中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.03 seconds)

    APPARATUS AND METHOD FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY
    1.
    发明申请
    APPARATUS AND METHOD FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY 审中-公开
    用于使用散射检测来检测重叠错误的装置和方法

    公开(公告)号：WO2004076963A2

    公开(公告)日：2004-09-10

    申请号：PCT/US2004/005419

    申请日：2004-02-23

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  MIEHER, Walter, D. ,  LEVY, Ady ,  GOLOVANEVSKY, Boris ,  FRIEDMANN, Michael ,  SMITH, Ian ,  ADEL, Michael ,  FABRIKANT, Anatoly ,  BEVIS, Christopher, F. ,  FIELDEN, John ,  BAREKET, Noah ,  GROSS, Ken ,  ZALICKI, Piotr ,  WACK, Dan ,  DECECCO, Paola ,  DZIURA, Thaddeus, G. ,  GHINOVKER, Mark

    Inventor： MIEHER, Walter, D. ,  LEVY, Ady ,  GOLOVANEVSKY, Boris ,  FRIEDMANN, Michael ,  SMITH, Ian ,  ADEL, Michael ,  FABRIKANT, Anatoly ,  BEVIS, Christopher, F. ,  FIELDEN, John ,  BAREKET, Noah ,  GROSS, Ken ,  ZALICKI, Piotr ,  WACK, Dan ,  DECECCO, Paola ,  DZIURA, Thaddeus, G. ,  GHINOVKER, Mark

    IPC: G01B

    CPC classification number: G03F9/7088 ,  G01N21/956 ,  G01N2021/213 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70683 ,  G03F9/7049 ,  G03F9/7084

    Abstract: Disclosed is a method of determining an overlay error between two layers of a multiple layer sample. For a plurality of periodic targets that each have a first structure formed from a first layer and a second structure formed from a second layer of the sample, an optical system is employed to thereby measure an optical signal from each of the periodic targets. There are predefined offsets between the first and second structures. An overlay error is determined between the first and second structures by analyzing the measured optical signals from the periodic targets using a scatterometry overlay technique based on the predefined offsets. The optical system comprises any one or more of the following apparatus: an imaging reflectometer, an imaging spectroscopic reflectometer, a polarized spectroscopic imaging reflectometer, a scanning reflectometer system, a system with two or more reflectometers capable of parallel data acquisition, a system with two or more spectroscopic reflectometers capable of parallel data acquisition, a system with two or more polarized spectroscopic reflectometers capable of parallel data acquisition, a system with two or more polarized spectroscopic reflectometers capable of serial data acquisition without moving the wafer stage or moving any optical elements or the reflectometer stage, imaging spectrometers, imaging system with wavelength filter, imaging system with long-pass wavelength filter, imaging system with short-pass wavelength filter, imaging system without wavelength filter, interferometric imaging system, imaging ellipsometer, a spectroscopic ellipsometer, a laser ellipsometer having a photoelastic modulator, an imaging spectroscopic ellipsometer, a scanning ellipsometer system, a system with two or more ellipsometers capable of parallel data acquisition, a system with two or more ellipsometers capable of serial data acquisition without moving the wafer stage or moving any optical elements or the ellipsometer stage, a Michelson interferometer, and a Mach-Zehnder interferometer, a Sagnac interferometer, a scanning angle of incidence system, a scanning azimuth angle system, a +/- first order differential reflectometer, a +/- first order differential polarized reflectometer.

    Abstract translation: 公开了一种确定多层样本的两层之间的覆盖误差的方法。 对于每个具有由第一层形成的第一结构和由第二层样品形成的第二结构的多个周期性目标，采用光学系统，从而测量来自每个周期性目标的光信号。 在第一和第二结构之间有预定义的偏移。 通过使用基于预定偏移的散射测量覆盖技术来分析来自周期性目标的所测量的光信号，在第一和第二结构之间确定覆盖误差。 光学系统包括以下装置中的任何一个或多个：成像反射计，成像光谱反射计，偏振光谱成像反射计，扫描反射计系统，具有两个或更多个能够并行数据采集的反射计的系统，具有两个 具有能够并行数据采集的两个或更多个偏振分光反射计的系统，具有两个或更多个偏振光谱反射计的系统，其能够进行串行数据采集而不移动晶片台或移动任何光学元件或 反射计阶段，成像光谱仪，波长滤波器成像系统，长波长滤波器成像系统，短波长滤波器成像系统，无波长滤波器成像系统，干涉成像系统，成像椭偏仪，光谱椭偏仪，激光 椭偏仪具有 光弹性调制器，成像光谱椭偏仪，扫描椭偏仪系统，具有能够并行数据采集的两个或更多个椭偏仪的系统，具有两个或更多个椭圆计的系统，能够进行串行数据采集而不移动晶片台或移动任何光学元件或 椭圆偏振台，迈克尔逊干涉仪和马赫 - 策德尔干涉仪，Sagnac干涉仪，入射系统的扫描角度，扫描方位角系统，+/-一阶微分反射计，+/-一阶差分偏振反射计 。

    METHOD FOR GENERATING A DESIGN RULE MAP HAVING SPATIALLY VARYING OVERLAY BUDGET
    2.
    发明申请
    METHOD FOR GENERATING A DESIGN RULE MAP HAVING SPATIALLY VARYING OVERLAY BUDGET 审中-公开
    用于生成具有空间变化的覆盖预算的设计规则地图的方法

    公开(公告)号：WO2008036827A2

    公开(公告)日：2008-03-27

    申请号：PCT/US2007/079053

    申请日：2007-09-20

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  ADEL, Michael ,  CHANG, Ellis

    Inventor： ADEL, Michael ,  CHANG, Ellis

    IPC: G06F17/50

    CPC classification number: G03F7/70633 ,  G03F7/70533

    Abstract: The invention is a method for generating a design rule map having a spatially varying overlay error budget. Additionally, the spatially varying overlay error budget can be employed to determine if wafers are fabricated in compliance with specifications. In one approach a design data file that contains fabrication process information and reticle information is processed using design rules to obtain a design map with a spatially varying overlay error budget that defines a localized tolerance to overlay errors for different spatial locations on the design map. This spatially varying overlay error budget can be used to disposition wafers. For example, overlay information obtained from measured metrology targets on a fabricated wafer are compared with the spatially varying overlay error budget to determine if the wafer overlay satisfies the required specification.

    Abstract translation: 本发明是一种用于生成具有空间变化的重叠误差预算的设计规则图的方法。 此外，可以采用空间上可变的重叠误差预算来确定晶片是否符合规格制造。 在一种方法中，使用设计规则处理包含制造过程信息和掩模版信息的设计数据文件，以获得具有空间上变化的重叠误差预算的设计图，该设计图定义了设计图上不同空间位置的重叠误差的局部容差。 这种空间上可变的重叠误差预算可用于配置晶片。 例如，将从制造的晶片上的测量的测量目标获得的覆盖信息与空间上变化的重叠误差预算进行比较，以确定晶片覆盖是否满足要求的规范。

    APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY
    3.
    发明申请
    APPARATUS AND METHODS FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY 审中-公开
    用于使用散射检测来检测重叠错误的装置和方法

    公开(公告)号：WO2004053426A1

    公开(公告)日：2004-06-24

    申请号：PCT/US2003/038784

    申请日：2003-12-05

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

    Inventor： MIEHER, Walter, D. ,  LEVY, Ady ,  GOLOVANEVSKY, Boris ,  FRIEDMANN, Michael ,  SMITH, Ian ,  ADEL, Michael ,  FABRIKANT, Anatoly ,  BEVIS, Christopher, F. ,  FIELDEN, John ,  BAREKET, Noah ,  GROSS, Ken ,  ZALICKI, Piotr ,  WACK, Dan ,  DECECCO, Paola ,  DZIURA, Thaddeus, G.

    IPC: G01B11/00

    CPC classification number: G03F9/7088 ,  G03F7/70633 ,  G03F9/7049 ,  G03F9/7084

    Abstract: Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. In one embodiment, a method for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample is disclosed. Targets A, B, C and D that each include a portion of the first and second structures are provided. Target A is designed to have an offset Xa between its first and second structures portions; target B is designed to have an offset Xb between its first and second structures portions; target C is designed to have an offset Xc between its first and second structures portions; and target D is designed to have an offset Xd between its first and second structures portions. Each of the offsets Xa, Xb, Xc and Xd is preferably different from zero; Xa is an opposite sign and differ from Xb; and Xc is an opposite sign and differs from Xd. The targets A, B, C and D are illuminated with electromagnetic radiation to obtain spectra S A , S B , S C , and S D from targets A, B, C, and D, respectively. Any overlay error between the first structures and the second structures is then determined using a linear approximation based on the obtained spectra S A , S B , S C , and S D .

    Abstract translation: 公开了用于确定样品的两层之间的重叠误差的技术，装置和目标。 在一个实施例中，公开了一种用于确定样品的第一层中的多个第一结构与样品的第二层中的多个第二结构之间的叠层的方法。 提供了各自包括第一和第二结构的一部分的目标A，B，C和D。 目标A设计成在其第一和第二结构部分之间具有偏移Xa; 目标B设计成在其第一和第二结构部分之间具有偏移Xb; 目标C被设计成在其第一和第二结构部分之间具有偏移Xc; 并且目标D被设计成在其第一和第二结构部分之间具有偏移Xd。 偏移量Xa，Xb，Xc和Xd中的每一个优选地不同于零; Xa是相反的符号，不同于Xb; Xc是相反的符号，与Xd不同。 目标A，B，C和D用电磁辐射照射，分别从目标A，B，C和D获得光谱SA，SB，SC和SD。 然后使用基于获得的光谱SA，SB，SC和SD的线性近似来确定第一结构和第二结构之间的任何覆盖误差。

    OVERLAY METROLOGY USING THE NEAR INFRA-RED SPECTRAL RANGE
    4.
    发明申请
    OVERLAY METROLOGY USING THE NEAR INFRA-RED SPECTRAL RANGE 审中-公开
    使用近红外光谱范围的覆盖度量

    公开(公告)号：WO2007061704A2

    公开(公告)日：2007-05-31

    申请号：PCT/US2006/044259

    申请日：2006-11-13

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  ADEL, Michael ,  FROMMER, Aviv

    Inventor： ADEL, Michael ,  FROMMER, Aviv

    IPC: G01B11/24

    CPC classification number: G01N21/956 ,  G01N2021/213 ,  G03F7/70633

    Abstract: A method and tool for conducting NIR overlay metrology is disclosed. Such methods involve generating a filtered illumination beam including NIR radiation and directing that illumination beam onto an overlay target to produce an optical signal that is detected and used to generate overlay metrology measurements. The method is particularly suited to substrate applications having layers of opaque material that are transmissive in the NIR range (e.g., amorphous carbon) and where NTR imaging is used to obtain overlay measurements. A tool implementation includes a means for generating a filtered illumination beam extending into the NIR range and a detector for receiving NIR signal from an NIR illuminated target and a computer for processing the signal data to obtain overlay metrology measurements.

    Abstract translation: 公开了一种用于进行NIR重叠测量的方法和工具。 这种方法涉及产生包括NIR辐射的滤波照明光束并将该照明光束引导到覆盖目标上以产生被检测并用于产生覆盖度量测量的光信号。 该方法特别适用于具有在NIR范围（例如无定形碳）中透射的不透明材料层的衬底应用，并且其中使用NTR成像来获得覆盖测量。 工具实现包括用于产生延伸到NIR范围内的滤波照明光束的装置和用于从NIR照明目标接收NIR信号的检测器和用于处理信号数据以获得覆盖度量测量的计算机。

Patent Agency Ranking