) which is focused on the patterned substrate surface. The defect identification of the substrate is performed using only those transmitted and reflected light signals (15,17), and other signals derived from them, such as the second derivative of each of them. The actual defect identification is then performed by comparing combinations of at least two of those measured and derived signals.

    MULTIPLE BEAM INSPECTION APPARATUS AND METHOD
    2.
    发明申请
    MULTIPLE BEAM INSPECTION APPARATUS AND METHOD 审中-公开
    多波束检测装置和方法

    公开(公告)号:WO0214846A3

    公开(公告)日:2002-08-29

    申请号:PCT/US0124931

    申请日:2001-08-08

    CPC classification number: G01N21/956 G01N21/8806 G01N21/9501 G01N2021/95676

    Abstract: Disclosed is an optical inspection system for inspecting the surface of (11) a substrate (12). The optical inspection system includes a light source (52) for emitting an incident light beam (66) along an optical axis and a first set of optical elements arranged for separating the incident light beam into a plurality of light beams, directing the plurality of light beams to intersect with the surface of the substrate, and focusing the plurality of light beams to a plurality of scanning spots on the surface of the substrate. The inspection system further includes a light detector arrangement including in dividual light detectors (61A, 61B, 61C, 65A, 65B, 65C) that correspond to individual ones of a plurality of reflected or transmitted light beams caused by the intersection of the plurality of light beams with the surface of the substrate. The light detectors are arranged for sensing the light intensity of either the reflected or transmitted light.

    Abstract translation: 公开了一种用于检查(11)基板(12)的表面的光学检查系统。 该光学检查系统包括用于沿着光轴发射入射光束(66)的光源(52)以及被布置用于将入射光束分离成多个光束的第一组光学元件,将多个光 使光束与基板的表面相交,并且将多个光束聚焦到基板表面上的多个扫描点。 该检查系统还包括光检测器装置,该光检测器装置包括对应于由多个光的交叉引起的多个反射或透射光束中的各个光束的单独光检测器(61A,61B,61C,65A,65B,65C) 横梁与基底的表面。 光检测器被布置用于感测反射光或透射光的光强度。

    MULTIPLE BEAM INSPECTION APPARATUS AND METHOD
    3.
    发明申请
    MULTIPLE BEAM INSPECTION APPARATUS AND METHOD 审中-公开
    多光束检测装置及方法

    公开(公告)号:WO0214846A9

    公开(公告)日:2003-04-03

    申请号:PCT/US0124931

    申请日:2001-08-08

    CPC classification number: G01N21/956 G01N21/8806 G01N21/9501 G01N2021/95676

    Abstract: Disclosed is an optical inspection system for inspecting the surface of (11) a substrate (12). The optical inspection system includes a light source (52) for emitting an incident light beam (66) along an optical axis and a first set of optical elements arranged for separating the incident light beam into a plurality of light beams, directing the plurality of light beams to intersect with the surface of the substrate, and focusing the plurality of light beams to a plurality of scanning spots on the surface of the substrate. The inspection system further includes a light detector arrangement including in dividual light detectors (61A, 61B, 61C, 65A, 65B, 65C) that correspond to individual ones of a plurality of reflected or transmitted light beams caused by the intersection of the plurality of light beams with the surface of the substrate. The light detectors are arranged for sensing the light intensity of either the reflected or transmitted light.

    Abstract translation: 公开了一种用于检查(11)基板(12)的表面的光学检查系统。 光学检查系统包括用于沿着光轴发射入射光束(66)的光源(52)和布置成将入射光束分离成多个光束的第一组光学元件,引导多个光 光束与衬底的表面相交,并将多个光束聚焦到衬底表面上的多个扫描点。 检查系统还包括光检测器装置,其包括与由多个光的交点引起的多个反射或透射光束中的各个相对应的单独的光检测器(61A,61B,61C,65A,65B,65C) 梁与基板的表面。 光检测器被布置用于感测被反射或透射的光的光强度。

    4.
    发明专利
    未知

    公开(公告)号:DE69535692T2

    公开(公告)日:2009-01-22

    申请号:DE69535692

    申请日:1995-07-11

    Abstract: A transmissive substrate (14) is illuminated by a laser (30) through an optical system comprised of a laser scanning system (40,42), individual transmitted and reflected light collection optics (84,35) and detectors (34,36) collect and generate signals representative of the light transmitted and reflected by the substrate (14) as the substrate is scanned repeatedly in one axis in a serpentine pattern by a laser beam (13) which is focused on the patterned substrate surface. The defect identification of the substrate is performed using only those transmitted and reflected light signals (15,17), and other signals derived from them, such as the second derivative of each of them. The actual defect identification is then performed by comparing combinations of at least two of those measured and derived signals.

    APPARATUS FOR EUV IMAGING AND METHODS OF USING SAME

    公开(公告)号:EP2663897A4

    公开(公告)日:2018-01-03

    申请号:EP12734716

    申请日:2012-01-06

    CPC classification number: G03F1/84 B82Y10/00 B82Y40/00 G03F1/24

    Abstract: One embodiment relates to an apparatus that includes an illumination source (102) for illuminating a target substrate (106), objective optics (108) for projecting the EUV light which is reflected from the target substrate, and a sensor (110) for detecting the projected EUV light. The objective optics includes a first mirror (202,302, or 402) which is arranged to receive and reflect the EUV light which is reflected from the target substrate, a second mirror (204, 304, or 404) which is arranged to receive and reflect the EUV light which is reflected by the first mirror, a third mirror (206, 306, or 406) which is arranged to receive and reflect the EUV light which is reflected by the second mirror, and a fourth mirror (208, 308, or 408) which is arranged to receive and reflect the EUV light which is reflected by the third mirror.

    DEEP ULTRA-VIOLET LIGHT SOURCES FOR WAFER AND RETICLE INSPECTION SYSTEMS
    7.
    发明申请
    DEEP ULTRA-VIOLET LIGHT SOURCES FOR WAFER AND RETICLE INSPECTION SYSTEMS 审中-公开
    用于晶圆和检测系统的深紫外光源

    公开(公告)号:WO2012154468A3

    公开(公告)日:2012-12-27

    申请号:PCT/US2012036124

    申请日:2012-05-02

    Abstract: Disclosed are methods and apparatus for generating a sub-208 nm laser. A laser apparatus includes one or more seed radiation sources for generating a first radiation beam having a first fundamental wavelength on a first optical path and a second radiation beam having a second fundamental wavelength on a second optical path, a first amplifier for amplifying the first radiation beam, a second amplifier for amplifying the second radiation beam, and a wavelength conversion module comprising a plurality of crystals for frequency multiplying and mixing the amplified first and second radiation beams to produce an output beam at a fifth harmonic that is less than about 208 nm.

    Abstract translation: 公开了用于生成亚208nm激光器的方法和设备。 激光装置包括一个或多个种子辐射源,用于在第一光路上产生具有第一基本波长的第一辐射光束,以及在第二光路上产生具有第二基波波长的第二辐射光束,第一放大器,用于放大第一辐射 第二放大器,用于放大第二辐射束;以及波长转换模块,包括多个晶体,用于倍增和混合放大的第一和第二辐射束,以产生小于大约208nm的第五谐波的输出束 。

    APPARATUS FOR EUV IMAGING AND METHODS OF USING SAME
    8.
    发明申请
    APPARATUS FOR EUV IMAGING AND METHODS OF USING SAME 审中-公开
    EUV成像装置及其使用方法

    公开(公告)号:WO2012096847A3

    公开(公告)日:2012-11-01

    申请号:PCT/US2012020504

    申请日:2012-01-06

    CPC classification number: G03F1/84 B82Y10/00 B82Y40/00 G03F1/24

    Abstract: One embodiment relates to an apparatus that includes an illumination source (102) for illuminating a target substrate (106), objective optics (108) for projecting the EUV light which is reflected from the target substrate, and a sensor (110) for detecting the projected EUV light. The objective optics includes a first mirror (202,302, or 402) which is arranged to receive and reflect the EUV light which is reflected from the target substrate, a second mirror (204, 304, or 404) which is arranged to receive and reflect the EUV light which is reflected by the first mirror, a third mirror (206, 306, or 406) which is arranged to receive and reflect the EUV light which is reflected by the second mirror, and a fourth mirror (208, 308, or 408) which is arranged to receive and reflect the EUV light which is reflected by the third mirror.

    Abstract translation: 一个实施例涉及一种装置,其包括用于照射目标基板(106)的照明源(102),用于投射从目标基板反射的EUV光的物镜(108)和用于检测目标基板 预计EUV灯。 物镜包括第一反射镜(202,302或402),第一反射镜(202,302或402)被布置成接收和反射从目标基底反射的EUV光,第二反射镜(204,304或404),其布置成接收和反射 由第一反射镜反射的EUV光,被配置为接收和反射由第二反射镜反射的EUV光的第三反射镜(206,306或406)和第四反射镜(208,308或408) ),其被布置成接收和反射由第三反射镜反射的EUV光。

    DIFFERENTIAL DETECTOR COUPLED WITH DEFOCUS FOR IMPROVED PHASE DEFECT SENSITIVITY
    9.
    发明申请
    DIFFERENTIAL DETECTOR COUPLED WITH DEFOCUS FOR IMPROVED PHASE DEFECT SENSITIVITY 审中-公开
    与缺陷相关的差异检测器改善相位缺陷敏感度

    公开(公告)号:WO03058681A3

    公开(公告)日:2003-08-28

    申请号:PCT/US0241364

    申请日:2002-12-24

    CPC classification number: G01N21/95607 G01N2021/95676 G03F1/84

    Abstract: Provided are apparatus and methods for detecting phase defects. The invention relies generally on the distortion of light as it passes through defects in phase shift masks (310) to detect these defects. Light traveling through a defect, such as a bump in an etched area will travel at a different rate than light traveling through air. In order to enhance the signals generated from the defects, the invention in several embodiments provides a defocused light beam (302) by setting the focus of the beam to a level above or below the photomask subject to inspection. The light from the photomask is collected by a detector (314) that is split into at least two portions, each generating a signal. A resulting differential signal produced from the signals generated at each of two detector portions is used to determine whether a defect in the photomask is present, in one embodiment, by generating an image from the resulting signal.

    Abstract translation: 提供了用于检测相位缺陷的装置和方法。 本发明通常依赖于当光通过相移掩模(310)中的缺陷以检测这些缺陷时的光的失真。 穿过缺陷的光,例如蚀刻区域中的凸起,将以与通过空气传播的光不同的速度行进。 为了增强从缺陷产生的信号,本发明在几个实施例中通过将光束的焦点设置在待检查的光掩模上方或下方的水平来提供散焦光束(302)。 来自光掩模的光由检测器(314)收集,检测器(314)被分成至少两部分,每个产生一个信号。 在一个实施例中,由在两个检测器部分中的每一个产生的信号产生的所得到的差分信号用于确定光掩模中的缺陷是否通过从所得到的信号产生图像。

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