公开(公告)号：EP0183060A3

公开(公告)日：1988-10-19

申请号：EP85113563

申请日：1985-10-25

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Frisch, David C. ,  Weber, Wilhelm

IPC: C23C18/16

CPC classification number: C23C18/1608 ,  B29C2035/0855 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/206 ,  C23C18/208 ,  C23C18/24 ,  C23C18/36 ,  C23C18/405 ,  C23C18/44 ,  H05K3/182 ,  H05K3/185

Abstract: Catalytically imaged thermosetting and thermoplastic resin objects inclusing printed circuit boards are provided. An adhesion promoted and thus hydrophilic insulating base material is treated in selected areas to produce metallic nuclei catalytic to electroless metal deposition in the form of an image of a desired metal pattern. The image is exposed to an electroless metal plating bath to reinforce the image. Then, the non-imaged areas of the base material are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably the solvent treatment of the non-imaged areas of the base material is repeated.

公开(公告)号：EP0180220A3

公开(公告)日：1988-01-27

申请号：EP85113861

申请日：1985-10-31

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Frisch, David C. ,  Weber, Wilhelm

IPC: B32B31/26 ,  B32B15/08 ,  H05K03/02 ,  H05K03/00

CPC classification number: B32B15/08 ,  B32B37/18 ,  B32B38/0036 ,  B32B2309/02 ,  B32B2457/08 ,  H05K3/0011 ,  H05K3/022 ,  H05K3/108 ,  H05K3/22 ,  H05K3/38 ,  H05K3/427 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0783 ,  H05K2203/1105

Abstract: A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuit boards from such metal clad thermoplastic polymeric base materials are claimed. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base materials, under pressure, at a temperature from about 2 °C to about 45 °C above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials suchs as moisture or solvents when laminated.

公开(公告)号：EP0192233A3

公开(公告)日：1988-11-02

申请号：EP86102055

申请日：1986-02-18

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： Cleveland, Eric J. ,  Frisch, David C. ,  Weber, Wilhelm

IPC: C23C18/16

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/208 ,  C23C18/24 ,  C23C18/30 ,  C23C18/38 ,  H05K1/0284 ,  H05K1/0373 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1476

Abstract: Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is adhesion promotable by an adhesion promotion process and is catalytic for adherent metallization, or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is resistant to the adhesion promotion process employed for the first material, or is non-catalytic for, and incapable of being rendered catalytic for, adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, for example, by electroless deposition to form the metallized one-piece article.